公开(公告)号：US08420745B2

公开(公告)日：2013-04-16

申请号：US13216653

申请日：2011-08-24

Applicant: Jhy-Long Jeng ,  Jeng-Yu Tsai ,  Shur-Fen Liu ,  Jinn-Shing King

Inventor： Jhy-Long Jeng ,  Jeng-Yu Tsai ,  Shur-Fen Liu ,  Jinn-Shing King

IPC: C08G59/14 ,  C08G59/40 ,  C08G59/22 ,  C08L63/00 ,  H05K3/28

CPC classification number: C08G59/066 ,  C08G59/22 ,  H05K1/0393 ,  H05K3/285 ,  H05K2201/0145

Abstract: A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

Abstract translation: 提供了一种用于柔性印刷电路板的热固化阻焊组合物。 阻焊剂组合物包含（a）50-100重量份的环氧树脂，其中环氧树脂至少包含具有式（I）或（II）的脂族聚酯改性环氧树脂，其中R1和R2各自 独立地是C6-38饱和或不饱和碳链，R3是醚，苯基，C6-38杂环或C6-38饱和碳链，n是1-10的整数，脂肪族聚酯改性环氧树脂具有 分子量1000-5000; （b）1-10重量份的固化剂; 和（c）1-10重量份的催化剂。

公开(公告)号：US20130025922A1

公开(公告)日：2013-01-31

申请号：US13193858

申请日：2011-07-29

Applicant: Karl S. Weibezahn

Inventor： Karl S. Weibezahn

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/189 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L31/02008 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/291 ,  H01L2224/7525 ,  H01L2224/83101 ,  H01L2224/83222 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2933/0066 ,  H05K3/34 ,  H05K2201/0116 ,  H05K2201/0145 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10143 ,  Y02E10/50 ,  Y10T29/49144 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods and apparatus are provided for mass production of electronic devices. Rows of perforation are formed across a sheet of conductive material such that plural conjoined strips are defined. Respective electronic entities are soldered to each of the conjoined strips. The strips are separated by severing the perforations such that plural discrete electronic devices are defined. Solar panels, electronic circuits and other apparatus can be formed in this way.

Abstract translation: 提供了用于批量生产电子设备的方法和装置。 穿孔的行穿过导电材料片形成，从而限定多个连接条。 各个电子实体被焊接到每个连接条。 通过切断穿孔来分离条带，以便限定多个分立的电子装置。 太阳能电池板，电子电路等装置可以这样形成。

公开(公告)号：US20120273257A1

公开(公告)日：2012-11-01

申请号：US13098394

申请日：2011-04-29

Applicant: CHAO-CHIEH CHU

Inventor： CHAO-CHIEH CHU

IPC: H05K1/09 ,  C23C14/28 ,  B05D5/12

CPC classification number: G06F3/044 ,  G06F2203/04103 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/0326

Abstract: A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of embedded conductive circuits embedded into the first coating layer and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger, any type of touch pen, or etc.) to touch.

Abstract translation: 施加到触摸面板的透明导电结构包括基板单元，第一涂覆单元，透明导电单元和第二涂覆单元。 基板单元包括透明基板。 第一涂布单元包括形成在透明基板的顶表面上的第一涂层。 透明导电单元包括形成在第一涂层的顶表面上的透明导电层。 透明导电层包括嵌入到第一涂层中并被布置成形成预定嵌入电路图案的多个嵌入式导电电路。 第二涂布单元包括形成在透明导电层的顶表面上的第二涂层。 第二涂层具有在其顶侧上形成的触摸表面，并且触摸表面允许外部对象（诸如用户的手指，任何类型的触摸笔等）触摸。

公开(公告)号：US20120193131A1

公开(公告)日：2012-08-02

申请号：US13262944

申请日：2010-04-07

Applicant: Kouichi Kusakawa ,  Kazuhiko Konomi ,  Satoshi Okamoto ,  Toyonari Ito

Inventor： Kouichi Kusakawa ,  Kazuhiko Konomi ,  Satoshi Okamoto ,  Toyonari Ito

IPC: H05K1/05 ,  B32B37/26 ,  B32B37/06

CPC classification number: H05K1/056 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0355

Abstract: The metal base circuit board according to the present invention includes a metal substrate, an insulating layer provided on the metal substrate, and a conductive foil for circuit formation that is provided on the insulating layer. The metal substrate has a thermal conductivity of 60 W/mK or more and a thickness of 0.2 to 5.0 mm. The insulating layer is formed using an insulating material composition in which an inorganic filler having a thermal conductivity of 30 W/mK or more is dispersed in a non-anisotropic liquid crystal polyester solution. According to the present invention, a metal base circuit board can be provided that can be applied in an inverter and applications requiring high heat dissipation properties, and that has high thermal conductivity, as well as having high thermal stability and electrical reliability.

