公开(公告)号：US5858809A

公开(公告)日：1999-01-12

申请号：US820316

申请日：1997-03-18

Applicant: Kevin Hin-Leung Chau ,  Roger T. Howe ,  Richard S. Payne ,  Yang Zhao ,  Theresa A. Core ,  Steven J. Sherman

Inventor： Kevin Hin-Leung Chau ,  Roger T. Howe ,  Richard S. Payne ,  Yang Zhao ,  Theresa A. Core ,  Steven J. Sherman

IPC: G01P15/08 ,  G01P15/125 ,  H01L21/465

CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P2015/0814

Abstract: A method and apparatus for providing a conductive plane beneath a suspended microstructure. A conductive region is diffused into a substrate. A dielectric layer is added, covering the substrate, and then removed from a portion of the conductive region. A spacer layer is deposited over the dielectric and exposed conductive region. A polysilicon layer is deposited over the spacer layer, and formed into the shape of the suspended microstructure. After removal of the spacer layer, the suspended microstructure is left free to move above an exposed conductive plane. The conductive plane is driven to the same potential as the microstructure.

Abstract translation: 一种用于在悬浮微结构下方提供导电平面的方法和装置。 导电区域扩散到衬底中。 添加介电层，覆盖基板，然后从导电区域的一部分去除。 间隔层沉积在电介质和暴露的导电区域上。 多晶硅层沉积在间隔层上，并形成悬浮微结构的形状。 在去除间隔层之后，使悬浮的微结构自由地在暴露的导电平面上移动。 导电平面被驱动到与微结构相同的电位。

公开(公告)号：US5542295A

公开(公告)日：1996-08-06

申请号：US348377

申请日：1994-12-01

Applicant: Roger T. Howe ,  H. Jerome Barber ,  Michael Judy

Inventor： Roger T. Howe ,  H. Jerome Barber ,  Michael Judy

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/125

CPC classification number: B81B3/0008 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  Y10S73/01

Abstract: An electro-mechanical micromachined structure uses bumpers to prevent contact between structures at different potentials. A beam is connected to one or more anchors by flexible suspensions, which permit the beam to move along a predetermined axis relative to one or more plates. The suspension includes at least one bumper positioned so that the bumper will contact another part of the suspension before the beam contacts the plates. The bumper is made from the same material as the suspension, during the same processing step. The bumper is positioned to take advantage of shrinkage or expansion of the beam during processing which forces the bumper closer to its contact point then would otherwise be possible.

Abstract translation: 机电微加工结构使用缓冲器来防止在不同电位下的结构之间的接触。 梁通过柔性悬架连接到一个或多个锚固件，这允许梁相对于一个或多个板沿预定轴线移动。 悬架包括至少一个保险杠，其被定位成使得保险杠在梁接触板之前将接触悬架的另一部分。 在相同的加工步骤中，保险杠由与悬架相同的材料制成。 保险杠被定位成利用在加工过程中梁的收缩或膨胀，这迫使保险杠更靠近其接触点，否则将是可能的。

公开(公告)号：US4943750A

公开(公告)日：1990-07-24

申请号：US376208

申请日：1989-07-03

Applicant: Roger T. Howe ,  Jeffrey H. Lang ,  Martin F. Schlecht ,  Martin A. Schmidt ,  Stephen D. Senturia

Inventor： Roger T. Howe ,  Jeffrey H. Lang ,  Martin F. Schlecht ,  Martin A. Schmidt ,  Stephen D. Senturia

IPC: H02N1/00

CPC classification number: H02N1/004

Abstract: An electrostatically driven microactuator is micromachined in a monolithic process. Sacrificial layers are placed between a moving element and stator structural layers. Removal of the sacrificial layers leaves a free standing moving element and micron wide air gaps within a stator. An electric field of about 100 Mv/m and higher is supported across the micron wide gap without breakdown and enables high energy torque densities to be produced between the stator and the moving element. One electrostatic drive scheme involves a series of stator electrodes attached to the stator and a series of electrodes attached to the moving element charged in sequence to attract each other in a direction of movement and to oppose each other in a direction normal to movement. A bearing is aligned with the moving element with the stator during the layering of a sacrificial layer over an edge of the moving element structural layer. The bearing and stator laterally stabilize the moving element. Vertical stability is through aerodynamic shaping of the moving element, electronic circuits, or bushings. Applications of the microactuator include a linearly sliding shutter, an optical modulator, a gyroscope and an air pump.

