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公开(公告)号：US20150036321A1
公开(公告)日：2015-02-05
申请号：US14445486
申请日：2014-07-29
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： CHAO-HSIUNG CHANG , PIN-CHUAN CHEN , LUNG-HSIN CHEN , WEN-LIANG TSENG
CPC classification number: G02B19/0061 , F21V5/046 , F21V7/0091 , F21V9/30 , G02B19/0028
Abstract: An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided.
Abstract translation: 光学透镜包括位于其底部的第一光学表面，位于其顶部并与第一光学表面相对布置的第三光学表面，以及在第一光学表面和第三光学表面之间延伸的第二光学表面。 第三光学表面向下朝向第一光学表面凹陷。 来自LED光源的光通过第一光学表面进入光学透镜，大部分入射光通过第二光学表面直接从光学透镜折射出来，并且进入第三光学表面的入射光的一部分 首先由第三光学表面通过全内反射朝向第二光学表面反射，然后通过第二光学表面折射出光学透镜。 还提供了包括光学透镜的背光模块。
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公开(公告)号：US20150003080A1
公开(公告)日：2015-01-01
申请号：US14310486
申请日：2014-06-20
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： CHAO-HSIUNG CHANG , PIN-CHUAN CHEN , HOU-TE LIN , LUNG-HSIN CHEN , WEN-LIANG TSENG
IPC: F21K99/00
CPC classification number: F21V5/04 , F21Y2115/10 , G02B19/0028 , G02B19/0061
Abstract: An LED module includes a PCB with a first electrode and a second electrode formed thereon, an LED mounted on the PCB, a lens mounted on the PCB and covering the LED. The LED includes a base, an LED die mounted on the base, and a packaging layer arranged on the base and covering the LED die therein. The base is flat. The lens includes a bottom surface, a first light output surface extending from the bottom surface, a second light output surface extending upwardly from a central of the first light output surface and away from the bottom surface, and a reflecting surface recessing downwardly from a top end of the second light output surface and oriented towards the bottom surface. A chamber is defined in the bottom surface to receive the LED therein.
Abstract translation: LED模块包括具有形成在其上的第一电极和第二电极的PCB，安装在PCB上的LED，安装在PCB上并覆盖LED的透镜。 LED包括基座，安装在基座上的LED管芯，以及布置在基座上并在其中覆盖LED管芯的封装层。 基地平坦。 透镜包括底面，从底面延伸的第一光输出表面，从第一光输出表面的中心向上延伸并远离底表面的第二光输出表面，以及从顶部向下凹陷的反射表面 第二光输出表面的端部并且朝向底表面定向。 在底表面中限定一个室，以便在其中接收LED。
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公开(公告)号：US20140319564A1
公开(公告)日：2014-10-30
申请号：US14140460
申请日：2013-12-24
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： HOU-TE LIN , CHAO-HSIUNG CHANG , PIN-CHUAN CHEN , LUNG-HSIN CHEN
IPC: H01L33/60
CPC classification number: H01L33/62 , H01L24/14 , H01L24/97 , H01L2224/16245 , H01L2924/12041 , H01L2924/00
Abstract: A light emitting diode package for mounting to a printed circuit board by surface mounting technology includes a substrate, first and second electrodes and a light emitting diode. The first electrode and the second electrode each have a first end and a second end. The second end of the first electrode is adjacent to the first end of the second electrode and a distance therebetween is increased along a top-to-bottom direction of the light emitting diode package. The first end of the first electrode extends out of the substrate and forms a tapered structure. The second end of the second electrode extends out of the substrate and forms a tapered structure. The light emitting diode chip is electrically connected with the first and second electrodes. A method for manufacturing the light emitting diode package is also provided.
Abstract translation: 用于通过表面安装技术安装到印刷电路板的发光二极管封装包括基板，第一和第二电极以及发光二极管。 第一电极和第二电极各自具有第一端和第二端。 第一电极的第二端与第二电极的第一端相邻，并且其间的距离沿着发光二极管封装的顶部到底部的方向增加。 第一电极的第一端延伸出基板并形成锥形结构。 第二电极的第二端延伸出基板并形成锥形结构。 发光二极管芯片与第一和第二电极电连接。 还提供了一种用于制造发光二极管封装的方法。
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公开(公告)号：US20140284640A1
公开(公告)日：2014-09-25
申请号：US14077220
申请日：2013-11-12
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： HOU-TE LIN , PIN-CHUAN CHEN , LUNG-HSIN CHEN
CPC classification number: H01L33/62 , H01L33/486 , H01L33/60 , H01L2224/13 , H01L2224/48247 , H01L2224/73265 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in the substrate and spaced from each other. Each of the first and the second electrodes includes a top face and a bottom face, with the top face and the bottom face thereof being exposed at a top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove therein. An oxidation-resistant metal coating layer is filled in the first groove. A positive bonding pad of the LED die directly contacts with a top face of the first oxidation-resistant metal coating layer.
