公开(公告)号：US07930909B2

公开(公告)日：2011-04-26

申请号：US12230630

申请日：2008-09-02

Applicant: Kyu-Won Lee

Inventor： Kyu-Won Lee

IPC: D06F39/04

CPC classification number: D06F39/008

Abstract: Disclosed are the steam generator and the washing/drying machine having the same, the steam generator including: a case having an opening at one side thereof, a heating unit formed to penetrate the opening, and a fixing assembly mounted at the opening so as to seal the opening and supporting the heating unit, wherein the fixing assembly includes a sealing member for sealing the opening, and the opening includes a leakage prevention portion for preventing a gap formation between the opening and the sealing member when the sealing member is deformed, thereby preventing a leakage between the opening of the case and the sealing member even though the case or the sealing member is thermally deformed.

Abstract translation: 蒸汽发生器和具有该蒸汽发生器的洗涤/干燥机具有以下特征：蒸汽发生器包括：在一侧具有开口的壳体，形成为穿透开口的加热单元，以及安装在开口处的固定组件， 密封开口并支撑加热单元，其中固定组件包括用于密封开口的密封构件，并且开口包括防漏部分，用于防止当密封构件变形时开口和密封构件之间的间隙形成，从而 即使壳体或密封构件发生热变形，防止了壳体的开口和密封构件之间的泄漏。

公开(公告)号：US20100095465A1

公开(公告)日：2010-04-22

申请号：US12425645

申请日：2009-04-17

Applicant: Pyoung Hwan KIM ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

Inventor： Pyoung Hwan KIM ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

IPC: D06L1/00

CPC classification number: D06F35/006 ,  D06F39/005 ,  D06F2202/02 ,  D06F2216/00

Abstract: The present invention relates to a method for controlling a washing machine, in which functioning of a safe rinsing is shown to a user visibly for improving user's reliability. The method, having a detergent amount calculating step for calculating a remained detergent amount at the time of finishing a washing course or a starting of a rinsing course by means of a conductivity sensor, and a determining step for determining whether an additional rinsing is performed or not according to the remained detergent amount calculated thus, the method includes a user informing step for informing a change of the rinsing pattern to the user if the rinsing pattern which is a parameter that gives influence to the rinsing course with reference to the remained detergent amount calculated in the detergent amount calculating step.

Abstract translation: 本发明涉及一种用于控制洗衣机的方法，其中用户可视地显示安全冲洗的功能，以提高用户的可靠性。 该方法具有洗涤剂量计算步骤，用于通过电导率传感器计算清洗过程完成时的残留洗涤剂量或冲洗过程的开始，以及用于确定是否进行附加冲洗的确定步骤， 不是根据由此计算的剩余洗涤剂量，所以该方法包括用户通知步骤，用于通知参照剩余洗涤剂量对冲洗过程产生影响的参数的漂洗图案给用户通知漂洗图案的改变 在洗涤剂量计算步骤中计算。

公开(公告)号：US06853060B1

公开(公告)日：2005-02-08

申请号：US10420977

申请日：2003-04-22

Applicant: Jae Wook Seok ,  Kyu Won Lee ,  Yong Suk Yoo

Inventor： Jae Wook Seok ,  Kyu Won Lee ,  Yong Suk Yoo

IPC: H01L21/48 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H05K3/24 ,  H05K3/28 ,  H01L23/02 ,  H01L23/04 ,  H01L21/44

CPC classification number: H05K3/28 ,  H01L21/4857 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K3/243 ,  H05K3/284 ,  H05K2201/09881 ,  H05K2203/025 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A semiconductor package has a substrate comprising a thermosetting resin layer of an approximate planar plate, a plurality of copper patterns formed at top and bottom surfaces of the resin layer, and protective layers coated on predetermined regions of the copper patterns and the thermosetting layer and having a same height at a surface of the resin layer. A semiconductor die is coupled to a center of the top surface of the substrate. A plurality of conductive wires for electrically coupling the semiconductor die to the copper patterns is positioned at the top surface of the resin layer. An encapsulant is used for covering the semiconductor die located at the top surface of the substrate and the conductive wires in order to protect them from the external environment. A plurality of solder balls is coupled to the bottom surface of the substrate.

Abstract translation: 半导体封装具有包括近似平板的热固性树脂层，形成在树脂层的顶表面和底表面处的多个铜图案的基板和涂覆在铜图案和热固化层的预定区域上的保护层，并且具有 在树脂层的表面具有相同的高度。 半导体管芯耦合到衬底顶表面的中心。 用于将半导体管芯电耦合到铜图案的多个导线定位在树脂层的顶表面。 密封剂用于覆盖位于基板的顶表面和导线的半导体管芯，以便保护它们免受外部环境的影响。 多个焊球联接到基板的底表面。

公开(公告)号：US09082634B2

公开(公告)日：2015-07-14

申请号：US12981386

申请日：2010-12-29

Applicant: Hee-Min Shin ,  Cheol-Ho Joh ,  Eun-Hye Do ,  Ji-Eun Kim ,  Kyu-Won Lee

Inventor： Hee-Min Shin ,  Cheol-Ho Joh ,  Eun-Hye Do ,  Ji-Eun Kim ,  Kyu-Won Lee

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L25/50 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/117 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00

Abstract: A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern.