Abstract translation: 静电驱动微致动器在单片工艺中被微加工。 牺牲层被放置在移动元件和定子结构层之间。 牺牲层的移除在定子内留​​下自由站立的移动元件和微米宽的气隙。 大约100Mv / m以上的电场被支撑在微米宽的间隙上而不会发生故障，并且能够在定子和移动元件之间产生高能量的转矩密度。 一个静电驱动方案涉及一系列连接到定子的定子电极和一系列连接到移动元件上的电极，该电极按顺序充电以在运动方向上彼此吸引并且在垂直于运动的方向上彼此相对。 在牺牲层在移动元件结构层的边缘上层叠期间，轴承与具有定子的移动元件对齐。 轴承和定子横向稳定移动元件。 垂直稳定性是通过移动元件，电子电路或衬套的空气动力学成形。 微致动器的应用包括线性滑动快门，光学调制器，陀螺仪和空气泵。

公开(公告)号：US4896098A

公开(公告)日：1990-01-23

申请号：US273106

申请日：1988-11-16

Applicant: Joseph H. Haritonidis ,  Roger T. Howe ,  Martin A. Schmidt ,  Stephen D. Senturia

Inventor： Joseph H. Haritonidis ,  Roger T. Howe ,  Martin A. Schmidt ,  Stephen D. Senturia

IPC: G01N13/00

CPC classification number: G01N13/00

Abstract: A microbridge is used for the accurate measuring of time varying shear forces in the presence of fluctuating pressure. A microdimensioned plate is suspended by arms to form a microbridge. The microdimensions enable the smallest turbulence scales of interest to be sensed uniformally throughout the entire surface of the plate. The cavity beneath the microbridge is so small that a viscous drag is created in the air within the cavity and dampens normal movement of the plate. The microdimensions in conjunction with the damping effect of the cavity enable the sensor to be substantially insensitive to pressure and thus sense lateral forces independent of normal forces. The microbridge sensor is fabricated by surface micromachining. A sacrificial layer is deposited over a substrate. A structural layer is deposited and patterned to form the plate and support arms over the sacrificial layer. The cavity is formed by a selective etchant removing the sacrificial layer and leaving the rest of the microbridge structure suspended above the substrate. In a differential capacitance readout scheme, a conducting layer in the plate of the microbridge is capacitively coupled with conductors in the substrate. A sensed change in capacitive coupling generates an indication of plate deflection and thereby shear stress independent of vertical movement. Optic readout schemes may also be employed and are readily incorporated in the fabrication process. A mounting member presses the microbridge sensor into a holding plate which fits in a matching slot flush with the target wall.

Abstract translation: 在存在波动压力的情况下，使用微桥来精确测量时变剪切力。 通过臂悬挂微尺寸板以形成微桥。 微尺寸使得能够在板的整个表面均匀地感测到感兴趣的最小湍流尺度。 微桥下面的空腔很小，使得在空腔内的空气中产生粘性阻力并阻尼板的正常运动。 结合腔的阻尼效应的微尺寸使得传感器对压力基本上不敏感，并因此感测与法向力无关的侧向力。 微桥传感器通过表面微加工制造。 牺牲层沉积在衬底上。 沉积并图案化结构层以在牺牲层上形成板和支撑臂。 通过选择性蚀刻剂除去该牺牲层并使悬浮在衬底上方的微桥结构的其余部分形成空腔。 在差分电容读出方案中，微桥板中的导电层与衬底中的导体电容耦合。 感测到的电容耦合变化产生板偏转的指示，从而产生与垂直运动无关的剪切应力。 也可以采用光学读出方案，并且容易地结合在制造过程中。 安装构件将微桥传感器压入保持板，该保持板适合与目标壁齐平的匹配槽。