Abstract translation: 发光二极管（LED）封装包括基板，第一电极，第二电极，安装在基板上并电连接到第一和第二电极的LED管芯，以及封装LED管芯的封装层。 第一和第二电极都嵌入基板并彼此间隔开。 第一电极和第二电极中的每一个分别包括顶面和底面，其顶面和底面分别在基板的顶表面和底表面处露出。 第一电极的顶面在其中限定第一凹槽。 在第一槽中填充抗氧化金属涂层。 LED管芯的正极接合焊盘直接与第一耐氧化金属被覆层的顶面接触。
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公开(公告)号：US20140284639A1
公开(公告)日：2014-09-25
申请号：US14077219
申请日：2013-11-12
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： HOU-TE LIN , PIN-CHUAN CHEN , LUNG-HSIN CHEN
CPC classification number: H01L33/62 , H01L33/486 , H01L2224/13 , H01L2224/48247 , H01L2224/73265 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.
Abstract translation: 发光二极管（LED）封装包括衬底，第一电极和嵌入在衬底中并彼此间隔开的第二电极，安装在衬底的顶表面上并电连接到第一和第二电极的LED管芯 。 第一和第二电极都包括顶面和底面，其中第一和第二电极中的每一个的顶面和底面分别暴露在基板的顶表面和底表面处。 第一电极的顶面限定对应于LED管芯的正焊盘（p焊盘）的第一槽。 p焊盘部分地插入第一凹槽中。 在p垫的插入部分和第一槽的内表面之间填充抗氧化金属涂层。
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Patent Agency Ranking
公开(公告)号：US20140175484A1
公开(公告)日：2014-06-26
申请号：US14014424
申请日：2013-08-30
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： HOU-TE LIN , PIN-CHUAN CHEN , LUNG-HSIN CHEN
IPC: H01L33/60
CPC classification number: H01L33/486 , H01L33/48 , H01L33/483 , H01L33/52 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
Abstract: An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.
Abstract translation: LED封装包括第一电极，第二电极，连接第一电极和第二电极的反射杯和LED芯片。 第一电极包括第一主要部分和从第一主要部分向外延伸的第一连接部分。 第一连接部分具有远离第一主要部分的第一连接面。 第二电极包括从第二主要部分向外延伸的第二主要部分和第二连接部分。 第二连接部分具有远离第二主要部分的第二连接面。 第一主要部分和第二主要部分嵌入到接收杯中，并且第一连接部分的第一连接面和第二连接部分的第二连接面暴露在接收杯的外部。
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27.发明申请公开(公告)号：US20140175482A1
公开(公告)日：2014-06-26
申请号：US13963324
申请日：2013-08-09
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： YAU-TZU JANG , PIN-CHUAN CHEN , LUNG-HSIN CHEN , HSING-FEN LO , WEN-LIANG TSENG , YU-LIANG HUANG
IPC: H01L33/60
CPC classification number: H01L33/60 , H01L2224/48091 , H01L2924/00014
Abstract: An exemplary LED package includes a base, electrodes formed on the base, an LED chip electrically connecting the electrodes, and a reflecting cup mounted on the base and surrounding the LED chip therein. The reflecting cup includes a bottom surface and an inner surface recessed up from the bottom surface and slantwise oriented towards a top end of the reflecting cup. The reflecting cup is annular. The inner surface includes a reflecting portion slantwise extending from the top surface, and a transition portion extending downwardly from the reflecting portion. The transition portion defines a through hole therein. The reflecting portion defines a reflecting hole therein. An angle α is defined between the reflecting portion and an imaginary surface parallel to the bottom surface. An angle β is defined between the reflecting portion and the bottom surface. The angle β is larger than the angle α.
Abstract translation: 示例性的LED封装包括基底，形成在基底上的电极，电连接电极的LED芯片和安装在基座上并围绕LED芯片的反射杯。 反射杯包括底表面和从底表面向上凹陷的内表面，并且朝向反射杯的顶端倾斜定向。 反射杯是环形的。 内表面包括从顶表面倾斜延伸的反射部分和从反射部分向下延伸的过渡部分。 过渡部分在其中限定一个通孔。 反射部分在其中限定反射孔。 在反射部分和平行于底面的假想表面之间限定角度α。 角＆bgr 被限定在反射部和底面之间。 角度＆bgr 大于角度α。
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公开(公告)号：US20140071675A1
公开(公告)日：2014-03-13
申请号：US13953902
申请日：2013-07-30
Applicant: Advanced Optoelectronic Technology, Inc.