Abstract translation: 根据本发明的金属基底电路板包括金属基板，设置在金属基板上的绝缘层和设置在绝缘层上的用于电路形成的导电箔。 金属基板的导热率为60W / mK以上，厚度为0.2〜5.0mm。 使用绝缘材料组合物形成绝缘层，其中导热率为30W / mK以上的无机填料分散在非各向异性液晶聚酯溶液中。 根据本发明，可以提供可应用于逆变器的金属基底电路板以及需要高散热性能，并且具有高导热性以及具有高热稳定性和电可靠性的应用。

公开(公告)号：US20120177897A1

公开(公告)日：2012-07-12

申请号：US13321675

申请日：2010-08-27

Applicant: Gregory A. Jablonski ,  Michael A. Mastropietro ,  Kimitaka Sato ,  Hiromasa Miyoshi ,  Hidefumi Fujita

Inventor： Gregory A. Jablonski ,  Michael A. Mastropietro ,  Kimitaka Sato ,  Hiromasa Miyoshi ,  Hidefumi Fujita

IPC: B32B15/02 ,  B32B3/10 ,  H01B1/22 ,  B82Y30/00

CPC classification number: C22C5/06 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B22F2301/255 ,  B22F2304/054 ,  B82Y30/00 ,  C23C24/087 ,  C23C24/106 ,  H05K1/097 ,  H05K2201/0145 ,  H05K2201/10098 ,  Y10T428/24802 ,  Y10T428/24909

Abstract: A silver nanoparticle composition is provided which is possible to be sintered through sintering at a low temperature in a short time and to form silver electro conductive film and wiring which is favorable for adhesion to a substrate and low in resistance, and articles using the same are provided. The silver nanoparticle composition is provided, wherein a main component of a solvent is water, a pH of the composition is within a range of 5.3 to 8.0, a silver nanoparticle included in the composition is protected by an organic acid or a derivative thereof, and the content of the organic acid or the derivative thereof with respect to silver is 2 to 20% by mass.

Abstract translation: 提供了一种银纳米颗粒组合物，其可以在短时间内在低温下烧结而烧结，并形成银导电膜和布线，其有利于对基片的粘附和低电阻，并且使用该银导电膜和布线 提供。 提供了银纳米颗粒组合物，其中溶剂的主要组分是水，组合物的pH在5.3至8.0的范围内，组合物中包含的银纳米颗粒被有机酸或其衍生物保护，并且 有机酸或其衍生物相对于银的含量为2〜20质量％。

公开(公告)号：US08153709B2

公开(公告)日：2012-04-10

申请号：US12482463

申请日：2009-06-11

Applicant: Bin Jian ,  Li-Chun Chen

Inventor： Bin Jian ,  Li-Chun Chen

IPC: C08K3/36 ,  C08K5/07 ,  C08L63/04

CPC classification number: H05K1/0326 ,  B32B17/04 ,  B32B27/12 ,  B32B27/20 ,  B32B27/24 ,  B32B27/26 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/718 ,  B32B2457/08 ,  C08G59/62 ,  C08G59/688 ,  C08K5/3155 ,  C08K5/54 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249946

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract translation: 提供了一种制备无卤素树脂的组合物，该组合物包括无卤素磷酸化环氧树脂，氨基甲酸酯改性共聚酯，固化剂，填料，表面活性剂和溶剂。 还提供了一种无卤素预浸料，其包括玻璃织物和玻璃织物上的无卤素树脂层。 无卤树脂层由上述无卤素树脂制成。

公开(公告)号：US08138263B2

公开(公告)日：2012-03-20

申请号：US12344484

申请日：2008-12-27

Applicant: Shur-Fen Liu ,  Meng-Huei Chen ,  Man-Chun Yu

Inventor： Shur-Fen Liu ,  Meng-Huei Chen ,  Man-Chun Yu

IPC: C08K3/22 ,  C08L101/00 ,  H01B3/30

CPC classification number: C08K3/22 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/0209 ,  C08L21/00

Abstract: A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.

