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    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    22.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    发光二极管封装及其制造方法

    公开(公告)号：US20140061697A1

    公开(公告)日：2014-03-06

    申请号：US13912211

    申请日：2013-06-07

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

    IPC: H01L33/60 ,  H01L33/62

    CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00

    Abstract: An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided.

    Abstract translation: LED封装包括相邻的第一和第二电极，从第一和第二电极向侧面突出的第一和第二延伸电极，围绕第一和第二电极的模制体和LED管芯。 成型体形成位于第一和第二电极上方的反射杯，每个反射杯在其顶面限定一个接收腔，以容纳LED管芯。 第一和第二延伸电极从成形体的外周露出。 第一电极具有第一底面。 第二电极具有第二底面。 第一和第二电极的第一和第二底面从成形体的底面露出。 还提供了用于制造LED封装的方法。

    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES
    27.
    发明申请
    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES 审中-公开
    制造发光二极管封装的方法

    公开(公告)号：US20140308767A1

    公开(公告)日：2014-10-16

    申请号：US14221219

    申请日：2014-03-20

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

    IPC: H01L33/62

    CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2924/00

    Abstract: A method for manufacturing LED packages includes steps: providing a lead frame including many pairs of first and second electrodes and first and second tie bars respectively located at opposite ends of each pair of the electrodes, the first and second electrodes each including a main body and an extension electrode protruding outwardly from the main body; forming many molded bodies to engage with the first and second electrodes, the first and second main bodies being embedded into the molded bodies, and the first and second extension electrodes being exposed from a periphery of the molded body; removing the first and second tie bars from the lead frame; disposing LED dies in corresponding receiving cavities defined by the molded bodies; and cutting the molded bodies and the lead frame to obtain a plurality of individual LED packages.

    Abstract translation: 一种制造LED封装的方法包括以下步骤：提供包括多对第一和第二电极的引线框架和分别位于每对电极的相对端部的第一和第二连接条，第一和第二电极各自包括主体和 从主体向外突出的延伸电极; 形成多个成型体以与第一和第二电极接合，第一和第二主体嵌入模制体中，并且第一和第二延伸电极从成型体的周边露出; 从引线框架移除第一和第二连接杆; 将LED管芯设置在由模制体限定的相应的接收腔中; 并切割成型体和引线框架以获得多个单独的LED封装。

    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES
    28.
    发明申请
    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES 审中-公开
    制造发光二极管封装的方法

    公开(公告)号：US20140248724A1

    公开(公告)日：2014-09-04

    申请号：US14190057

    申请日：2014-02-25

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

    IPC: H01L33/60

    CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A method for manufacturing LED packages includes steps: providing a lead frame including many pairs of first, second electrodes and first and second tie bars, the first electrodes and second electrodes each including a main body and an extension electrode protruding outward from the main body; forming many molded bodies to engage with the first and second electrodes, the first and second main bodies being embedded into the molded bodies, and the first and second extension electrodes being exposed out from a periphery of the molded body; preforming two first through grooves at joints where each first electrode meets the first tie bar and two second through grooves at joints where each second electrode meets the second tie bar; disposing LED dies in corresponding receiving cavities; and cutting the molded bodies through the grooves to obtain a plurality of individual LED packages.

    Abstract translation: 一种制造LED封装的方法包括以下步骤：提供包括多对第一，第二电极和第一和第二连接条的引线框，所述第一电极和第二电极各自包括从主体向外突出的主体和延伸电极; 形成许多模制体以与第一和第二电极接合，第一和第二主体嵌入模制体中，并且第一和第二延伸电极从成型体的周边露出; 在每个第一电极与第一连接杆相交的接头处预先形成两个第一通孔，以及在每个第二电极与第二连接杆相交的接头处的两个第二通孔; 在相应的接收腔中设置LED管芯; 并且通过凹槽切割成型体以获得多个单独的LED封装。

    LIGHT EMITTING DIODE PACKAGE
    29.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20140175483A1

    公开(公告)日：2014-06-26

    申请号：US14014374

    申请日：2013-08-30

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

    IPC: H01L33/60

    CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: An LED package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes an elongated first main portion and a first connecting portion bending downwardly from an end of the first main portion. The second electrode includes an elongated second main portion and a second connecting portion bending downwardly from an end of the second main portion. The LED chip is received in reflecting cup. The first main portion and the second main portion are embedded into the receiving cup, the end of the first main portion and the end of the second main portion extend outside the reflecting cup, and the first connecting portion and the second connecting portion are located outside the receiving cup.

    Abstract translation: LED封装包括第一电极，与第一电极电绝缘的第二电极，连接第一电极和第二电极的反射杯以及LED芯片。 第一电极包括细长的第一主要部分和从第一主要部分的端部向下弯曲的第一连接部分。 第二电极包括细长的第二主要部分和从第二主要部分的端部向下弯曲的第二连接部分。 LED芯片被接收在反射杯中。 第一主要部分和第二主要部分嵌入到接收杯中，第一主要部分的端部和第二主要部分的端部延伸到反射杯的外部，并且第一连接部分和第二连接部分位于外部 接收杯。

    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
    30.
    发明申请
    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE 有权
    制造发光二极管封装的方法

    公开(公告)号：US20130337594A1

    公开(公告)日：2013-12-19

    申请号：US13903976

    申请日：2013-05-28

    Applicant: Advanced Optoelectronic Technology, Inc

    Inventor： HOU-TE LIN ,  LUNG-HSIN CHEN

    IPC: H01L33/64

    CPC classification number: H01L33/64 ,  H01L33/0095 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00012 ,  H01L2924/00014

    Abstract: A method for manufacturing LED packages includes following steps: providing an engaging frame including a lead frame, electrode structures having first and second electrodes, and defining slots between the electrode structure, each first electrode including a first inserting part and each second electrode including a second inserting part;providing a substrate and combining the substrate and the engaging frame together to make through holes of the substrate located at lateral sides of the first and second inserting parts respectively, insulating parts of the substrate received in the slots of the engaging frame, and cavities of the substrate receiving the first and second inserting parts; providing LED diodes, and connecting each LED diode electrically to the first and second electrodes; and cutting along the first and second inserting parts to make sides of the first and second inserting parts exposed to ambient air.

    Abstract translation: 一种制造LED封装的方法包括以下步骤：提供包括引线框架的接合框架，具有第一和第二电极的电极结构，并且在电极结构之间限定狭缝，每个第一电极包括第一插入部分和每个第二电极， 插入部分 提供基板并将基板和接合框架组合在一起，以分别在位于第一和第二插入部分的侧面处的基板的通孔，分别容纳在接合框架的槽中的基板的绝缘部分和 接收第一和第二插入部件的基板; 提供LED二极管，并将每个LED二极管电连接到第一和第二电极; 并且沿着第一和第二插入部分切割以使第一和第二插入部分的侧面暴露于环境空气。

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