Abstract translation: 叠层封装包括覆盖膜，具有附接到覆盖膜的第一半导体芯片的第一封装，形成为密封第一半导体芯片的第一粘合构件和覆盖膜的表面，以及第一电路图案 其设置在第一粘合构件上并与第一半导体芯片电连接; 第二封装，设置在所述第一封装上，具有与所述第一电路图案电连接的第二半导体芯片，形成为密封所述第二半导体芯片的第二粘合构件，以及形成在所述第二粘合剂上的第二电路图案 以及形成为穿过第二电路图案和第二粘合构件并且与第一电路图案和第二电路图案电连接的通孔。

公开(公告)号：US08615166B2

公开(公告)日：2013-12-24

申请号：US11919255

申请日：2007-01-23

Applicant: Jae Mun Kim ,  Jong Deuk Bae ,  Heung Gi Kim ,  Ki Chul Woo ,  In Geun Ahn ,  Kyeong Hwan Kim ,  Kyung Chul Woo ,  Kyu Won Lee ,  Young Soo Kim ,  Ji Maeng Kim

Inventor： Jae Mun Kim ,  Jong Deuk Bae ,  Heung Gi Kim ,  Ki Chul Woo ,  In Geun Ahn ,  Kyeong Hwan Kim ,  Kyung Chul Woo ,  Kyu Won Lee ,  Young Soo Kim ,  Ji Maeng Kim

IPC: A61H3/06

CPC classification number: D06F39/008 ,  F22B1/284

Abstract: The present invention relates to a steam generator and a washing machine therewith. The present invention provides a steam generator including a water chamber for holding water actually, the water chamber having a heater mounted thereto for heating the water, and a steam chamber for holding steam generated as the water is heated actually, wherein the water chamber has a vertical direction length (a vertical length) relatively greater than a horizontal direction length (a horizontal length).

Abstract translation: 本发明涉及一种蒸汽发生器及其洗衣机。 本发明提供了一种蒸汽发生器，其特征在于，具有实际保持水的水室，所述水室具有安装在其上的用于加热水的加热器，以及蒸汽室，用于保持水被实际加热时产生的蒸汽，其中，所述水室具有 相对大于水平方向长度（水平长度）的垂直方向长度（垂直长度）。

公开(公告)号：US08564141B2

公开(公告)日：2013-10-22

申请号：US13038831

申请日：2011-03-02

Applicant: Kyu Won Lee ,  Cheol Ho Joh ,  Eun Hye Do ,  Ji Eun Kim ,  Hee Min Shin

Inventor： Kyu Won Lee ,  Cheol Ho Joh ,  Eun Hye Do ,  Ji Eun Kim ,  Hee Min Shin

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L23/3121 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other.

Abstract translation: 芯片单元包括：第一半导体芯片和第二半导体芯片，其布置成使得其用于形成第一焊盘和第二焊盘的表面彼此面对; 第一和第二连接构件，设置在第一和第二半导体芯片的表面上，用于形成第一和第二接合焊盘，并且具有一端与第一和第二接合焊盘连接的再分配线，另一端突出超过 第一和第二半导体芯片和薄膜; 插入在所述第一连接构件和所述第二连接构件之间的粘合构件; 并且通过图案通过粘合构件并将第一和第二连接构件的再分配线的突出部彼此连接。

公开(公告)号：US08109119B2

公开(公告)日：2012-02-07

申请号：US11819482

申请日：2007-06-27

Applicant: In Geun Ahn ,  Kyu Won Lee ,  Seong Il Moon

Inventor： In Geun Ahn ,  Kyu Won Lee ,  Seong Il Moon

IPC: D06F37/00 ,  F22B1/28

CPC classification number: F22B37/78 ,  D06F39/008 ,  F22B1/284

Abstract: A steam generating device and a washing machine having the same are disclosed. The steam generating device includes a lower housing, which contains water, in which a heater is arranged, and which has a vertical length longer than a horizontal length, an upper housing including a steam chamber for containing steam generated as the water is heated, a water level sensor for sensing a water level of the water chamber, and a receptacle for covering the water level sensor, the receptacle including an opening for allowing water to be introduced into the receptacle. In accordance with this configuration, it is possible to easily install the steam generating device, to achieve a superior performance, to prevent the water level sensor from malfunctioning, and to prevent spots from being formed on laundry.

