Abstract:
The present invention provides a method and a system for image identification and identification result output, which determines a location coordinate with respect to an image and a rotating angle based on at least one direction of the image according to features of the image. The image is compared to a plurality of sample images stored in a database according to the rotating angle so as to obtain at least one identification result. By means of the method and the system of the present invention, identification can be achieved with respect to various rotating angles and distances so as to improve the identification rate.
Abstract:
A driving system of a display panel and a driving method thereof are provided, in which the display panel includes a plurality of pixel units, and the driving system includes a timing controller and a voltage generator. The timing controller is used for detecting data values of the pixel units, and calculating difference values between the data values of every two pixel units, in which the calculated pixel units are in successive rows. The timing controller obtains an aggregation value of absolute values of the difference values, and then provides a related control signal to the voltage generator according to whether the aggregation value reaches a threshold value. The voltage generator provides a common voltage or provides a compensation voltage to a common electrode according to content of the control signal.
Abstract:
The present invention relates to a tandem organic light emitting device, which reduces the driving voltage by using a non-doping material having both the electron transporting and hole transporting abilities to act, respectively, as an electron transporting layer and a hole transporting layer that are in contact with the connecting layer. The tandem organic light emitting device does not have to double its driving voltage as a result of the increasing of the number of the emitting element contained therein. However, the brightness and the current efficiency of the device of the present invention will be higher than the theoretical fold value calculated in accordance with the number of emitting element contained in the device.
Abstract:
An electrophoretic display apparatus and a method of manufacturing the same are provided. The electrophoretic display apparatus includes a driving substrate, an electrophoretic display panel disposed on the driving substrate, a controller disposed on the driving substrate, and a conductive element. The electrophoretic display panel comprises a peripheral region and a display region, and the display region is positioned between the controller and the peripheral region. The first conductive element is disposed in the peripheral region, and electrically connected the controller and the electrophoretic display panel.
Abstract:
A method for manufacturing three-terminal solar cell array is provided. In this method, only four major scribing or etching steps are needed to expose the three conductive layers of the three-terminal solar cell and isolate the individual solar cells.
Abstract:
An electrophoretic display apparatus and a method of manufacturing the same are provided. The electrophoretic display apparatus includes a driving substrate, an electrophoretic display panel disposed on the driving substrate, a controller disposed on the driving substrate, and a conductive element. The electrophoretic display panel comprises a peripheral region and a display region, and the display region is positioned between the controller and the peripheral region. The first conductive element is disposed in the peripheral region, and electrically connected the controller and the electrophoretic display panel.
Abstract:
An integrated circuit includes a substrate having a bonding pad region and a non-bonding pad region. A relatively large via, called a “big via,” is formed on the substrate in the bonding region. The big via has a first dimension in a top view toward the substrate. The integrated circuit also includes a plurality of vias formed on the substrate in the non-bonding region. The plurality of vias each have a second dimension in the top view, the second dimension being substantially less than the first dimension.
Abstract:
A method for forming a gear, including the following steps: first obtaining a billet, then carrying out a backward extrusion process of the billet to form a forged billet with a blind hole by using a mold, and the forged billet has an appropriate axial length and an appropriate radial length. Then, a precise piercing process is carried out to remove the solid billet portion remained in the blind hole of the forged billet to form a through hole. Then, trimming of the through hole is carried out to form a high-precision inner hole, and positioning is carried out based on the high-precision inner hole to implement a pressing process of an outer tooth shape of the forged billet to form the gear.
Abstract:
The present invention provides a method and a system for image identification and identification result output, which determines a location coordinate with respect to an image and a rotating angle based on at least one direction of the image according to features of the image. The image is compared to a plurality of sample images stored in a database according to the rotating angle so as to obtain at least one identification result. By means of the method and the system of the present invention, identification can be achieved with respect to various rotating angles and distances so as to improve the identification rate.
Abstract:
A test structure to detect vertical leakage in a multi-layer flip chip pad stack or similar semiconductor device. The test structure is integrated into the semiconductor device when it is fabricated. A metal layer includes at least two portions that are electrically isolated from each other; one portion being disposed under a test pad, and another portion being disposed under a pad associated with a pad structure being tested. The metal layer in most cases is separated from a top metal layer directly underlying the pads by an inter-metal dielectric (IMD) layer. A metal layer portion underlying the pad to be tested forms a recess in which a conductive member is disposed without making electrical contact. The conductive line is electrically coupled to a test portion of the same or, alternately, of a different metal layer. The test structure may be implemented on multiple layers, with recesses portions underlying the same or different pads.