公开(公告)号：US07630685B2

公开(公告)日：2009-12-08

申请号：US12359690

申请日：2009-01-26

Applicant: Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

Inventor： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

IPC: H04B7/00 ,  H04B1/16

CPC classification number: H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

公开(公告)号：US20090179810A1

公开(公告)日：2009-07-16

申请号：US12401767

申请日：2009-03-11

Applicant: Noboru KATO ,  Yuya DOKAI ,  Nobuo IKEMOTO

Inventor： Noboru KATO ,  Yuya DOKAI ,  Nobuo IKEMOTO

IPC: H01Q13/24

CPC classification number: H04B5/0012 ,  G06K7/10178 ,  G06K19/04 ,  G06K19/07749

Abstract: An article having an electromagnetic coupling module attached thereto includes an electromagnetic coupling module and a PET bottle having the electromagnetic coupling module bonded thereto. The electromagnetic coupling module includes a wireless IC chip arranged to process transmission and reception signals and the feed circuit board having the wireless IC chip mounted thereon. The feed circuit board includes a feed circuit including a resonant circuit having a predetermined resonant frequency. The feed circuit performs characteristic impedance matching between the PET bottle and the wireless IC chip. The PET bottle functions as a radiator arranged to radiate a transmission signal supplied from the feed circuit using electromagnetic field coupling and to supply a received reception signal to the feed circuit using electromagnetic field coupling.

Abstract translation: 具有附接有电磁耦合模块的物品包括电磁耦合模块和具有与其结合的电磁耦合模块的PET瓶。 电磁耦合模块包括布置成处理发送和接收信号的无线IC芯片以及安装有无线IC芯片的馈电电路板。 馈电电路板包括具有预定谐振频率的谐振电路的馈电电路。 馈电电路执行PET瓶和无线IC芯片之间的特征阻抗匹配。 PET瓶用作散热器，其布置成使用电磁场耦合辐射从馈电电路提供的传输信号，并且使用电磁场耦合将接收到的接收信号提供给馈电电路。

公开(公告)号：US20090065594A1

公开(公告)日：2009-03-12

申请号：US12276444

申请日：2008-11-24

Applicant: Noboru Kato ,  Yuya Dokai ,  Satoshi Ishino

Inventor： Noboru Kato ,  Yuya Dokai ,  Satoshi Ishino

IPC: G06K19/077

CPC classification number: H01Q1/2208 ,  G06K19/07749 ,  G06K19/07756 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01F17/0006 ,  H01F38/14 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01Q1/2283 ,  H01Q1/242 ,  H01Q1/50 ,  H01Q7/00 ,  H01Q23/00 ,  H01Q25/02

Abstract: A wireless IC device includes a wireless IC chip, a feed circuit board having the wireless IC chip mounted thereon and including a feed circuit including inductance elements, and a radiation plate electromagnetically coupled to the inductance elements in the feed circuit. A high-permeability magnetic body made of a high-permeability magnetic material is provided in the feed circuit board and a portion of the inductance elements is provided in the high-permeability magnetic body.

Abstract translation: 无线IC器件包括无线IC芯片，其上安装有无线IC芯片的馈电电路板，并且包括具有电感元件的馈电电路，以及电磁耦合到馈电电路中的电感元件的辐射板。 由高磁导率磁性材料制成的高导磁率磁体设置在馈电电路板中，并且电感元件的一部分设置在高磁导率磁体中。

公开(公告)号：US08692718B2

公开(公告)日：2014-04-08

申请号：US13083626

申请日：2011-04-11

Applicant: Noboru Kato ,  Yuya Dokai

Inventor： Noboru Kato ,  Yuya Dokai

IPC: H01Q1/38

CPC classification number: H01Q9/045 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/40 ,  H01Q7/00

Abstract: An antenna and a wireless IC device that includes the antenna are provided for which the manufacturing process is simple and for which there is a low probability of a poor connection occurring between a feeder portion and a radiation electrode. An antenna includes a radiation electrode that is provided on a main surface of an insulator board, a ground electrode and/or a counter electrode that is arranged so as to oppose the radiation electrode, and a magnetic field electrode that is connected to the radiation electrode through a connection portion. The magnetic field electrode is defined by line-shaped electrodes and feeds a signal to the radiation electrode from a feeder portion defined by ends of the line-shaped electrodes through the magnetic field electrode.

Abstract translation: 提供了包括天线的天线和无线IC器件，其制造过程简单，并且在馈电部分和辐射电极之间出现差的连接的可能性很低。 天线包括设置在绝缘体板的主表面上的辐射电极，与辐射电极相对配置的接地电极和/或对电极，以及连接到辐射电极的磁场电极 通过连接部分。 磁场电极由线状电极限定，并且通过磁场电极从由线状电极的端部限定的馈电部分向辐射电极馈送信号。

公开(公告)号：US08676117B2

公开(公告)日：2014-03-18

申请号：US13567108

申请日：2012-08-06

Applicant: Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

Inventor： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

IPC: H04B5/00

CPC classification number: H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

公开(公告)号：US20130002513A1

公开(公告)日：2013-01-03

申请号：US13613021

申请日：2012-09-13

Applicant: Yuya DOKAI ,  Noboru KATO

Inventor： Yuya DOKAI ,  Noboru KATO

IPC: H01Q9/04

CPC classification number: H01Q1/2208 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/30

Abstract: An antenna and a wireless communication device which are suitable for an RFID system and in which radiation characteristics are prevented from being changed as a result of impedance adjustment are configured such that the antenna includes a first loop electrode that has an external shape of a regular polygon or circle and that includes a pair of open ends, feeding portions arranged inside the first loop electrode, a second loop electrode connected to the feeding portions, and a coupling electrode that couples the first loop electrode and the second loop electrode to each other. The wireless communication device is obtained by coupling the wireless communication element which processes a high-frequency signal to the feeding portions.

