公开(公告)号：US07436272B2

公开(公告)日：2008-10-14

申请号：US11641890

申请日：2006-12-20

Applicant: Hidetoshi Fujii ,  Masaki Takeuchi

Inventor： Hidetoshi Fujii ,  Masaki Takeuchi

IPC: H03H9/00

CPC classification number: H03H9/105 ,  B81B2201/0271 ,  H03H3/02 ,  H03H9/02086 ,  H03H9/173

Abstract: A pizoelectric filter capable of improving the shielding property and increasing the heat releasing property is provided. The piezoelectric device includes a cover and piezoelectric device chips which are stacked and sealed together. The piezoelectric device also includes first external electrodes exposed at an upper surface of the cover and a grounded second external electrode exposed at the upper surface and a side surface of the cover. Electroconductive bonding materials are disposed between the cover and the piezoelectric device chips and all around an outer edge which connects the cover to the piezoelectric device chips so as to form a seal. The electroconductive bonding materials are also connected to the grounded second external electrode.

Abstract translation: 提供了能够提高屏蔽性和提高散热性能的真空电容滤波器。 压电装置包括层叠并密封在一起的盖和压电装置芯片。 压电装置还包括在盖的上表面处暴露的第一外部电极和暴露在盖的上表面和侧表面处的接地的第二外部电极。 导电接合材料设置在盖和压电元件芯片之间，并且全部围绕将盖与压电元件芯片连接以形成密封件的外边缘。 导电接合材料也连接到接地的第二外部电极。

公开(公告)号：US20080224319A1

公开(公告)日：2008-09-18

申请号：US11976678

申请日：2007-10-26

Applicant: Makiko Nakamura

Inventor： Makiko Nakamura

IPC: H01L23/48 ,  H01L21/02 ,  H01L21/44

CPC classification number: B81C1/00944 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C2201/112 ,  H01L28/40 ,  H03H3/0077 ,  H03H9/2457 ,  H03H2009/02496

Abstract: A micro electro-mechanical system, which can be stably formed so as to prevent sticking of a movable part and which has a narrow gap, and a method of manufacturing the same are provided. The micro electro-mechanical system includes at least one fixed electrode formed above a principal surface of a semiconductor substrate and at least one movable electrode formed on the principal surface. The at least one movable electrode includes the movable part separated from the principal surface and the at least one fixed electrode. The movable part is movable with respect to the principal surface and the at least one fixed electrode. The method of manufacturing the micro electromechanical system includes a sacrifical film formation step for forming a sacrifical film above the principal surface, an electrode layer formation step for forming an electrode layer above the principal surface so as to cover over the sacrifical film, an etching step for partially etching the electrode layer via a pattern so as to form the at least one electrode and the at least one fixed electrode, a sacrifical film removal step for removing the sacrifical film, and a conducting film formation step for forming a conducting film on surfaces of the at least one electrode and the at least one fixed electrode.

Abstract translation: 提供一种可以稳定地形成以防止可动部分的粘附并且具有窄间隙的微机电系统及其制造方法。 微电子机械系统包括形成在半导体衬底的主表面上的至少一个固定电极和形成在主表面上的至少一个可移动电极。 所述至少一个可移动电极包括从所述主表面和所述至少一个固定电极分离的可移动部件。 可移动部分可相对于主表面和至少一个固定电极移动。 微机电系统的制造方法包括在主表面上形成牺牲膜的牺牲膜形成工序，在主表面上形成电极层以覆盖牺牲膜的电极层形成工序，蚀刻工序 用于通过图案部分地蚀刻电极层，以形成至少一个电极和至少一个固定电极，用于去除牺牲膜的牺牲膜去除步骤，以及用于在表面上形成导电膜的导电膜形成步骤 的至少一个电极和至少一个固定电极。

公开(公告)号：US20080211042A1

公开(公告)日：2008-09-04

申请号：US12038908

申请日：2008-02-28

Applicant: Teruo TAKIZAWA

Inventor： Teruo TAKIZAWA

IPC: H01L21/02 ,  H01L29/84

CPC classification number: B81C1/00476 ,  B81B2201/0271

Abstract: To provide a method for manufacturing a semiconductor device and a semiconductor device manufactured by the method. In the method, a movable portion formed on a semiconductor substrate can be released by etching an insulation layer in a shorter time and more readily controlling the etching amount in a section direction of the insulation layer.A method for manufacturing a semiconductor device 10 includes: a step of forming a structure 30 on an insulation layer 14 formed on a semiconductor substrate 14, the structure including a piezoelectric layer 22, a first electrode 20, and a second electrode 24; a step of exposing a section of the insulation layer 14 by dicing the semiconductor device 10; and a step of removing the insulation layer 14 from the exposed section so as to release a movable portion 30b of the structure 30 while a fixing portion 30a of the structure 30 is fixed on the insulation layer 14.

