公开(公告)号：US20230055125A1

公开(公告)日：2023-02-23

申请号：US17787310

申请日：2020-12-10

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC ,  DAIKIN INDUSTRIES, LTD.

Inventor： Isao IIDA ,  Kazuhisa ONO ,  Tetsuo FUJIMOTO ,  Kazuki MARUHASHI ,  Hisashi MITSUHASHI

IPC: C08G77/46 ,  C08K5/544 ,  C08K5/5415 ,  C08K3/26 ,  C08K3/04

Abstract: A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR2 groups bonded to an Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) an inorganic filler with a primary particle size from 0.01 to 0.1 μm.

公开(公告)号：US20210147681A1

公开(公告)日：2021-05-20

申请号：US16319639

申请日：2017-07-20

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Daigo HIRAKAWA ,  Masanori TAKANASHI ,  Isao IIDA ,  Kenji TAKENAKA ,  Eiji TANIGAWA

IPC: C08L83/04 ,  C08G77/08 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/00 ,  C08K3/28 ,  C08K3/22

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 μm to 150 μm in an amount of at least 20% by mass, based on the mass of a total of the component (A).

公开(公告)号：US20190161666A1

公开(公告)日：2019-05-30

申请号：US15772690

申请日：2016-11-02

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Eiji TANIGAWA ,  Masanori TAKANASHI ,  Isao IIDA ,  Daigo HIRAKAWA ,  Kenji TAKENAKA

IPC: C09K5/14 ,  C08G77/20 ,  C08K9/06 ,  C08K3/22

Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

公开(公告)号：US20230227651A1

公开(公告)日：2023-07-20

申请号：US17928915

申请日：2021-06-01

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Isao IIDA ,  Kazuhisa ONO ,  Koji MIYATA

IPC: C08L83/06 ,  C08K3/22 ,  C08K3/04 ,  C08K5/45 ,  C08J3/28 ,  C08F4/26 ,  C08K3/36

CPC classification number: C08L83/06 ,  C08K3/22 ,  C08K3/04 ,  C08K5/45 ,  C08J3/28 ,  C08F4/26 ,  C08K3/36 ,  C08L2312/08 ,  C08K2003/2241 ,  C08K2201/014 ,  C08J2383/06

Abstract: A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional groups per molecule; (b) a crosslinking agent having per molecule two or more crosslinkable groups having reactivity with the curable functional groups of the component (a); (c) a curing catalyst capable of catalyzing a crosslinking reaction of the component (a) and the component (b); (d) a pigment which itself does not emit a fluorescent light; and (e) a UV tracer. The composition can be used as an adhesive.

公开(公告)号：US20210147738A1

公开(公告)日：2021-05-20

申请号：US16319612

申请日：2017-07-20

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Masanori TAKANASHI ,  Isao IIDA ,  Daigo HIRAKAWA ,  Kenji TAKENAKA ,  Eiji TANIGAWA

IPC: C09K5/14 ,  C08G77/18 ,  C08G77/12 ,  C08G77/08 ,  C08K3/22 ,  C08K3/28 ,  H05K7/20

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure

公开(公告)号：US20150140346A1

公开(公告)日：2015-05-21

申请号：US14605184

申请日：2015-01-26

Applicant: Momentive Performance Materials Japan LLC

Inventor： Isao IIDA ,  Yasuhito MORITA

IPC: C09D183/06 ,  H05K1/18

CPC classification number: C09D183/06 ,  C08K5/0091 ,  C08K5/5419 ,  C08L83/04 ,  C08L83/14 ,  C09D7/63 ,  C09D183/04 ,  C09D183/14 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/20 ,  Y10T428/31663 ,  C08L83/00

Abstract: This room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of polyorganosiloxane consisting of: (A1) 10 to 80 parts by mass of a both ends alkoxysilyl group-terminated polyorganosiloxane and (A2) 90 to 20 parts by mass of a partial hydrolysis condensate (the number of Si atoms is 10 to 200) of a silane compound expressed by a general formula: R4bSi(OR)4-b; (B) 0.1 to 15 parts by mass of a silane compound or a partial hydrolysis condensate thereof (the number of Si atoms is 1 or more and less than 10) as a cross-linking agent; and (C) 0.1 to 15 parts by mass of an organic titanium compound as a curing catalyst. It has low viscosity and good coatability without a solvent, and forms a cured coating film excellent in scratch resistance.

