POWER-DELIVERY MECHANISM AND APPARATUS OF PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION USING THE SAME
    22.
    发明申请
    POWER-DELIVERY MECHANISM AND APPARATUS OF PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION USING THE SAME 有权
    动力传递机理及其等离子体增强化学气相沉积的设备

    公开(公告)号:US20080295771A1

    公开(公告)日:2008-12-04

    申请号:US11847316

    申请日:2007-08-29

    Abstract: A power-delivery mechanism is provided in the present invention, which utilizes an element with airtight and flexible characteristics coupled to a power-generating unit so as to generate a motion in a specific direction. Besides, an apparatus of plasma -enhanced chemical vapor deposition (PECVD) is also provided in the present invention, which comprises the power-delivery mechanism to load/unload a workpiece onto a stage for processing automatically. Meanwhile, the present invention also provides a height-adjusting unit and a position-indicating unit allowing the operator to adjust the distance between an upper electrode and a lower electrode of the PECVD so that the operator is capable of monitoring and adjusting the distance easily between the upper electrode and the lower electrode outside the chamber of the PECVD.

    Abstract translation: 在本发明中提供了一种动力输送机构,其利用与发电单元相耦合的气密和柔性特性的元件,以产生沿特定方向的运动。 此外,在本发明中还提供了等离子体化学气相沉积(PECVD)装置,其包括将工件装载/卸载到工作台上以自动处理的动力输送机构。 同时,本发明还提供了一种高度调节单元和位置指示单元,其允许操作者调节PECVD的上电极和下电极之间的距离,使得操作者能够容易地监测和调整距离 PECVD室的上电极和下电极。

    RUTHENIUM COMPLEXES WITH TRIDENTATE HETEROCYCLIC LIGAND AND DYE-SENSITIZED SOLAR CELLS USING THE SAME
    23.
    发明申请
    RUTHENIUM COMPLEXES WITH TRIDENTATE HETEROCYCLIC LIGAND AND DYE-SENSITIZED SOLAR CELLS USING THE SAME 有权
    具有三元杂环配体和染料敏感的太阳能电池的钌复合物

    公开(公告)号:US20080114174A1

    公开(公告)日:2008-05-15

    申请号:US11939559

    申请日:2007-11-14

    Abstract: A ruthenium complex having a chemical formula of RuL1L2X is provided. The chemical formula includes a structural formula represented by the following Formula (I): in which, X is a monodentate anion ligand, L1 and L2 respectively represent a heterocyclic tridentate ligand with a structure shown in the following structural formula (II): and a bipyridine ligand derivative with a structure shown in the following structural formula (III): in which R1, R2, R4 and R5 of L1 and L2 are the same or different substituents and represent alkyl, alkoxy, aminoalkyl, haloalkanes or substituted phenyl group, carboxylic acid group or acid radical salt thereof, sulfonic acid group or acid radical salt thereof, phosphoric acid group or acid radical salt thereof or hydrogen atom. R3 represents perhalogenated alkyl group, alkoxy, alkyl, amino, halogens, or hydrogen atom. The ruthenium complexes are suitable for being used as dye-sensitizers for fabricating dye-sensitized solar cells.

    Abstract translation: 提供化学式为RuL 1 L 2 X的钌络合物。 化学式包括由下式(I)表示的结构式:其中X是单齿阴离子配体,L 1和L 2分别表示杂环三齿 具有以下结构式(II)所示结构的配体和具有如下结构式(III)所示结构的联吡啶配体衍生物:其中R 1,R 2, ,L 1和L 2的R 4和R 5都是相同或不同的取代基和/或 代表烷基,烷氧基,氨基烷基,卤代烷基或取代的苯基,羧酸基团或其酸基盐,磺酸基或其酸基盐,磷酸基或其酸基盐或氢原子。 R 3表示全卤代烷基,烷氧基,烷基,氨基,卤素或氢原子。 钌配合物适用于染料敏化剂制造染料敏化太阳能电池。

    Wafer backside protection apparatus
    24.
    发明授权
    Wafer backside protection apparatus 有权
    晶片背面保护装置

    公开(公告)号:US06220771B1

    公开(公告)日:2001-04-24

    申请号:US09461349

    申请日:1999-12-15

    CPC classification number: H01L21/6708 G03F7/707 G03F7/70916 H01L21/67028

    Abstract: A wafer backside protection apparatus includes a motor, a vacuum chuck, an annular seat and a top cover. The motor has an output shaft upon which the chuck is mounted. The chuck has a front surface to suck and hold a wafer from its backside. The chuck has a backside in which a water guard ring and a plurality of slant bores are formed. The slant bores run from the water guard ring through the wafer front surface. The annular seat is located below the chuck and has two symmetrical slant nozzles projecting toward motor rotating direction for ejecting protection liquid to the water guard ring. Protection liquid may be spun and splashed out through the slant bores to form a protection liquid film between the chuck and the wafer backside due to centrifugal force resulting from chuck and wafer rotation driven by the motor. The protection liquid film may protect wafer backside from chemical erosion and contamination resulting from wafer production process.

    Abstract translation: 晶片背面保护装置包括电动机,真空吸盘,环形座和顶盖。 马达具有输出轴,卡盘安装在该输出轴上。 卡盘具有从其背面吸取并保持晶片的前表面。 卡盘具有背面,其中形成有防水环和多个倾斜孔。 倾斜的孔从防水环穿过晶片正面。 环形座位于卡盘下方,并具有朝向马达旋转方向突出的两个对称倾斜喷嘴,用于将防护液喷射到防水环上。 保护液体可以通过倾斜孔旋转溅出,由卡盘和由马达驱动的晶片旋转产生的离心力在卡盘和晶片背面之间形成保护液膜。 保护液膜可以保护晶片背面免受晶片生产过程中的化学侵蚀和污染。

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