公开(公告)号：US10074491B2

公开(公告)日：2018-09-11

申请号：US15512285

申请日：2015-07-10

Applicant: Sony Corporation

Inventor： Shinya Morita

IPC: H01H1/00

CPC classification number: H01H1/0036 ,  B81B2201/033 ,  B81B2203/0136 ,  B81B2203/051 ,  H01H59/0009 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0078

Abstract: [Object] To be capable of promptly performing a switching operation of a switch.[Solving Means] In a switching apparatus according to an embodiment of the present technology, a movable electrode includes a first movable electrode piece, a second movable electrode piece, and a movable contact point. A first fixed electrode includes first and second fixed electrode pieces, the first and second fixed electrode pieces facing each other with the first movable electrode piece disposed between the first and second fixed electrode pieces, the first fixed electrode piece facing the first movable electrode piece with a gap narrower than a gap between the second fixed electrode piece and the first movable electrode piece. A second fixed electrode includes third and fourth fixed electrode pieces, the third and fourth fixed electrode pieces facing each other with the second movable electrode piece disposed between the third and fourth fixed electrode pieces, the third fixed electrode piece facing the second movable electrode piece with a gap narrower than a gap between the fourth fixed electrode piece and the second movable electrode piece. A first fixed contact point is in contact with the movable contact point, the movable contact point moving in a first direction by an electrostatic attractive force between the movable electrode and the first fixed electrode. A second fixed contact point is in contact with the movable contact point, the movable contact point moving in a second direction opposite to the first direction by an electrostatic attractive force between the movable electrode and the second fixed electrode.

公开(公告)号：US20180129016A1

公开(公告)日：2018-05-10

申请号：US15803056

申请日：2017-11-03

Applicant: Robert Bosch GmbH

Inventor： Alexander Buhmann

IPC: G02B7/198 ,  B81B3/00 ,  G02B26/08

CPC classification number: G02B7/198 ,  B81B3/004 ,  B81B2201/033 ,  B81B2201/042 ,  F16D2121/14 ,  G02B26/0833

Abstract: A method for activating a deflectable micromechanical actuator unit, in particular a micromirror. A periodic setpoint deflection profile of a deflection of the actuator unit is predefined at a predefined period duration. The actuator unit is periodically activated based on an activation signal according to the predefined period duration. A deflection profile of the deflection of the actuator unit is measured during at least one activation period. The activation signal is adapted for at least one of the following activation periods based on the setpoint deflection profile and on the measured deflection profile.

公开(公告)号：US09869858B2

公开(公告)日：2018-01-16

申请号：US14955060

申请日：2015-12-01

Applicant: APPLE INC.

Inventor： Yuval Gerson ,  Alexander Shpunt

IPC: G01S17/42 ,  G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  G01S7/481 ,  G01S17/89 ,  G01S7/497 ,  G02B26/08 ,  G01S17/10

CPC classification number: G02B26/101 ,  B81B3/00 ,  B81B3/007 ,  B81B2201/033 ,  B81B2201/034 ,  B81B2201/047 ,  B81B2203/0136 ,  B81B2203/058 ,  B81B2207/015 ,  B81C1/00515 ,  B81C2201/0111 ,  G01S7/4817 ,  G01S7/497 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G02B26/0833

Abstract: A scanning device includes a frame, having a central opening, and an array including a plurality of parallel mirrors contained within the central opening of the frame. Hinges respectively connect the mirrors to the frame and define respective, mutually-parallel axes of rotation of the mirrors relative to the frame. A main drive applies a driving force to the array so as to drive an oscillation of the mirrors about the hinges at a resonant frequency of the array. A sensor is configured to detect a discrepancy in a synchronization of the oscillation among the mirrors in the array, and an adjustment circuit applies a corrective signal to at least one of the mirrors in order to alleviate the detected discrepancy.

公开(公告)号：US09829318B2

公开(公告)日：2017-11-28

申请号：US14694208

申请日：2015-04-23

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Anssi Blomqvist

IPC: G01C19/00 ,  G01C19/5762 ,  G01C19/5712 ,  G01C19/5747

CPC classification number: G01C19/5762 ,  B81B2201/0242 ,  B81B2201/033 ,  G01C19/5712 ,  G01C19/5747

Abstract: A microelectromechanical gyroscope structure for detecting angular motion about an axis of angular motion. A drive element is suspended for one-dimensional motion in a direction of a drive axis, and a sense body carries one or more sense rotor electrodes and is coupled to the drive element with a first directional spring structure that forces the sense body to move with the drive element and has a preferred direction of motion in a direction of a sense axis. The drive element includes an actuation body and a drive frame wherein the first spring structure couples the sense body directionally to the drive frame, and a second directional spring structure that couples the drive frame to the actuation body and has a preferred direction of motion in the direction of the sense axis.

公开(公告)号：US20170190569A1

公开(公告)日：2017-07-06

申请号：US15165893

申请日：2016-05-26

Applicant: MEMS DRIVE, INC.