Abstract translation: 提供一种通过该方法制造的半导体器件和半导体器件的制造方法。 在该方法中，可以通过在较短时间内蚀刻绝缘层并且更容易地控制绝缘层的截面方向上的蚀刻量来释放形成在半导体衬底上的可移动部分。 半导体装置10的制造方法包括：在形成于半导体基板14上的绝缘层14上形成结构体30的工序，该结构体包括压电层22，第一电极20和第二电极24; 通过切割半导体器件10来暴露绝缘层14的一部分的步骤; 以及将绝缘层14从暴露部分去除以便将结构30的固定部分30a固定在绝缘层14上的同时释放结构30的可移动部分30b的步骤。

公开(公告)号：US07362197B2

公开(公告)日：2008-04-22

申请号：US11725878

申请日：2007-03-20

Applicant: Markus Lutz ,  Aaron Partridge

Inventor： Markus Lutz ,  Aaron Partridge

IPC: H03H9/46 ,  H03H9/52

CPC classification number: H03H9/02448 ,  B81B3/0072 ,  B81B2201/0271 ,  B81B2203/0118 ,  H03H9/02259 ,  H03H9/02338 ,  H03H9/02417 ,  H03H9/2457 ,  H03H9/2463 ,  H03H2009/02496 ,  H03H2009/02511

Abstract: Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.

Abstract translation: 通过施加补偿刚度或压缩/拉伸应变，微机械谐振器中的热诱导频率变化被主动地或被动地减轻。 可以根据其热膨胀系数选择各种组合物材料，并用于在基底上形成共振器部件。 当暴露于温度变化时，这些组合物材料的相对膨胀产生补偿刚度或压缩/拉伸应变。

公开(公告)号：US07358579B2

公开(公告)日：2008-04-15

申请号：US10185283

申请日：2002-06-28

Applicant: Qing Ma ,  Tsung-Kuan Allen Chou ,  Valluri Rao

Inventor： Qing Ma ,  Tsung-Kuan Allen Chou ,  Valluri Rao

IPC: H01L21/00 ,  H01L29/82

CPC classification number: H01H59/0009 ,  B81B3/007 ,  B81B2201/014 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81B2203/04 ,  B81C2201/056 ,  H01H1/20 ,  H01H2001/0084 ,  H01H2059/0036 ,  H01H2059/0063

Abstract: A microelectromechanical system switch may include a relatively stiff cantilevered beam coupled, on its free end, to a more compliant or flexible extension. A contact may be positioned at the free end of the cantilevered beam. The extension reduces the actuation voltage that is needed and compensates for the relative stiffness of the cantilevered beam in closing the switch. In opening the switch, the stiffness of the cantilevered beam may advantageously enable quicker operation which may be desirable in higher frequency situations.

Abstract translation: 微机电系统开关可以包括在其自由端上耦合到更顺从或柔性延伸部的相对刚性的悬臂梁。 触点可以位于悬臂梁的自由端。 该延伸部分减小了所需的致动电压，并补偿了关闭开关时悬臂梁的相对刚度。 在打开开关时，悬臂梁的刚度可以有利地实现更快的操作，这在更高的频率情况下是可取的。

公开(公告)号：US20080038916A1

公开(公告)日：2008-02-14

申请号：US11779794

申请日：2007-07-18

Applicant: Xavier Rottenberg ,  Phillip Ekkels ,  Hendrikus Tilmans ,  Walter De Raedt

Inventor： Xavier Rottenberg ,  Phillip Ekkels ,  Hendrikus Tilmans ,  Walter De Raedt

IPC: H01L21/4763 ,  H01L21/311

CPC classification number: B81C1/00611 ,  B81B2201/0271 ,  B81C2201/0123

Abstract: A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in between the plurality of structures. The method further comprises providing a fill layer of electromagnetic radiation curable material substantially filling the space between the structures. The method further comprises illuminating a portion of the fill layer with electromagnetic radiation, hereby producing a exposed portion and an unexposed portion, the portions being separated by an interface substantially parallel with the first main surface of the substrate. The method further comprises removing the portion above the interface.

Abstract translation: 公开了一种制造平面结构的方法。 该方法包括在基板上制造具有大致相同高度的多个结构，并且在多个结构之间存在空间。 该方法还包括提供基本上填充结构之间的空间的电磁辐射可固化材料的填充层。 该方法还包括用电磁辐射照射填充层的一部分，从而产生暴露部分和未曝光部分，该部分被基本平行于基底的第一主表面的界面分开。 该方法还包括去除界面上方的部分。

公开(公告)号：US20080017974A1

公开(公告)日：2008-01-24

申请号：US11864448

申请日：2007-09-28

Applicant: MARTIN FRANOSCH ,  Andreas Meckes ,  Winfried Nessler ,  Klaus-Gunter Oppermann

Inventor： MARTIN FRANOSCH ,  Andreas Meckes ,  Winfried Nessler ,  Klaus-Gunter Oppermann

IPC: H01L23/12

CPC classification number: B81C1/00293 ,  B41J2/1603 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2/1639 ,  B41J2/1645 ,  B81B2201/0271 ,  B81C2203/0136 ,  B81C2203/0145 ,  Y10S438/977

Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.