Abstract translation: 提供了用于制造柔性基底的柔性低介电损耗组合物。 该组合物包括：SrTiO 3和/或Ba（Sr）TiO 3陶瓷颗粒，其特征尺寸在30nm和2μm之间，其量为组合物重量的20-80％; 至少一种柔性大分子的量为组合物重量的1.0-50％，其中大分子具有羟基，羧基，烯丙基，氨基或链脂族环氧基的官能团; 和热固性有机树脂。

公开(公告)号：US20090169773A1

公开(公告)日：2009-07-02

申请号：US12126783

申请日：2008-05-23

Applicant: Sang Gon LEE ,  Dae Sung Kim ,  Woo Hyuck Chang

Inventor： Sang Gon LEE ,  Dae Sung Kim ,  Woo Hyuck Chang

IPC: C09K19/00 ,  B32B15/04 ,  B32B7/00 ,  B32B3/10

CPC classification number: H05K3/38 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/181 ,  H05K3/388 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  Y10T428/10 ,  Y10T428/24273 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2924/00

Abstract: A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the water absorbency of the dielectric film is about 0.01-3.5%. The flexible film is robust against humidity variations and can efficiently transmit image signals having a high scan rate.

Abstract translation: 提供柔性膜。 柔性膜包括电介质膜; 以及设置在所述电介质膜上的金属层，其中所述电介质膜的吸水性为约0.01-3.5％。 柔性膜对于湿度变化是鲁棒的，并且可以有效地传输具有高扫描速率的图像信号。

公开(公告)号：US20070246690A1

公开(公告)日：2007-10-25

申请号：US11785786

申请日：2007-04-20

Applicant: Kuang-Ming Kuo ,  Nelson Tseng ,  Yung-Jen Hsiao

Inventor： Kuang-Ming Kuo ,  Nelson Tseng ,  Yung-Jen Hsiao

IPC: H01B1/12

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K2201/0145 ,  H05K2201/0245

Abstract: Membrane switches are manufactured by electrically conductive pastes consisting of 55 to 65% by weight of metal powder in the shape of flake (silver, aluminum, copper or the alloy thereof), 35 to 60% by weight of an organic solvent at high boiling point, 5 to 15% by weight of organic thermal plastic, including mainly saturation polyester polymer, and 0.5 to 5% by weight of additives, including trietheanolamine, adhesion promoter, defoamer, leveling agent, thixotropic agent etc. The silver paste is of excellent adhesion on ITO film or ITO glass, delivers conductivity high up to 20 mΩ/□ with less than 65% by weight of silver, and passes test under the conditions (85□, 85% RH, 1000 hours).

Abstract translation: 薄膜开关由薄片（银，铝，铜或其合金）55〜65重量％的金属粉末，高沸点有机溶剂35〜60重量％ ，5〜15重量％的有机热塑性塑料，其中主要包括饱和聚酯聚合物，和0.5-5重量％的添加剂，包括三
乙炔胺，粘合促进剂，消泡剂，流平剂，触变剂等。 在ITO膜或ITO玻璃上，电导率高达20mOmega /□，小于65重量％的银，并在条件（85℃，85％RH，1000小时）下通过试验。

公开(公告)号：US07226664B2

公开(公告)日：2007-06-05

申请号：US11439793

申请日：2006-05-24

Applicant: Shotaro Tanaka ,  Junpei Ohashi ,  Yasushi Takada

Inventor： Shotaro Tanaka ,  Junpei Ohashi ,  Yasushi Takada

IPC: B32B27/08 ,  B32B15/09 ,  B32B27/26 ,  B32B27/28 ,  B32B27/36

CPC classification number: B32B27/36 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/281 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2307/714 ,  B32B2457/08 ,  C08K5/353 ,  H05K1/0326 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0154 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/31786 ,  Y10T428/31794 ,  C08L67/02

Abstract: The present invention is to provide a laminated polyester film with excellent adhesive properties for use in a laminating material, and the laminated polyester film is a film in which a resin layer including a polyester resin and a oxazoline-based cross-linking agent is laminated on at least one side surface of polyester film, diethylene glycol accounts for 40 mole % or more of all diol components constituting the polyester resin and the mass ratio of the polyester resin to the oxazoline-based cross-linking agent resin layer is within a range of 20/80 to 80/20. Furthermore, the present invention is to provide a flame-retardant polyester film in which a polyimide-including layer is laminated on both sides of the laminated polyester film and also a copper-clad laminated plate in which the flame-retardant polyester film is used, and also a circuit substrate in which the copper-clad laminated plate is used.

Abstract translation: 本发明提供一种层压材料具有优异的粘合性能的叠层聚酯薄膜，层压聚酯薄膜是将包含聚酯树脂和恶唑啉系交联剂的树脂层层压在 聚酯膜的至少一个侧面，二甘醇占构成聚酯树脂的所有二醇成分的40摩尔％以上，聚酯树脂与恶唑啉系交联剂树脂层的质量比在 20/80至80/20。 此外，本发明提供一种阻聚聚酯膜，其中在层压聚酯膜的两面上层叠含聚酰亚胺的层以及其中使用阻燃聚酯膜的覆铜层压板， 以及使用覆铜层压板的电路基板。