公开(公告)号：US4805456A

公开(公告)日：1989-02-21

申请号：US52026

申请日：1987-05-19

Applicant: Roger T. Howe ,  Shih-Chia Chang

Inventor： Roger T. Howe ,  Shih-Chia Chang

IPC: G01P15/097 ,  G01P15/10 ,  G01P15/18

CPC classification number: G01P15/18 ,  G01P15/097 ,  G01P2015/084 ,  Y10S73/01

Abstract: An accelerometer is provided by a sample mass suspended in a central area of a support by pairs of resonating arms. One pair of arms lies on one axis through the sample mass. Another pair of arms lies on a second axis through the sample mass perpendicular to the one axis. Acceleration of the mass and support is detected by a measured change in resonant frequency of the arms of a pair. The measured change in resonant frequency is the magnitude of the acceleration and the axis along which the pair of arms lies provides the direction of the acceleration. Orthogonal components of acceleration are simultaneously measured by the pairs of arms lying on perpendicular axes. Electrostatic force-rebalance techniques and other known techniques for measuring acceleration in a direction perpendicular to the axes of the pairs of arms are readily incorporated to provide a third direction measurement of acceleration. The accelerometer is fabricated in a monolithic process which employs micromachining techniques.

Abstract translation: 加速度计由悬挂在支撑体的中心区域中的一对样品质量块组成，由一对谐振臂提供。 一对臂位于通过样品块的一个轴上。 另一对臂位于垂直于一个轴的样品质量的第二轴上。 通过测量一对臂的谐振频率的变化来检测质量和支撑的加速度。 谐振频率的测量变化是加速度的大小，一对臂所在的轴提供加速度的方向。 通过位于垂直轴上的成对的臂同时测量加速度的正交分量。 用于测量垂直于成对的轴的方向的加速度的静电 - 重新平衡技术和其它已知的技术很容易结合，以提供加速度的第三方向测量。 加速度计采用微加工技术制成的单片工艺。

公开(公告)号：US08633573B2

公开(公告)日：2014-01-21

申请号：US12706112

申请日：2010-02-16

Applicant: Jinendra Raja Jain ,  Roger T. Howe

Inventor： Jinendra Raja Jain ,  Roger T. Howe

IPC: H01L29/06

CPC classification number: H01L31/105 ,  H01L33/34

Abstract: Various applications are directed to a material stack having a strained active material therein. In connection with an embodiment, an active material (e.g. a semiconductor material) is at least initially and partially released from and suspended over a substrate, strained, and held in place. The release and suspension facilitates the application of strain to the semiconductor material.

Abstract translation: 各种应用涉及其中具有应变活性材料的材料堆叠。 结合一个实施例，活性材料（例如半导体材料）至少首先和部分地从衬底上释放并悬浮在衬底上，应变并保持就位。 释放和悬浮有助于将应变应用于半导体材料。

公开(公告)号：US08273594B2

公开(公告)日：2012-09-25

申请号：US13017767

申请日：2011-01-31

Applicant: Emmanuel P. Quevy ,  Pezhman Monadgemi ,  Roger T. Howe

Inventor： Emmanuel P. Quevy ,  Pezhman Monadgemi ,  Roger T. Howe

IPC: H01L21/00

CPC classification number: B81C1/00293 ,  B81B7/02 ,  B81C1/00246 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0721 ,  B81C2203/0735 ,  B81C2203/0771

Abstract: Low temperature, multi-layered, planar microshells for encapsulation of devices such as MEMS and microelectronics. The microshells include a planar perforated pre-sealing layer, below which a non-planar sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. In an embodiment, the pre-sealing layer has perforations formed with a damascene process to be self-aligned to the chamber below the microshell. The sealing layer may include a nonhermetic layer to physically occlude the perforation and a hermetic layer over the nonhermetic occluding layer to seal the perforation. In a particular embodiment, the hermetic layer is a metal which is electrically coupled to a conductive layer adjacent to the microshell to electrically ground the microshell.