Abstract translation: 用于容纳微机械结构的装置，以及用于制造外壳的方法。 该装置具有基板，其上形成有微机械结构的主侧面，围绕微机械结构的光致抗蚀剂材料结构，与基板和光刻胶材料结构之间的基板一起形成空腔，其中空腔分离 微机械结构和光致抗蚀剂材料结构并具有开口，以及用于封闭开口以封闭空腔的封闭件。

公开(公告)号：US07300814B2

公开(公告)日：2007-11-27

申请号：US11014415

申请日：2004-12-16

Applicant: Brian T. Cunningham ,  Marc S. Weinberg

Inventor： Brian T. Cunningham ,  Marc S. Weinberg

IPC: H01L21/00

CPC classification number: B81C3/008 ,  B81B2201/0271 ,  B81C2203/031 ,  G01C19/5719 ,  G01P15/0802 ,  G01P15/097

Abstract: A method of fabricating micro-mechanical devices. A mesa is etched in a homogeneous wafer. The wafer is bonded to a patterned substrate with the mesa defining device elements suspended above the substrate. A portion of the wafer is removed until a desired device thickness is achieved. Discrete elements of the device are then formed by performing a structural etch on the remaining wafer material.

Abstract translation: 一种制造微机械装置的方法。 在均匀晶片中蚀刻台面。 晶片被结合到图案化衬底，其中台面限定器件元件悬置在衬底上。 去除晶片的一部分直到实现所需的器件厚度。 然后通过对剩余的晶片材料进行结构蚀刻来形成器件的离散元件。

公开(公告)号：US20070115079A1

公开(公告)日：2007-05-24

申请号：US11655129

申请日：2007-01-19

Applicant: Ryuichi Kubo ,  Takahiro Oguchi ,  Hajime Yamada

Inventor： Ryuichi Kubo ,  Takahiro Oguchi ,  Hajime Yamada

IPC: H03H9/58

CPC classification number: H03H9/587 ,  B81B2201/0271 ,  B81C1/00238 ,  H03H9/105 ,  H03H9/1092 ,  H03H9/564

Abstract: A piezoelectric filter that includes a first substrate having at least one first piezoelectric resonator disposed on a main surface thereof; a second substrate having at least one second piezoelectric resonator disposed on a main surface thereof. A connection pattern extends around the first piezoelectric resonator and the second piezoelectric resonator and is disposed between the first substrate and the second substrate such that the main surface of the first substrate faces the main surface of the second substrate, and the first piezoelectric resonator is remote from the second piezoelectric resonator. A connecting layer bonds a pad disposed on the main surface of the first substrate to a pad disposed on the main surface of the second substrate, and is electrically connected to the first piezoelectric resonator and the second piezoelectric resonator.

Abstract translation: 一种压电滤波器，包括：第一基板，具有设置在其主表面上的至少一个第一压电谐振器; 第二基板，其具有设置在其主表面上的至少一个第二压电谐振器。 连接图案围绕第一压电谐振器和第二压电谐振器延伸并且设置在第一基板和第二基板之间，使得第一基板的主表面面向第二基板的主表面，并且第一压电谐振器是远程的 从第二压电谐振器。 连接层将设置在第一基板的主表面上的焊盘与设置在第二基板的主表面上的焊盘接合，并且电连接到第一压电谐振器和第二压电谐振器。

公开(公告)号：US20070111363A1

公开(公告)日：2007-05-17

申请号：US11539182

申请日：2006-10-06

Applicant: Eskild Westby

Inventor： Eskild Westby

IPC: H01L21/00

CPC classification number: B81B3/0067 ,  B81B2201/0271 ,  B81B2203/0109 ,  G01C19/5712

Abstract: A resonant structure for a micromechanical device includes a beam and at least one mass attached to the beam. The resonant structure is arranged to have a predominantly rotational excitation mode and an excitation plane in which motion of the excited resonant structure predominantly takes place, the at least one mass including a geometry such that none of the principal axes of the rotational inertia tensor of the resonant structure are normal to the excitation plane.

Abstract translation: 用于微机械装置的谐振结构包括梁和附接到梁的至少一个质量块。 谐振结构被布置为具有主要旋转的激励模式和激励平面，其中主要发生激发的谐振结构的运动，所述至少一个质量包括几何形状，使得不存在所述旋转惯性张量的主轴 谐振结构与激励平面正交。