Inventor： XIAOLEI LIU ,  MATTHEW NG ,  ROBERT CALVET ,  GERARDO MORABITO

IPC: B81B3/00 ,  H02N1/00

CPC classification number: B81B3/0051 ,  B81B7/0016 ,  B81B2201/033 ,  B81B2203/0118 ,  B81B2203/0136 ,  H02N1/006

Abstract: Caging structures are disclosed for caging or otherwise reducing the mechanical shock pulse experienced by MEMS device beam structures during events that may cause mechanical shock to the MEMS device. The caging structures at least partially surround the beam such that they limit the motion of the beam in a direction perpendicular to the beam's longitudinal axis, thereby reducing stress on the beam during a mechanical shock event. The caging structures may be used in combination with mechanical shock-resistant beams.

公开(公告)号：US20170133951A1

公开(公告)日：2017-05-11

申请号：US15412679

申请日：2017-01-23

Applicant: MEMS Drive, Inc.

Inventor： Xiaolei Liu ,  Guiqin Wang ,  Matthew Ng

IPC: H02N1/00 ,  H02N2/02 ,  B81B7/00 ,  B81B7/02 ,  H01L41/09 ,  B81B3/00

CPC classification number: H02N1/008 ,  B81B3/0021 ,  B81B3/0062 ,  B81B7/0006 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/033 ,  B81B2201/034 ,  B81B2201/047 ,  B81B2203/0118 ,  B81B2203/0136 ,  B81B2203/05 ,  B81B2203/053 ,  G02B7/09 ,  G02B27/646 ,  H01L41/09 ,  H01L41/0953 ,  H02N2/02 ,  H04N5/23287

Abstract: A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.

公开(公告)号：US09630836B2

公开(公告)日：2017-04-25

申请号：US14872094

申请日：2015-09-30

Applicant: MEMS DRIVE, INC.

Inventor： Roman Gutierrez ,  Tony Tang ,  Xiaolei Liu ,  Matthew Ng ,  Guiqin Wang

IPC: H01L21/00 ,  B81C1/00

CPC classification number: B81C1/00476 ,  B81B2201/033 ,  B81C1/00619 ,  B81C99/0095 ,  B81C2201/0132 ,  B81C2201/056

Abstract: A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.

公开(公告)号：US20170088418A1

公开(公告)日：2017-03-30

申请号：US14872094

申请日：2015-09-30

Applicant: MEMS DRIVE, INC.

Inventor： ROMAN GUTIERREZ ,  TONY TANG ,  XIAOLEI LIU ,  MATTHEW NG ,  GUIQIN WANG

IPC: B81C1/00

CPC classification number: B81C1/00476 ,  B81B2201/033 ,  B81C1/00619 ,  B81C99/0095 ,  B81C2201/0132 ,  B81C2201/056

Abstract: A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.

公开(公告)号：US20160337592A1

公开(公告)日：2016-11-17

申请号：US15224399

申请日：2016-07-29

Applicant: MEMS Start, LLC

Inventor： ROMAN C. GUTIERREZ

IPC: H04N5/232 ,  H04N5/225 ,  H02N1/00 ,  G03B3/10

CPC classification number: H04N5/23287 ,  B81B3/0062 ,  B81B2201/033 ,  B81B2203/0136 ,  G03B3/10 ,  G03B2205/0053 ,  G03B2205/0084 ,  H02N1/008 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254

Abstract: An actuator for moving a platform having electrical connections is provided. The actuator includes an outer frame connected to an inner frame by one or more spring elements that are electrically conductive. The actuator further includes one or more comb drive actuators that apply a controlled force between the outer frame and the inner frame. Each of the comb drive actuators includes one or more comb drives. Moreover, a method for moving a platform having electrical connections is also provided. The method includes connecting an outer frame to an inner frame using one or more spring elements that are electrically conductive. The method further includes generating a controlled force using one or more comb drive actuators. Each of the comb drive actuators includes one or more comb drives. In addition, the method includes applying the controlled force between the outer frame and the inner frame.

公开(公告)号：US20160332872A1

公开(公告)日：2016-11-17

申请号：US15147233

申请日：2016-05-05

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Antti IIHOLA ,  Altti TORKKELI

IPC: B81C1/00

CPC classification number: B81C1/00595 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/033 ,  B81B2203/0136 ,  B81C1/00603 ,  G01C19/56 ,  G01C19/5733 ,  G01C19/5769

Abstract: A method for manufacturing a micromechanical device layer is performed on a device wafer comprising a single layer of homogenous material. The method comprises patterning a first mask on a first face of the device wafer, the first mask patterning at least lateral dimensions of comb structures and outlines of large device structures. First trenches are etched, the first trenches defining the lateral dimensions of the at least comb structures and outlines of large device structures in a single deep etching process. Recession etching may be used on one or two faces of the device wafer for creating structures at least partially recessed below the respective surfaces of the device wafer. A double mask etching process may be used on one or two faces of the device wafer for creating structures at least partially recessed to mutually varying depths from the respective face of the device wafer.

Abstract translation: 在包括单层均质材料的器件晶片上进行微机械器件层的制造方法。 该方法包括在器件晶片的第一面上构图第一掩模，第一掩模至少构图梳状结构的横向尺寸和大型器件结构的轮廓。 蚀刻第一沟槽，第一沟槽在单个深刻蚀工艺中限定至少梳状结构的横向尺寸和大型器件结构的轮廓。 衰减蚀刻可以用在器件晶片的一个或两个面上，用于产生至少部分地凹入器件晶片的相应表面下方的结构。 可以在器件晶片的一个或两个面上使用双掩模蚀刻工艺，用于产生至少部分地凹陷到从器件晶片的相应面相互变化的深度的结构。