Abstract translation: 该室温固化性聚有机硅氧烷组合物含有：（A）100质量份由以下组成的聚有机硅氧烷：（A1）10〜80质量份的末端为末端的烷氧基甲硅烷基封端的聚有机硅氧烷和（A2）90〜20质量份 的由下列通式表示的硅烷化合物的部分水解缩合物（Si原子数为10〜200）：R4bSi（OR）4-b; （B）0.1〜15质量份作为交联剂的硅烷化合物或其部分水解缩合物（Si原子数为1以上且小于10）; 和（C）0.1〜15质量份作为固化催化剂的有机钛化合物。 没有溶剂，粘度低，涂布性好，形成耐刮擦性优异的固化涂膜。

公开(公告)号：US20210147633A1

公开(公告)日：2021-05-20

申请号：US16319624

申请日：2017-07-20

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Eiji TANIGAWA ,  Masanori TAKANASHI ,  Isao IIDA ,  Daigo HIRAKAWA ,  Kenji TAKENAKA

IPC: C08G77/18 ,  C08K9/06 ,  C08K3/013

Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

公开(公告)号：US20160304745A1

公开(公告)日：2016-10-20

申请号：US15190916

申请日：2016-06-23

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Isao IIDA ,  Takeshi SUNAGA

IPC: C09D183/06 ,  B05D1/02

CPC classification number: C09D183/06 ,  B05D1/02 ,  C08G77/18 ,  C08K5/0025 ,  C08K5/56 ,  C09D183/04 ,  C08L83/00 ,  C08K5/57 ,  C08K5/5419 ,  C08K5/5442 ,  C08L83/06

Abstract: There is provided a room-temperature-curable polyorganosiloxane composition having low viscosity and good coatability without any solvent and forming a cured coating film excellent in scratch resistance. The room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of a mixture of (A1) 10 to 80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to silicon atoms and a prescribed viscosity, and (A2) 90 to 20 parts by mass of a polyorganosiloxane represented by an average composition formula: R1aSi(OR2)bO{4−(a+b)}/2 (R1 and R2 represent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.

Abstract translation: 提供了一种室温可固化的聚有机硅氧烷组合物，其具有低粘度和良好的涂布性，而没有任何溶剂，并且形成了耐擦伤性优异的固化涂膜。 室温固化性聚有机硅氧烷组合物含有：（A）100质量份（A1）10〜80质量份具有两个以上与硅原子键合的烷氧基的聚有机硅氧烷和规定粘度的混合物，（ A2）90〜20质量份以平均组成式：R1aSi（OR2）bO {4-（a + b）} / 2表示的聚有机硅氧烷（R1和R2分别表示规定的组，a和b为规定的正数 数字），Mw为2000〜100,000，三维网状结构，在常温下处于固态或半固态; 和（B）0.1〜15质量份有机钛化合物。

公开(公告)号：US20150240057A1

公开(公告)日：2015-08-27

申请号：US14707540

申请日：2015-05-08

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Prakash KUMAR ,  Isao IIDA

IPC: C08K9/04

CPC classification number: C08K9/04 ,  C08G77/16 ,  C08K5/5419 ,  C08K5/544 ,  C08K5/57 ,  C08K2003/265 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06

Abstract: There is provided a room-temperature-curable polyorganosiloxane composition that provides a cured product having little decrease in hardness at high temperature and high humidity, and is excellent in adhesiveness to various base materials. The composition is a two-part room-temperature-curable polyorganosiloxane composition including a main agent composition (A) and a curing agent composition (B). The main agent composition (A) contains, at a predetermined ratio, (c) polyorganosiloxane having a resin structure represented by an average unit formula: (R13SiO1/2)p[Si(OH)xO(4−x)/2]q. The curing agent composition (B) contains (e) a trifunctional or tetrafunctional silane compound or a partial hydrolysis condensate thereof and (f) an amino group-containing silicon compound.

Abstract translation: 提供一种室温可固化聚有机硅氧烷组合物，其提供在高温和高湿度下几乎没有硬度降低的固化产物，并且对各种基材的粘合性优异。 该组合物是包含主剂组合物（A）和固化剂组合物（B）的两部分室温可固化聚有机硅氧烷组合物。 主剂组合物（A）以预定比例含有（c）具有由平均单元式（R 13 SiO 1/2）p [Si（OH）x O（4-x）/ 2] q表示的树脂结构的聚有机硅氧烷 。 固化剂组合物（B）含有（e）三官能或四官能的硅烷化合物或其部分水解缩合物和（f）含氨基的硅化合物。

公开(公告)号：US20240279524A1

公开(公告)日：2024-08-22

申请号：US18564711

申请日：2022-05-11

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Isao IIDA

IPC: C09K5/14 ,  C08G77/04 ,  C08G77/12 ,  C08G77/20 ,  C08K7/00

CPC classification number: C09K5/14 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08K7/00 ,  C08K2201/001 ,  C08K2201/005

Abstract: A thermally-conductive polysiloxane composition contains (A) a silver powder, (B) a polyorganosiloxane containing one or more aliphatic unsaturated groups in a molecule, (C) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to a silicon atom in a molecule, and (D) a platinum-based catalyst, wherein the component (A) includes (A-1) a flaky silver powder having a tapped density of 3.0 to 10.0 g/cm3 and an average particle size of 1 to 20 μm, and (A-2) an agglomerated silver powder having a tapped density of 1.0 to 5.0 g/cm3 and an average particle size of 1 to 10 μm, and the content ratio of component (A-1) and component (A-2) in 100 mass % of the thermally-conductive polysiloxane composition is 70 to 98 mass %. A heat-dissipating material uses the thermally-conductive polysiloxane composition.