THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION
    233.
    发明公开

    公开(公告)号:US20240279524A1

    公开(公告)日:2024-08-22

    申请号:US18564711

    申请日:2022-05-11

    Inventor: Isao IIDA

    Abstract: A thermally-conductive polysiloxane composition contains (A) a silver powder, (B) a polyorganosiloxane containing one or more aliphatic unsaturated groups in a molecule, (C) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to a silicon atom in a molecule, and (D) a platinum-based catalyst, wherein the component (A) includes (A-1) a flaky silver powder having a tapped density of 3.0 to 10.0 g/cm3 and an average particle size of 1 to 20 μm, and (A-2) an agglomerated silver powder having a tapped density of 1.0 to 5.0 g/cm3 and an average particle size of 1 to 10 μm, and the content ratio of component (A-1) and component (A-2) in 100 mass % of the thermally-conductive polysiloxane composition is 70 to 98 mass %. A heat-dissipating material uses the thermally-conductive polysiloxane composition.

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