Inventor： CHAO-HSIUNG CHANG , LUNG-HSIN CHEN , PIN-CHUAN CHEN , WEN-LIANG TSENG
CPC classification number: F21V5/04 , F21K9/232 , F21K9/60 , F21V3/02 , F21V29/70 , F21V29/773 , F21V29/89 , F21Y2113/13 , F21Y2115/10 , G02B19/0061 , G02B19/0071
Abstract: An LED bulb includes a connecting member having an Edison male screw base and an LED module engaging with the connecting member. The LED module includes a circuit board, a first LED and a plurality of second LEDs mounted on the circuit board. The first LED is arranged on a center of the circuit board. The second LEDs are located surround the first LED. The LED bulb furthermore includes a plurality of lens. Each lens covers a corresponding second LED. Each lens includes a light-guiding portion which includes a light input surface and a light output surface. Light emitted from each of the second LEDs travels into the lens via the light input surface, and is refracted out to lateral directions of the LED bulb by the light output surface of the light-guiding portion to obtain a wider illumination range.
Abstract translation: LED灯泡包括具有Edison外螺纹基座和与连接构件接合的LED模块的连接构件。 LED模块包括电路板，第一LED和安装在电路板上的多个第二LED。 第一个LED布置在电路板的中心。 第二个LED位于第一个LED的周围。 LED灯泡还包括多个透镜。 每个镜头都覆盖相应的第二个LED。 每个透镜包括导光部分，其包括光输入表面和光输出表面。 从每个第二LED发射的光经由光输入表面进入透镜，并且通过导光部分的光输出表面折射到LED灯泡的横向以获得更宽的照明范围。
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公开(公告)号：US20140063849A1
公开(公告)日：2014-03-06
申请号：US13926084
申请日：2013-06-25
Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
Inventor： CHAO-HSIUNG CHANG , PIN-CHUAN CHEN , LI-HSIANG CHEN
CPC classification number: G02B6/0011 , F21V5/00 , G02B19/0061 , G02F1/133603 , G02F1/133606
Abstract: A backlight module includes a substrate, a plurality of LED packages mounted on the substrate and a light diffusion board located above the LED packages. The light diffusion board includes a light incident surface facing toward the LED packages and a light output surface. A plurality of light-guiding portions is configured extending from the incident surface of the light diffusion board toward the LED package. Each light-guiding portion comprises a concave surface at an outer periphery thereof. A diameter of each light-guiding portion decreases gradually from light diffusion board toward the LED packages. The concave surface of each light-guiding portion is recessed inwardly from the outer periphery of the light-guiding portion. Light from the LED packages and emitting into the light-guiding potions is divergently and uniformly adjusted into the light diffusion board by the concave surfaces of the light-guiding portions.
Abstract translation: 背光模块包括基板，安装在基板上的多个LED封装以及位于LED封装之上的光漫射板。 光漫射板包括面向LED封装的光入射表面和光输出表面。 多个导光部被配置为从光扩散板的入射面向LED封装延伸。 每个导光部分在其外周边包括凹面。 每个导光部分的直径从光扩散板朝向LED封装逐渐减小。 每个导光部分的凹面从导光部分的外周向内凹入。 来自LED封装并发射到导光部分的光通过导光部分的凹面发散均匀地调整到光扩散板中。
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公开(公告)号：US20130302919A1
公开(公告)日：2013-11-14
申请号：US13942716
申请日：2013-07-16
Applicant: Advanced Optoelectronic Technology, Inc.
Inventor： HSIN-CHIANG LIN , PIN-CHUAN CHEN
CPC classification number: H01L33/52 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
Abstract: A method for making an LED package includes the following steps: providing a substrate with an electrode formed thereon; forming at least one barrier portion on the electrode; forming a reflective cup on the substrate wherein the reflective cup covers the at least one barrier portion; providing an LED die in the reflective cup and electrically connecting the LED die to the electrode; and forming an encapsulation in the reflective cup, the encapsulation covering the LED die.
Abstract translation: 一种制造LED封装的方法包括以下步骤：提供其上形成有电极的基板; 在所述电极上形成至少一个阻挡部分; 在所述基底上形成反射杯，其中所述反射杯覆盖所述至少一个阻挡部分; 在反射杯中提供LED管芯并将LED管芯电连接到电极上; 并在反射杯中形成封装，封装覆盖LED裸片。
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