公开(公告)号：US20150003080A1

公开(公告)日：2015-01-01

申请号：US14310486

申请日：2014-06-20

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  HOU-TE LIN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG

IPC: F21K99/00

CPC classification number: F21V5/04 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061

Abstract: An LED module includes a PCB with a first electrode and a second electrode formed thereon, an LED mounted on the PCB, a lens mounted on the PCB and covering the LED. The LED includes a base, an LED die mounted on the base, and a packaging layer arranged on the base and covering the LED die therein. The base is flat. The lens includes a bottom surface, a first light output surface extending from the bottom surface, a second light output surface extending upwardly from a central of the first light output surface and away from the bottom surface, and a reflecting surface recessing downwardly from a top end of the second light output surface and oriented towards the bottom surface. A chamber is defined in the bottom surface to receive the LED therein.

Abstract translation: LED模块包括具有形成在其上的第一电极和第二电极的PCB，安装在PCB上的LED，安装在PCB上并覆盖LED的透镜。 LED包括基座，安装在基座上的LED管芯，以及布置在基座上并在其中覆盖LED管芯的封装层。 基地平坦。 透镜包括底面，从底面延伸的第一光输出表面，从第一光输出表面的中心向上延伸并远离底表面的第二光输出表面，以及从顶部向下凹陷的反射表面 第二光输出表面的端部并且朝向底表面定向。 在底表面中限定一个室，以便在其中接收LED。

公开(公告)号：US20140319564A1

公开(公告)日：2014-10-30

申请号：US14140460

申请日：2013-12-24

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/60

CPC classification number: H01L33/62 ,  H01L24/14 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light emitting diode package for mounting to a printed circuit board by surface mounting technology includes a substrate, first and second electrodes and a light emitting diode. The first electrode and the second electrode each have a first end and a second end. The second end of the first electrode is adjacent to the first end of the second electrode and a distance therebetween is increased along a top-to-bottom direction of the light emitting diode package. The first end of the first electrode extends out of the substrate and forms a tapered structure. The second end of the second electrode extends out of the substrate and forms a tapered structure. The light emitting diode chip is electrically connected with the first and second electrodes. A method for manufacturing the light emitting diode package is also provided.

Abstract translation: 用于通过表面安装技术安装到印刷电路板的发光二极管封装包括基板，第一和第二电极以及发光二极管。 第一电极和第二电极各自具有第一端和第二端。 第一电极的第二端与第二电极的第一端相邻，并且其间的距离沿着发光二极管封装的顶部到底部的方向增加。 第一电极的第一端延伸出基板并形成锥形结构。 第二电极的第二端延伸出基板并形成锥形结构。 发光二极管芯片与第一和第二电极电连接。 还提供了一种用于制造发光二极管封装的方法。

公开(公告)号：US20140284640A1

公开(公告)日：2014-09-25

申请号：US14077220

申请日：2013-11-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/40 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in the substrate and spaced from each other. Each of the first and the second electrodes includes a top face and a bottom face, with the top face and the bottom face thereof being exposed at a top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove therein. An oxidation-resistant metal coating layer is filled in the first groove. A positive bonding pad of the LED die directly contacts with a top face of the first oxidation-resistant metal coating layer.

Abstract translation: 发光二极管（LED）封装包括基板，第一电极，第二电极，安装在基板上并电连接到第一和第二电极的LED管芯，以及封装LED管芯的封装层。 第一和第二电极都嵌入基板并彼此间隔开。 第一电极和第二电极中的每一个分别包括顶面和底面，其顶面和底面分别在基板的顶表面和底表面处露出。 第一电极的顶面在其中限定第一凹槽。 在第一槽中填充抗氧化金属涂层。 LED管芯的正极接合焊盘直接与第一耐氧化金属被覆层的顶面接触。

公开(公告)号：US20140284639A1

公开(公告)日：2014-09-25

申请号：US14077219

申请日：2013-11-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/40 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.

Abstract translation: 发光二极管（LED）封装包括衬底，第一电极和嵌入在衬底中并彼此间隔开的第二电极，安装在衬底的顶表面上并电连接到第一和第二电极的LED管芯 。 第一和第二电极都包括顶面和底面，其中第一和第二电极中的每一个的顶面和底面分别暴露在基板的顶表面和底表面处。 第一电极的顶面限定对应于LED管芯的正焊盘（p焊盘）的第一槽。 p焊盘部分地插入第一凹槽中。 在p垫的插入部分和第一槽的内表面之间填充抗氧化金属涂层。

公开(公告)号：US20140220718A1

公开(公告)日：2014-08-07

申请号：US14248340

申请日：2014-04-09

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG

IPC: H01L27/15 ,  H01L33/08

CPC classification number: H01L27/153 ,  H01L25/167 ,  H01L33/08 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A method for manufacturing an LED (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an LED chip is mounted on the first electrode, wherein the LED chip is electrically connected to the first and second electrodes, and the LED chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the LED chip.

