公开(公告)号：US20170371092A1

公开(公告)日：2017-12-28

申请号：US15672684

申请日：2017-08-09

Applicant: TactoTek Oy

Inventor： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC: F21V8/00

CPC classification number: G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

Abstract: A method for manufacturing an electronic product, including obtaining a flexible, optically substantially transparent or translucent, substrate sheet, printing, by an additive printed electronics process, a plurality of electrical conductors on the substrate sheet, printing or disposing, a plurality of electronic components including optoelectronic light emissive components on the substrate sheet, at least some of the printed conductors being configured to provide electrical current thereto, providing at least one graphic on the substrate sheet, the at least one graphic configured to enable outcoupling of light, and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate sheet to establish a multi-layer structure, the light emitted by the light emissive components being received by the lightguide sheet, propagating therewithin, and then being at least partly emitted to the environment through the at least one graphic.

公开(公告)号：US09297675B2

公开(公告)日：2016-03-29

申请号：US14046425

申请日：2013-10-04

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Mikko Heikkinen

IPC: G01D11/28

CPC classification number: G01D11/28 ,  F21K9/60 ,  F21V23/04 ,  H01H13/83 ,  H01H2219/028 ,  H01H2219/039 ,  H01H2219/056 ,  H01H2219/06

Abstract: A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

Abstract translation: 用于电子设备的复合层压组件为由组件限定的一个或多个指示器形状提供集成背光。 组件包括基本上不透明的盖构件，以遮蔽电子设备的至少一部分。 盖构件中的半透明指示器结构限定相应的指示器形状，以允许背光通过盖构件。 光学导电材料的光学基质层被附着到盖构件的内表面，其中多个照明装置嵌入在光学矩阵层中并且横向偏离相关联的指示器结构。 多个照明装置可以连接到承载在盖构件的内表面上的电路。

公开(公告)号：US20250048813A1

公开(公告)日：2025-02-06

申请号：US18922834

申请日：2024-10-22

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design including at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector

公开(公告)号：US12130005B2

公开(公告)日：2024-10-29

申请号：US18339427

申请日：2023-06-22

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Sami Torvinen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC: F21V7/28 ,  F21V7/00 ,  H05K1/02 ,  H05K1/18 ,  F21V7/10 ,  F21V8/00

CPC classification number: F21V7/00

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US11910530B2

公开(公告)日：2024-02-20

申请号：US17704264

申请日：2022-03-25

Applicant: TactoTek Oy

Inventor： Vinski Bräysy ,  Ilpo Hänninen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Topi Wuori ,  Mikko Sippari ,  Heikki Alamäki

IPC: H05K3/32 ,  H05K1/18 ,  H05K1/11 ,  H05K3/12 ,  H05K3/30

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/12 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0129

Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

公开(公告)号：US20230309242A1

公开(公告)日：2023-09-28

申请号：US18191427

申请日：2023-03-28

Applicant: TactoTek Oy

Inventor： Tomi SIMULA ,  Tapio RAUTIO

IPC: H05K3/28 ,  H05K3/00 ,  H05K1/03 ,  H05K1/11 ,  H05K3/12

CPC classification number: H05K3/284 ,  H05K3/0067 ,  H05K1/0393 ,  H05K1/111 ,  H05K3/1283 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

公开(公告)号：US20230309231A1

公开(公告)日：2023-09-28

申请号：US17704264

申请日：2022-03-25

Applicant: TactoTek Oy

Inventor： Vinski BRÄYSY ,  Ilpo HÄNNINEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Topi WUORI ,  Mikko SIPPARI ,  Heikki ALAMÄKI

IPC: H05K1/18 ,  H05K3/12 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K3/12 ,  H05K1/111 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/0129

Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

公开(公告)号：US20220171121A1

公开(公告)日：2022-06-02

申请号：US17674894

申请日：2022-02-18

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Mikko HEIKKINEN

IPC: F21V8/00

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US10960641B2

公开(公告)日：2021-03-30

申请号：US17061934

申请日：2020-10-02

Applicant: TactoTek Oy

Inventor： Vinski Bräysy ,  Anne Isohätälä ,  Jarmo Sääski ,  Tomi Simula

IPC: B32B1/00 ,  B32B3/00 ,  B32B3/30 ,  B32B27/08 ,  G06F3/044 ,  B29L31/34 ,  B29C45/16

Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

公开(公告)号：US10946612B2

公开(公告)日：2021-03-16

申请号：US16113335

申请日：2018-08-27

Applicant: TactoTek Oy

Inventor： Vinski Bräysy ,  Anne Isohätälä ,  Jarmo Sääski ,  Tomi Simula

IPC: G06F3/045 ,  B32B3/30 ,  B32B27/08 ,  G06F3/044 ,  B29C45/16 ,  B29L31/34

Abstract: An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.