公开(公告)号：US20110121416A1

公开(公告)日：2011-05-26

申请号：US13017892

申请日：2011-01-31

Applicant: Emmanuel P. Quevy ,  Pezhman Monadgemi ,  Roger T. Howe

Inventor： Emmanuel P. Quevy ,  Pezhman Monadgemi ,  Roger T. Howe

IPC: H01L29/84 ,  H01L21/04

CPC classification number: B81C1/00293 ,  B81B7/02 ,  B81C1/00246 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0721 ,  B81C2203/0735 ,  B81C2203/0771

Abstract: Low temperature, multi-layered, planar microshells for encapsulation of devices such as MEMS and microelectronics. The microshells include a planar perforated pre-sealing layer, below which a non-planar sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. In an embodiment, the pre-sealing layer has perforations formed with a damascene process to be self-aligned to the chamber below the microshell. The sealing layer may include a nonhermetic layer to physically occlude the perforation and a hermetic layer over the nonhermetic occluding layer to seal the perforation. In a particular embodiment, the hermetic layer is a metal which is electrically coupled to a conductive layer adjacent to the microshell to electrically ground the microshell.

Abstract translation: 用于MEMS和微电子等器件封装的低温多层平面微型壳体。 微壳包括平面穿孔的预密封层，在其下面接近非平面牺牲层，以及密封层，用于在去除牺牲材料之后封闭预密封层中的穿孔。 在一个实施例中，预密封层具有形成有镶嵌工艺的穿孔，以与微壳下方的腔室自对准。 密封层可以包括非密封层，以物理地封闭穿孔，并且在非密封闭塞层上方具有密封层以密封穿孔。 在特定实施例中，密封层是金属，其电耦合到与微壳相邻的导电层，以电微接地微壳。

公开(公告)号：US20110121415A1

公开(公告)日：2011-05-26

申请号：US13017767

申请日：2011-01-31

Applicant: Emmanuel P. Quevy ,  Pezhman Monadgemi ,  Roger T. Howe

Inventor： Emmanuel P. Quevy ,  Pezhman Monadgemi ,  Roger T. Howe

IPC: H01L29/84 ,  H01L21/04

CPC classification number: B81C1/00293 ,  B81B7/02 ,  B81C1/00246 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0721 ,  B81C2203/0735 ,  B81C2203/0771

Abstract: Low temperature, multi-layered, planar microshells for encapsulation of devices such as MEMS and microelectronics. The microshells include a planar perforated pre-sealing layer, below which a non-planar sacrificial layer is accessed, and a sealing layer to close the perforation in the pre-sealing layer after the sacrificial material is removed. In an embodiment, the pre-sealing layer has perforations formed with a damascene process to be self-aligned to the chamber below the microshell. The sealing layer may include a nonhermetic layer to physically occlude the perforation and a hermetic layer over the nonhermetic occluding layer to seal the perforation. In a particular embodiment, the hermetic layer is a metal which is electrically coupled to a conductive layer adjacent to the microshell to electrically ground the microshell.

公开(公告)号：US20110068422A1

公开(公告)日：2011-03-24

申请号：US12927312

申请日：2010-11-10

Applicant: Emmanuel P. Quevy ,  Roger T. Howe

Inventor： Emmanuel P. Quevy ,  Roger T. Howe

IPC: H01L29/66

CPC classification number: B81C1/00039 ,  B81B2201/0271

Abstract: A MEMS coupler and a method to form a MEMS structure having such a coupler are described. In an embodiment, a MEMS structure comprises a member and a substrate. A coupler extends through a portion of the member and connects the member with the substrate. The member is comprised of a first material and the coupler is comprised of a second material. In one embodiment, the first and second materials are substantially the same. In one embodiment, the second material is conductive and is different than the first material. In another embodiment, a method for fabricating a MEMS structure comprises first forming a member above a substrate. A coupler comprised of a conductive material is then formed to connect the member with the substrate.

Abstract translation: 描述了MEMS耦合器和形成具有这种耦合器的MEMS结构的方法。 在一个实施例中，MEMS结构包括构件和衬底。 耦合器延伸穿过构件的一部分并将构件与衬底连接。 该构件由第一材料构成，并且该耦合器由第二材料构成。 在一个实施例中，第一和第二材料基本相同。 在一个实施例中，第二材料是导电的并且不同于第一材料。 在另一个实施例中，一种用于制造MEMS结构的方法包括首先在衬底上形成构件。 然后形成由导电材料构成的耦合器，以将该构件与衬底连接。