Abstract translation: 公开了一种蒸汽发生装置和具有该蒸汽发生装置的洗衣机。 蒸汽发生装置包括下壳体，其包含水，其中布置有加热器，并且具有比水平长度更长的垂直长度;上壳体，包括用于容纳加热时产生的蒸汽的蒸汽室， 用于感测水室的水位的水位传感器和用于覆盖水位传感器的容器，该容器包括用于允许水引入容器的开口。 根据该结构，能够容易地安装蒸汽发生装置，以达到优异的性能，防止水位传感器发生故障，并且防止在衣物上形成斑点。

公开(公告)号：US08109120B2

公开(公告)日：2012-02-07

申请号：US11819320

申请日：2007-06-26

Applicant: In Geun Ahn ,  Kyu Won Lee ,  Seong Il Moon

Inventor： In Geun Ahn ,  Kyu Won Lee ,  Seong Il Moon

IPC: D06F39/04

CPC classification number: F22B1/284 ,  D06F39/008

Abstract: A steam generating device and a washing machine having the same are disclosed. The steam generating device includes a lower housing including a main portion for receiving a heater, and connecting portions extending outwardly from the main portion, the lower housing defining a water chamber for containing water, an upper housing connected to the connecting portions, the upper housing defining a steam chamber for containing steam, a water level sensor for sensing a level of water contained in the water chamber, and a receptacle for protecting the water level sensor. The receptacle has an opening for allowing water to be introduced into the receptacle, and is substantially aligned with an inner surface of the lower housing or is arranged at a position spaced apart from the heater by a longer distance than the inner surface of the lower housing.

Abstract translation: 公开了一种蒸汽发生装置和具有该蒸汽发生装置的洗衣机。 蒸汽发生装置包括：下壳体，其包括用于接收加热器的主体部分和从主要部分向外延伸的连接部分，下壳体限定用于容纳水的水室，连接到连接部分的上壳体， 限定用于容纳蒸汽的蒸汽室，用于感测水室中容纳的水位的水位传感器和用于保护水位传感器的容器。 容器具有用于允许水引入到容器中的开口，并且基本上与下壳体的内表面对准或者布置在与加热器间隔开比距下壳体的内表面更长的距离 。

公开(公告)号：US20110272820A1

公开(公告)日：2011-11-10

申请号：US13096143

申请日：2011-04-28

Applicant: Kyu Won LEE ,  Cheol Ho JOH ,  Eun-Hye DO ,  Ji Eun KIM ,  Hee Min SHIN

Inventor： Kyu Won LEE ,  Cheol Ho JOH ,  Eun-Hye DO ,  Ji Eun KIM ,  Hee Min SHIN

IPC: H01L23/48 ,  H01L21/82

CPC classification number: H01L23/481 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/1076 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.

Abstract translation: 堆叠半导体封装包括半导体封装模块，其包括多个半导体封装，每个半导体封装具有第一表面，背离第一表面的第二表面，连接第一表面和第二表面的侧表面和形成在第一表面上的通孔 侧表面通过第一表面和第二表面并且堆叠成使得它们的通孔彼此垂直连接;以及粘合构件，其形成在半导体封装之间并将半导体封装彼此附接，主基板 支撑半导体封装模块，并在其面向半导体封装模块的第三表面上形成与通孔对准的主连接焊盘，以及形成在通孔中的导电连接构件，并将半导体封装与 主连接垫

公开(公告)号：US07954344B2

公开(公告)日：2011-06-07

申请号：US11657726

申请日：2007-01-25

Applicant: Jae Mun Kim ,  Jong Deuk Bae ,  Heung Gi Kim ,  Ki Chul Woo ,  In Geun Ahn ,  Kyeong Hwan Kim ,  Kyung Chul Woo ,  Kyu Won Lee ,  Young Soo Kim ,  Ji Maeng Kim

Inventor： Jae Mun Kim ,  Jong Deuk Bae ,  Heung Gi Kim ,  Ki Chul Woo ,  In Geun Ahn ,  Kyeong Hwan Kim ,  Kyung Chul Woo ,  Kyu Won Lee ,  Young Soo Kim ,  Ji Maeng Kim

IPC: D06F39/04

CPC classification number: D06F39/008 ,  F22B1/284

Abstract: A steam generator includes a water chamber for holding water, the water chamber having a heater mounted thereto for heating the water, a steam chamber for holding steam generated as the water is heated, a water supply line for supplying the water to the water chamber, and a steam discharge line for discharging steam from the steam chamber, wherein the water chamber has a vertical direction length relatively greater than a horizontal direction length and the steam chamber has a horizontal direction length relatively greater than the horizontal length of the water chamber. A dryer or washing machine may include the steam generator described herein.

Abstract translation: 蒸汽发生器包括用于保持水的水室，水室具有安装在其上的用于加热水的加热器，用于保持加热时产生的蒸汽的蒸汽室，用于将水供应到水室的供水管线， 以及用于从所述蒸汽室排出蒸汽的蒸汽排放管线，其中所述水室具有相对大于水平方向长度的垂直方向长度，并且所述蒸汽室具有相对大于所述水室的水平长度的水平方向长度。 干衣机或洗衣机可以包括本文所述的蒸汽发生器。