公开(公告)号：US20100072511A1

公开(公告)日：2010-03-25

申请号：US12626884

申请日：2009-11-28

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base that include a copper surface layer and an aluminum core. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括柱和包括铜表面层和铝芯的基座。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20020005591A1

公开(公告)日：2002-01-17

申请号：US09464561

申请日：1999-12-16

Applicant: Charles W.C. Lin

Inventor： CHARLES W.C. LIN

IPC: H01L023/48

CPC classification number: H01L24/50 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00

Abstract: A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes or apertures of which preformed strips or wires inside the via holes serve as the connections between the semiconductor device and substrate circuitry. The assembling steps may include attaching an integrated circuit (IC) chip or chips to a rigid or flexible substrate circuitry having a plurality of pre-formed strips extended from the patterned circuitry and hanging inside a plurality of through holes. These through holes are aligned and placed on top of the terminal pads so that the respective traces on the substrate can be connected with the respective input/output terminal pads of the IC chip through the leads inside the via holes. After attachment, electrically conductive material is subsequently connected to these leads to the IC terminal pads through electrolytic plating, electroless (chemical) plating or solder re-flow processes. The joining material can provide mechanical support as well as electrical continuity between IC chip and the circuitry of the substrate.

Abstract translation: 一种倒装芯片组件及其形成方法，包括具有多个通孔或孔的单层或多层基板，其中通孔内的预制条或导线用作半导体器件与衬底电路之间的连接。 组装步骤可以包括将集成电路（IC）芯片或芯片附接到具有从图案化电路延伸并且悬挂在多个通孔内的多个预成形条的刚性或柔性基板电路。 这些通孔对齐并放置在端子焊盘的顶部上，使得衬底上的各个迹线可以通过通孔内的引线与IC芯片的相应输入/输出端子焊盘连接。 附着后，导电材料随后通过电镀，无电镀（化学镀）或焊料回流工艺连接到这些引线到IC端子焊盘。 接合材料可以提供机械支撑以及IC芯片和基板的电路之间的电连续性。

公开(公告)号：US20110278638A1

公开(公告)日：2011-11-17

申请号：US13192463

申请日：2011-07-28

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/62

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48639 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/0104 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a dielectric base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive, the second post extends from the dielectric base in a second vertical direction into a second opening in the second adhesive and the dielectric base contacts and is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 散热器包括第一柱，第二柱和电介质基底。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线并热连接到散热器。 第一柱从第一垂直方向的电介质基底延伸到第一粘合剂中的第一开口中，第二柱从第二垂直方向的电介质基底延伸到第二粘合剂中的第二开口中，并且电介质基底接触并且是 夹在柱之间并横向延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20110037094A1

公开(公告)日：2011-02-17

申请号：US12911729

申请日：2010-10-26

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/64 ,  H01L33/56

CPC classification number: H05K1/021 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01087 ,  H01L2924/15153 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/10106 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00014

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括凸块，底座和凸缘。 导电迹线包括焊盘和端子。 半导体器件延伸到凸块中的空腔中，电连接到导电迹线并且热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。

公开(公告)号：US20100193830A1

公开(公告)日：2010-08-05

申请号：US12758040

申请日：2010-04-12

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L33/48 ,  H01L33/64

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/49575 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部穿过第一粘合剂中的开口向上延伸，并且基部从柱横向延伸。 第一粘合剂在基部和导电迹线之间延伸，并且第二粘合剂在柱和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20100190297A1

公开(公告)日：2010-07-29

申请号：US12714494

申请日：2010-02-28

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L21/50 ,  H01L21/60

CPC classification number: H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106 ,  H01L2224/05599

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将基底安装在粘合剂上，包括使柱与基底中的孔对准， 然后将粘合剂在位于柱和基底之间的孔中的间隙中向上流动，固化粘合剂，然后蚀刻柱以在柱中形成空腔，然后将半导体器件安装在柱上，其中散热器 包括柱和基部，并且半导体器件延伸到空腔中，将半导体器件电连接到衬底并将半导体器件热连接到散热器。

公开(公告)号：US20100163921A1

公开(公告)日：2010-07-01

申请号：US12721551

申请日：2010-03-10

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader is aluminum and includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace includes a silver coating and a copper core and provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器是铝，包括一个柱子和一个基座。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线包括银涂层和铜芯，并且在焊盘和端子之间提供信号路由。

公开(公告)号：US20100059786A1

公开(公告)日：2010-03-11

申请号：US12616773

申请日：2009-11-11

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The assembly provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，衬底和粘合剂。 半导体器件电连接到衬底并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部向上延伸到粘合剂中的开口和基底中的孔，并且基部从柱横向延伸。 粘合剂在柱和基底之间以及基底和基底之间延伸。 组件提供垫和终端之间的信号路由。

公开(公告)号：US20100052005A1

公开(公告)日：2010-03-04

申请号：US12616775

申请日：2009-11-11

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L23/34

CPC classification number: H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US06576539B1

公开(公告)日：2003-06-10

申请号：US09939140

申请日：2001-08-24

Applicant: Charles W.C. Lin

Inventor： Charles W.C. Lin

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/4046 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48

Abstract: A semiconductor chip assembly includes a semiconductor chip, a conductive trace, a connection joint, an insulative adhesive and an encapsulant. The conductive trace includes a routing line and a pillar. The routing line extends within and outside a periphery of the chip, and the pillar is disposed outside the periphery of the chip and extends away from the chip. The connection joint contacts and electrically connects the routing line and the pad. The adhesive is sandwiched between the routing line and the chip and contacts a surface of the routing line that faces away from the chip, thereby interlocking the routing line to the assembly. The encapsulant extends into a channel in the pillar, thereby interlocking the pillar to the assembly.