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    OPTICAL LENS, BACKLIGHT MODULE AND DISPLAY DEVICE USING SAME
    1.
    发明申请
    OPTICAL LENS, BACKLIGHT MODULE AND DISPLAY DEVICE USING SAME 审中-公开

    公开(公告)号：US20200326594A1

    公开(公告)日：2020-10-15

    申请号：US16680784

    申请日：2019-11-12

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： CHAO-HSIUNG CHANG ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  PIN-CHUAN CHEN ,  HSIN-CHIANG LIN ,  HOU-TE LIN

    IPC: G02F1/1335

    Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.

    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    发光二极管封装及其制造方法

    公开(公告)号：US20150162498A1

    公开(公告)日：2015-06-11

    申请号：US14524387

    申请日：2014-10-27

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： YAU-TZU JANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  YU-LIANG HUANG

    IPC: H01L33/38 ,  H01L33/62 ,  H01L33/56 ,  H01L33/44 ,  H01L33/54

    CPC classification number: H01L33/62 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2933/0066 ,  H01L2924/00014

    Abstract: A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of the connecting pin is smaller than that of the conductive sheet. A top surface of the connecting pin is coplanar with that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.

    Abstract translation: 发光二极管封装（LED）包括彼此间隔开的两个电极，夹在两个电极之间的绝缘层，布置在两个电极上并与之电连接的LED管芯以及覆盖LED管芯的封装层。 每个电极包括导电片和连接到导电片的多个连接销。 连接销的厚度小于导电片的厚度。 连接销的顶表面与导电片的顶表面共面。 LED封装还包括涂覆连接销的涂层，涂层销的一部分夹在连接销的顶表面和封装层之间。

    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES
    5.
    发明申请
    METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES 有权
    制造发光二极管封装的方法

    公开(公告)号：US20140248725A1

    公开(公告)日：2014-09-04

    申请号：US14191375

    申请日：2014-02-26

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： HOU-TE LIN ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

    IPC: H01L33/62

    CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A method for manufacturing LED packages includes steps: providing a lead frame including many pairs of first and second electrodes, and first and second tie bars, the first electrodes and second electrodes each including a main body and an extension electrode protruding outward from the main body; forming many molded bodies to engage with the pairs of the first and second electrodes, the first and second main bodies being embedded into the molded bodies, and the first and second extension electrodes being exposed out from a corresponding molded body; preforming many first grooves at a bottom of each molded body; disposing LED dies in the corresponding receiving cavities; and cutting the molded bodies along edges thereof defining the first grooves in a first direction and then along a second direction perpendicular to the first direction to obtain many individual LED packages.

    Abstract translation: 一种制造LED封装的方法包括以下步骤：提供包括多对第一和第二电极以及第一和第二连接条的引线框，所述第一电极和第二电极各自包括主体和从主体向外突出的延伸电极 ; 形成许多成型体以与所述第一和第二电极对配合，所述第一和第二主体嵌入所述模制体中，并且所述第一和第二延伸电极从相应的模制体露出; 在每个成型体的底部形成许多第一凹槽; 将LED管芯设置在相应的接收腔中; 并且沿着沿着第一方向限定第一凹槽的边缘并沿着垂直于第一方向的第二方向切割成型体，以获得许多单独的LED封装。

    LED WITH WIRE SUPPORT
    6.
    发明申请
    LED WITH WIRE SUPPORT 审中-公开
    LED电线支持

    公开(公告)号：US20140145216A1

    公开(公告)日：2014-05-29

    申请号：US13859739

    申请日：2013-04-10

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： LUNG-HSIN CHEN ,  PIN-CHUAN CHEN ,  WEN-LIANG TSENG

    IPC: H01L33/62 ,  H01L27/15

    CPC classification number: H01L33/62 ,  H01L24/06 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An LED includes a base, a first chip and a second chip mounted on the base, a wire support formed on the base, and wires electrically connecting the first chip and the second chip with the base. The base includes a first lead, a second lead and an insulative band connecting the first lead and the second lead. A first wire connects an electrode of the first chip to the wire support, and a second wire connects an electrode of the second chip to the wire support. The first wire and the second wire are electrically connected to each other via a conductive layer formed on the wire support. The wire support in one embodiment is a Zener diode.

    Abstract translation: LED包括基座，安装在基座上的第一芯片和第二芯片，形成在基座上的线支架，以及将第一芯片和第二芯片与基座电连接的电线。 基座包括第一引线，第二引线和连接第一引线和第二引线的绝缘带。 第一线将第一芯片的电极连接到线支撑件，并且第二线将第二芯片的电极连接到线支撑件。 第一线和第二线通过形成在线支撑上的导电层彼此电连接。 一个实施例中的线支撑件是齐纳二极管。

    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    7.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光二极管封装及其制造方法

    公开(公告)号：US20140084315A1

    公开(公告)日：2014-03-27

    申请号：US13955276

    申请日：2013-07-31

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： CHE-HSANG HUANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  YU-LIANG HUANG

    IPC: H01L33/62

    CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.

    Abstract translation: 示例性的发光二极管（LED）封装包括电绝缘基板，嵌入绝缘基板中的电极结构以及分别与电极结构的电极电连接的多个LED芯片。 电极结构包括位于第一和第二电极之间的第一电极，第二电极和第三电极。 第一，第二和第三电极的顶表面露出绝缘衬底的顶表面以支撑LED芯片。 第一和第二电极的底表面露出基板的底表面以与印刷电路板的焊盘连接。 第三电极的底面容纳在基板中。

    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光二极管封装及其制造方法

    公开(公告)号：US20140084312A1

    公开(公告)日：2014-03-27

    申请号：US13965185

    申请日：2013-08-12

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： CHE-HSANG HUANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN ,  WEN-LIANG TSENG ,  YU-LIANG HUANG

    IPC: H01L27/15

    CPC classification number: H01L27/15 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.

    Abstract translation: 发光二极管（LED）封装包括衬底，嵌入衬底中的电极结构以及与电极结构电连接的多个LED芯片。 基板包括从主要部分的底表面延伸的主要部分和突出部分。 主要部分位于突出部分的上方。 电极结构包括彼此间隔开的第一，第二和第三电极。 第三电极位于第一和第二电极之间。 第一，第二和第三电极的顶表面暴露在主要部分的顶表面之外。 第一和第二电极的底表面暴露在主体部分的底表面之外。 第三电极的底表面被突出部分覆盖。 本公开还涉及一种用于制造LED封装的方法。

    LIGHT-EMITTING ELEMENT PACKAGE AND FABRICATION METHOD THEREOF
    9.
    发明申请
    LIGHT-EMITTING ELEMENT PACKAGE AND FABRICATION METHOD THEREOF 有权
    发光元件包装及其制造方法

    公开(公告)号：US20140051193A1

    公开(公告)日：2014-02-20

    申请号：US13973941

    申请日：2013-08-22

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： MIN-TSUN HSIEH ,  WEN-LIANG TSENG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN ,  CHING-LIEN YEH ,  CHI-WEI LIAO

    IPC: H01L33/58

    CPC classification number: H01L33/58 ,  H01L33/54 ,  H01L2933/005 ,  H01L2933/0083

    Abstract: A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.

    Abstract translation: 一种发光元件封装的制造方法，所述方法包括：提供高精度晶片级模具模块，所述高精度晶片级模具模块包括上模具和底模具; 在上模和底模之间安装具有多个发光元件的基板; 将包装材料填充到高精度晶片级模具模块中，以获得安装在发光元件上的封装构件; 并移除高精度晶圆级模具模块。

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