Abstract translation: 适用于RFID系统并且其中防止辐射特性作为阻抗调整的结果的天线和无线通信设备被配置为使得天线包括具有正多边形的外部形状的第一环形电极 或圆形，并且包括一对开口端，布置在第一环形电极内部的馈电部分，连接到馈电部分的第二环形电极，以及将第一环形电极和第二环形电极彼此耦合的耦合电极。 通过将处理高频信号的无线通信元件耦合到馈送部分来获得无线通信设备。

公开(公告)号：US20120292397A1

公开(公告)日：2012-11-22

申请号：US13567109

申请日：2012-08-06

Applicant: Yuya DOKAI ,  Noboru KATO ,  Satoshi ISHINO

Inventor： Yuya DOKAI ,  Noboru KATO ,  Satoshi ISHINO

IPC: G06K19/077

CPC classification number: H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

公开(公告)号：US20120217312A1

公开(公告)日：2012-08-30

申请号：US13468058

申请日：2012-05-10

Applicant: Nobuo IKEMOTO ,  Satoshi ISHINO ,  Yuya DOKAI ,  Noboru KATO ,  Takeshi KATAYA ,  Ikuhei KIMURA ,  Mikiko TANAKA

Inventor： Nobuo IKEMOTO ,  Satoshi ISHINO ,  Yuya DOKAI ,  Noboru KATO ,  Takeshi KATAYA ,  Ikuhei KIMURA ,  Mikiko TANAKA

IPC: G06K19/073

CPC classification number: H01Q1/243 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/28 ,  H03H7/38 ,  H03H2007/386 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/165 ,  H05K2201/10098 ,  H01L2924/00012

Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

Abstract translation: 小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线 处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。 馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。 馈电电极并且电磁耦合到辐射板并提供给印刷线路板。 无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

公开(公告)号：US20120056001A1

公开(公告)日：2012-03-08

申请号：US13295153

申请日：2011-11-14

Applicant: Yuya DOKAI ,  Noboru KATO ,  Ikuhei KIMURA

Inventor： Yuya DOKAI ,  Noboru KATO ,  Ikuhei KIMURA

IPC: G06K19/07

CPC classification number: G11B23/286 ,  G11B20/00086 ,  G11B20/00094 ,  G11B20/00173 ,  G11B20/0021 ,  G11B20/00253 ,  G11B20/00275 ,  G11B20/00492 ,  G11B20/00695 ,  G11B20/00876 ,  G11B23/30 ,  G11B2220/2537

Abstract: An optical disc includes an electromagnetic coupling module mounted therein. The electromagnetic coupling module includes a wireless IC chip and a feeder circuit substrate in which a feeder circuit including a resonant circuit having a predetermined resonant frequency is disposed. The electromagnetic coupling module is electromagnetically coupled to a reflective film defining a metal thin film of the optical disc, and the reflective film defines an antenna or radiation pattern of the electromagnetic coupling module.

Abstract translation: 光盘包括安装在其中的电磁耦合模块。 电磁耦合模块包括无线IC芯片和馈电电路基板，其中设置包括具有预定谐振频率的谐振电路的馈电电路。 电磁耦合模块电磁耦合到限定光盘的金属薄膜的反射膜，反射膜限定电磁耦合模块的天线或辐射图。

公开(公告)号：US20110278362A1

公开(公告)日：2011-11-17

申请号：US13099392

申请日：2011-05-03

Applicant: Yuya DOKAI ,  Nihei KAISHITA ,  Hiroshi NONOGAKI ,  Ryohei GOTO ,  Takahiro YAMAGUCHI ,  Kazuyuki IKEDA

Inventor： Yuya DOKAI ,  Nihei KAISHITA ,  Hiroshi NONOGAKI ,  Ryohei GOTO ,  Takahiro YAMAGUCHI ,  Kazuyuki IKEDA

IPC: G06K19/077

CPC classification number: H01Q1/2283 ,  G06K19/07749 ,  H01Q1/38

Abstract: A wireless IC device includes a dielectric body, a metal pattern that is provided on a surface of the dielectric body and that defines a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. A plurality of slits are provided on at least one surface of the dielectric body so as to provide flexibility for the dielectric body.

Abstract translation: 无线IC器件包括介电体，设置在电介质体的表面上并限定散热器的金属图案，以及耦合到金属图案的馈电部分的无线IC元件。 在电介质体的至少一个表面上设置多个狭缝，以提供电介质体的柔性。