Abstract translation: 一种制造LED（发光二极管）封装的方法包括以下步骤：提供电绝缘基底，该基底具有第一表面和与其相对的第二表面; 环形电压稳定模块形成在第一表面上; 第一电极形成在第一表面上，其中第一电极附接并由电压稳定模块环绕; 在所述第一表面上形成第二电极，其中所述第二电极附接到所述电压稳定模块并且环绕所述稳压模块; LED芯片安装在第一电极上，其中LED芯片电连接到第一和第二电极，并且LED芯片和稳压模块反向并联连接。 最后，将封装层封装在LED芯片中。

公开(公告)号：US20140175484A1

公开(公告)日：2014-06-26

申请号：US14014424

申请日：2013-08-30

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/60

CPC classification number: H01L33/486 ,  H01L33/48 ,  H01L33/483 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.

Abstract translation: LED封装包括第一电极，第二电极，连接第一电极和第二电极的反射杯和LED芯片。 第一电极包括第一主要部分和从第一主要部分向外延伸的第一连接部分。 第一连接部分具有远离第一主要部分的第一连接面。 第二电极包括从第二主要部分向外延伸的第二主要部分和第二连接部分。 第二连接部分具有远离第二主要部分的第二连接面。 第一主要部分和第二主要部分嵌入到接收杯中，并且第一连接部分的第一连接面和第二连接部分的第二连接面暴露在接收杯的外部。

公开(公告)号：US20200326594A1

公开(公告)日：2020-10-15

申请号：US16680784

申请日：2019-11-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： CHAO-HSIUNG CHANG ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  PIN-CHUAN CHEN ,  HSIN-CHIANG LIN ,  HOU-TE LIN

IPC: G02F1/1335

Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.

公开(公告)号：US20160064604A1

公开(公告)日：2016-03-03

申请号：US14686152

申请日：2015-04-14

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/20 ,  H01L33/62 ,  H01L33/50 ,  H01L33/56

CPC classification number: H01L33/20 ,  H01L33/502 ,  H01L33/56 ,  H01L33/62 ,  H01L33/644 ,  H05K1/05 ,  H05K3/284 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10674

Abstract: A flip chip light emitting diode (LED) packaging structure, including a substrate, an LED chip including a P electrode and a N electrode. A protruding platform is formed in a center of the substrate. The protruding platform includes a first connecting portion and a second connecting portion electrically insulating from each other. The P electrode and the N electrode is conductively fixed to the protruding platform by solder, and a bottom edge of the P electrode and the N electrode are beyond a top edge of the protruding platform.

Abstract translation: 一种倒装芯片发光二极管（LED）封装结构，包括基板，包括P电极和N电极的LED芯片。 在基板的中心形成突出平台。 突出平台包括彼此电绝缘的第一连接部分和第二连接部分。 P电极和N电极通过焊料导电地固定到突出平台，并且P电极和N电极的底部边缘超过突出平台的顶部边缘。

公开(公告)号：US20150188013A1

公开(公告)日：2015-07-02

申请号：US14525466

申请日：2014-10-28

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/62 ,  H01L27/02 ,  H01L33/52 ,  H01L33/58 ,  H01L33/60 ,  H01L27/15 ,  H01L33/38

CPC classification number: H01L27/0248 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A photoelectric device includes a base, an LED (light emitting diode) element and a zener diode. The base includes a first electrode and a second electrode. The LED element and the zener diode are electrically connected with the first electrode and the second electrode. A recess structure is defined in the base. The zener diode is arranged in the recess structure. The zener diode is electrically connected in anti-parallel with the LED element.

Abstract translation: 光电装置包括基座，LED（发光二极管）元件和齐纳二极管。 基座包括第一电极和第二电极。 LED元件和齐纳二极管与第一电极和第二电极电连接。 在基座中限定了凹陷结构。 齐纳二极管布置在凹槽结构中。 齐纳二极管与LED元件反并联电连接。

公开(公告)号：US20140321127A1

公开(公告)日：2014-10-30

申请号：US14086978

申请日：2013-11-22

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： CHAO-HSIUNG CHANG ,  CHE-HSANG HUANG ,  HOU-TE LIN ,  PIN-CHUAN CHEN

IPC: F21V13/04 ,  F21K99/00

CPC classification number: G02F1/133606 ,  G02F1/133603 ,  G02F1/133605 ,  G02F2001/133607

Abstract: An LED module for use in a direct-type backlight module includes a printed circuit board, an LED arrange on the printed circuit board and electrically connected to the printed circuit board, and a lens covering the LED and fixed on the printed circuit board. A reflective layer is arranged on the printed circuit board. A semi-transparent surface is recessed and tampered from a top of a column-shaped protrusion at a center of the lens towards the LED. Part of light beams emitted from a center of the LED is refracted and diffused by the semi-transparent surface to an outside, and another part of the light beams emitted from a center of the LED is reflected by the semi-transparent surface to the reflective layer, and then reflected by the reflective layer to the outside.

Abstract translation: 用于直接型背光模块的LED模块包括印刷电路板，布置在印刷电路板上并电连接到印刷电路板的LED以及覆盖LED并固定在印刷电路板上的透镜。 反射层布置在印刷电路板上。 半透明表面从透镜中心向LED的柱形突起的顶部凹陷并被篡改。 从LED的中心发射的光束的一部分被半透明表面折射并扩散到外部，并且从LED的中心发射的另一部分光束被半透明表面反射到反射 层，然后被反射层反射到外部。