Abstract:
A low-wear fluoropolymer composite body comprises at least one fluoropolymer and additive particles dispersed therein. Also provided is a process for the fabrication of such a fluoropolymer composite body. The composite body exhibits a low wear rate for sliding motion against a hard counterface, and may be formulated with either melt-processible or non-melt-processible fluoropolymers.
Abstract:
A method for preparing an insulating varnish. The method includes: providing equivalence of an epoxy resin solution having a concentration exceeding 99 wt. % and acetone solution having a concentration of 40 wt. %, adding silane coupling agent-modified hexagonal boron nitride (BN) having a particle size of between 200 and 250 nm to the acetone solution and stirring; mixing the epoxy resin solution and the acetone solution and stirring, and dispersing the resulting mixture; adding to the mixture, low molecular weight polyamide resins as a curing agent, and stirring to uniformly disperse the curing agent; adding n-butane as a lubricant to the mixture and stirring, cooling the mixture to room temperature, adding di-n-butyl phthalate as a diluent to the mixture and stirring; and allowing the mixture to stand in a vacuum drier to remove bubbles to yield the insulating varnish, which is free of bubbles.
Abstract:
A formed article is made from a resin composition containing a thermoplastic resin, first inorganic particles having a mean volume diameter of primary-particle of 10 nm to 100 nm, both inclusive, and second inorganic particles having a mean volume diameter of primary-particle of 120 nm to 10000 nm, both inclusive. One hundred (100) parts by mass of the resin composition contains 9.0 to 40.5 parts by mass of the first inorganic particles and 4.5 to 36.0 parts by mass of the second inorganic particles.
Abstract:
Provided are: a polycarbonate-based resin composition, including: (A) 100 parts by mass of a resin mixture formed of: 30 to 100 mass % of a PC-POS copolymer (A-1) which has constituent units represented by a general formula (I) and a general formula (II), and in which an average repetition number n of organosiloxane constituent units in the general formula (II) is 70 to 500; and 70 to 0 mass % of an aromatic polycarbonate resin (A-2) except the PC-POS copolymer (A-1); (B) 0.01 to 0.15 part by mass of an alkaline (earth) metal salt of an organic sulfonic acid; (C) 0.1 to 1 part by mass of a polytetrafluoroethylene having a fibril-forming ability; and (D) 2 to 15 parts by mass of titanium dioxide particles each having, on an outermost surface thereof, a coating layer formed of a polyol free of a nitrogen atom; a molded article obtained by molding the resin composition; and a structure member for solar photovoltaic power generation formed of the molded article. The polycarbonate-based resin composition, molded article, and structure member for solar photovoltaic power generation each have excellent flame retardancy and excellent tracking resistance without impairing a low-temperature impact characteristic which a PC-POS copolymer has.
Abstract:
A composition for allowing marking of a product, the composition comprising: (a) a volatile solvent; (b) a silicone resin comprising a trifunctional unit of formula (R)SiO3/2, wherein R is chosen, independently by trifunctional unit, from hydrocarbyl groups and hydroxyl groups, on the condition that at least one R is a hydrocarbyl group; and, (c) titanium dioxide particles having an average size of between approximately 100 nanometers and 1000 nanometers.
Abstract:
The present application is directed to a method of making an article. The method comprises coating a composition to a surface of a substrate. The coating composition comprises an aqueous continuous liquid phase, a silica nano-particle dispersed in the aqueous continuous liquid phase, and a polymer latex dispersion. The coated substrate is then heated to at least 300° C.
Abstract:
Disclosed are the nanoparticle and the method for the same, and the preparing method includes steps of mixing polyethylenimine (PEI) with the poly(acrylic acid)-bound iron oxide (PAAIO) to form a PEI-PAAIO polyelectrolyte complex (PEC) and mixing the PEI-PAAIO PEC with genetic material such as plasmid DNA to form the PEI-PAAIO/pDNA magnetic nanoparticle. The PEI-PAAIO/pDNA magnetoplex is highly water dispersible and suitable for long term storage, shows superparamagnetism, low cytotoxicity, high stability and nice transfection efficiency, and thus the PEI-PAAIO PEC can replace PEI as a non-viral gene vector.
Abstract:
The present disclosure provides a plurality of glass bubbles having an average true density of up to about 0.55 grams per cubic centimeter and a size distribution including a median size in a range from about 15 micrometers to 40 micrometers. A hydrostatic pressure at which ten percent by volume of the plurality of glass bubbles collapses is at least about 100 megapascals. In some embodiments, the plurality of glass bubbles is a graded fraction preparable by classifying a second plurality of glass bubbles, wherein the second plurality of glass bubbles has a higher percentage of glass bubbles with a size of up to ten micrometers than the first plurality of glass bubbles. Composites including the plurality of glass bubbles are also disclosed.
Abstract:
Disclosed are the nanoparticle and the method for the same, and the preparing method includes steps of mixing polyethylenimine (PEI) with the poly(acrylic acid)-bound iron oxide (PAAIO) to form a PEI-PAAIO polyelectrolyte complex (PEC) and mixing the PEI-PAAIO PEC with genetic material such as plasmid DNA to form the PEI-PAAIO/pDNA magnetic nanoparticle. The PEI-PAAIO/pDNA magnetoplex is highly water dispersible and suitable for long term storage, shows superparamagnetism, low cytotoxicity, high stability and nice transfection efficiency, and thus the PEI-PAAIO PEC can replace PEI as a non-viral gene vector.
Abstract:
The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on the back surface of a semiconductor element to be flip chip-connected onto an adherend, the film containing a resin and a thermoconductive filler, in which the content of the thermoconductive filler is at least 50% by volume of the film, and the thermoconductive filler has an average particle size relative to the thickness of the film of at most 30% and has a maximum particle size relative to the thickness of the film of at most 80%.