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公开(公告)号：US12130005B2
公开(公告)日：2024-10-29
申请号：US18339427
申请日：2023-06-22
Applicant: TactoTek Oy
Inventor： Antti Keränen , Sami Torvinen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: F21V7/00
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
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公开(公告)号：US11817534B1
公开(公告)日：2023-11-14
申请号：US17856958
申请日：2022-07-02
Applicant: TactoTek Oy
Inventor： Antti Keränen , Sami Torvinen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
IPC: H01L33/60 , H01L33/62 , H01L25/075 , H01L33/00
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/005 , H01L33/62 , H01L2933/0058 , H01L2933/0066
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
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公开(公告)号：US11906774B2
公开(公告)日：2024-02-20
申请号：US18326110
申请日：2023-05-31
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: G02B6/0031 , G02B6/004 , G02B6/0021 , G02B6/0036 , G02B6/0041 , G02B6/0043 , G02B6/0051 , G02B6/0055 , G02B6/0061 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G02B6/0083 , G02B5/0883
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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公开(公告)号：US11500142B1
公开(公告)日：2022-11-15
申请号：US17856959
申请日：2022-07-02
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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公开(公告)号：US12052829B2
公开(公告)日：2024-07-30
申请号：US18191427
申请日：2023-03-28
Applicant: TactoTek Oy
Inventor： Tomi Simula , Tapio Rautio
IPC: H05K1/02 , H01L23/24 , H01L23/36 , H01L23/492 , H01L23/58 , H05K1/03 , H05K1/11 , H05K3/00 , H05K3/12 , H05K3/28
CPC classification number: H05K3/284 , H05K1/0393 , H05K1/111 , H05K3/0067 , H05K3/1283 , H05K2203/1316 , H05K2203/1322
Abstract: The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.
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Patent Agency Ranking
公开(公告)号：US11914184B2
公开(公告)日：2024-02-27
申请号：US18339467
申请日：2023-06-22
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: G02B6/0031 , G02B6/004 , G02B6/0021 , G02B6/0036 , G02B6/0041 , G02B6/0043 , G02B6/0051 , G02B6/0055 , G02B6/0061 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G02B6/0083 , G02B5/0883
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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公开(公告)号：US11729915B1
公开(公告)日：2023-08-15
申请号：US17700657
申请日：2022-03-22
Applicant: TactoTek Oy
Inventor： Tomi Simula , Tapio Rautio
IPC: H05K1/02 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/22 , H05K3/28 , H05K3/34 , H05K3/46 , H01L21/00 , H01L21/02 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/56 , H01L21/60 , H01L21/66 , H01L21/78 , H01L21/673 , H01L23/00 , H01L23/02 , H01L23/04 , H01L23/28 , H01L23/48 , H01L23/49 , H01L23/52 , H01L23/488 , H01L23/495 , H01L23/498 , H01L23/552 , H05K1/03 , H05K1/11 , H05K3/12
CPC classification number: H05K3/284 , H05K1/0393 , H05K1/111 , H05K3/0067 , H05K3/1283 , H05K2203/1316 , H05K2203/1322
Abstract: The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.
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公开(公告)号：US12159965B2
公开(公告)日：2024-12-03
申请号：US18476676
申请日：2023-09-28
Applicant: TactoTek Oy
Inventor： Antti Keränen , Sami Torvinen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
IPC: H01L33/60 , H01L25/075 , H01L33/00 , H01L33/46 , H01L33/62
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
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公开(公告)号：US11703627B1
公开(公告)日：2023-07-18
申请号：US17945247
申请日：2022-09-15
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: G02B6/0031 , G02B6/004 , G02B6/0021 , G02B6/0036 , G02B6/0041 , G02B6/0043 , G02B6/0051 , G02B6/0055 , G02B6/0061 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G02B6/0083 , G02B5/0883
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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公开(公告)号：US11528802B2
公开(公告)日：2022-12-13
申请号：US16724631
申请日：2019-12-23
Applicant: TACTOTEK OY
Inventor： Tapio Rautio , Tomi Simula , Minna Pirkonen , Jarkko Torvinen , Tuukka Junkkari , Janne Asikkala , Hasse Sinivaara
IPC: H05K1/02
Abstract: A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.
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