公开(公告)号：US20160229684A1

公开(公告)日：2016-08-11

申请号：US15024704

申请日：2014-09-23

Applicant: MOTION ENGINE INC.

Inventor： Robert Mark Boysel

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0078 ,  B81B7/0058 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0163 ,  B81B2207/092 ,  B81C1/00269 ,  B81C2201/013 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/125

Abstract: A micro-electro-mechanical system (MEMS) device and a manufacturing method are provided. The device includes top and bottom cap wafers and a MEMS wafer disposed between the top cap wafer and the bottom cap wafer. The top, bottom and MEMS wafers define sidewalls of a cavity. A MEMS structure is housed within the cavity and is movable relative to the top and bottom caps. At least one electrode is provided in one of the wafers, the electrode being operatively coupled to the MEMS structure to detect or induce a movement thereof. A support structure extends through the cavity from the top cap wafer to the bottom cap wafer to prevent bowing in the top cap and bottom cap wafers.

Abstract translation: 提供了一种微电子机械系统（MEMS）装置和制造方法。 该装置包括顶盖和底盖晶片以及设置在顶盖晶片和底盖晶片之间的MEMS晶片。 顶部，底部和MEMS晶片限定空腔的侧壁。 MEMS结构容纳在腔内并且可相对于顶盖和底盖移动。 在一个晶片中提供至少一个电极，电极可操作地耦合到MEMS结构以检测或引起其移动。 支撑结构通过空腔从顶盖晶片延伸到底盖晶片，以防止在顶盖和底盖晶片中弯曲。

公开(公告)号：US11852481B2

公开(公告)日：2023-12-26

申请号：US14622548

申请日：2015-02-13

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01C19/5712 ,  G01C19/5755 ,  G01C19/5769

CPC classification number: G01C19/5712 ,  G01C19/5755 ,  G01C19/5769

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

公开(公告)号：US11287486B2

公开(公告)日：2022-03-29

申请号：US15534702

申请日：2015-12-02

Applicant: MOTION ENGINE INC.

Inventor： Robert Mark Boysel

IPC: G01R33/26 ,  G01R33/028 ,  G01R33/02

Abstract: A micro-electro-mechanical system (MEMS) magnetometer is provided for measuring magnetic field components along three orthogonal axes. The MEMS magnetometer includes a top cap wafer, a bottom cap wafer and a MEMS wafer having opposed top and bottom sides bonded respectively to the top and bottom cap wafers. The MEMS wafer includes a frame structure and current-carrying first, second and third magnetic field transducers. The top cap, bottom cap and MEMS wafer are electrically conductive and stacked along the third axis. The top cap wafer, bottom cap wafer and frame structure together form one or more cavities enclosing the magnetic field transducers. The MEMS magnetometer further includes first, second and third electrode assemblies, the first and second electrode assemblies being formed in the top and/or bottom cap wafers. Each electrode assembly is configured to sense an output of a respective magnetic field transducer induced by a respective magnetic field component.