公开(公告)号：US20240319712A1

公开(公告)日：2024-09-26

申请号：US18187848

申请日：2023-03-22

Applicant: Advanced Micro Devices, Inc ,  ATI Technologies ULC

Inventor： Jerry Anton Ahrens ,  Grant Evan Ley ,  Anil Harwani ,  Amitabh Mehra ,  Joshua Taylor Knight ,  William Robert Alverson ,  Adam Neil Calder Clark

IPC: G05B19/4155 ,  G01K7/01

CPC classification number: G05B19/4155 ,  G01K7/01 ,  G05B2219/49216

Abstract: Dynamic range aware conversion of sensor readings is described. A system includes one or more sensors to sense conditions of a component and output sensor readings and a system manager. The system manager is configured to convert the sensor readings into condition measurements by converting the sensor readings into the condition measurements using a first transformation while operating in a first conversion mode or converting the sensor readings into the condition measurements using a second transformation while operating in a second conversion mode. The system manager then adjusts operation of the component based on the condition measurements.

公开(公告)号：US20240220108A1

公开(公告)日：2024-07-04

申请号：US18147963

申请日：2022-12-29

Applicant: Advanced Micro Devices, Inc.

Inventor： Jayesh Hari Joshi ,  Alicia Wen Ju Yurie Leong ,  William Robert Alverson ,  Joshua Taylor Knight ,  Jerry Anton Ahrens ,  Grant Evan Ley ,  Amitabh Mehra ,  Anil Harwani

IPC: G06F3/06

CPC classification number: G06F3/061 ,  G06F3/0653 ,  G06F3/0673

Abstract: Automated memory overclocking is described. In accordance with the described techniques, one or more sets of overclocked memory settings of a memory are automatically selected for performance testing and stability testing of the memory. The one or more sets of the overclocked memory settings are tested for performance of the memory and a performance indication is output for each of the one or more sets of the overclocked memory settings. The one or more sets of the overclocked memory settings are tested for stability of the memory and a stability indication is output for each of the one or more sets of the overclocked memory settings. One of the one or more sets of the overclocked memory settings are selected as optimized overclocked memory settings for the memory.

公开(公告)号：US11977757B2

公开(公告)日：2024-05-07

申请号：US17732718

申请日：2022-04-29

Applicant: Advanced Micro Devices, Inc.

Inventor： Grant Evan Ley ,  Jayesh Hari Joshi ,  Amitabh Mehra ,  Jerry Anton Ahrens ,  Joshua Taylor Knight ,  Anil Harwani ,  William Robert Alverson

IPC: G06F3/06

CPC classification number: G06F3/0634 ,  G06F3/0604 ,  G06F3/0613 ,  G06F3/0673

Abstract: Profile switching for memory overclocking is described. In accordance with the described techniques, a memory is operated according to a first memory profile. During operation of the memory according to the first memory profile, a request is received to operate the memory according to a second memory profile. Responsive to the request, operation of the memory is switched to operate according to the second memory profile without rebooting. In one or more implementations, at least one of the first memory profile or the second memory profile comprises an overclocking memory profile that configures the memory to operate in an overclocking mode. In one or more implementations, the memory is trained to operate according to the overclocking memory profile prior to operating the memory according to the first memory profile.

公开(公告)号：US20230324967A1

公开(公告)日：2023-10-12

申请号：US17704862

申请日：2022-03-25

Applicant: Advanced Micro Devices, Inc.

Inventor： Jerry Anton Ahrens ,  William Robert Alverson ,  Amitabh Mehra ,  Grant Evan Ley ,  Anil Harwani ,  Joshua Taylor Knight

IPC: G06F1/20

CPC classification number: G06F1/206

Abstract: Package lids with carveouts configured to expose lights directly connected to an internal component of a processor are described. Lid carveouts are configured to precisely align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device via a press fit connection, while maintaining visibility of lights directly connected to processor internal components when the cooling device is connected. Lid carveouts are further configured to expose one or more connectors disposed on a processor surface that supports its internal component. When contacted by corresponding connectors of an auxiliary device, such as a light not integrated into a processor package or a cooling device, the lid carveouts enable direct connections between the package’s internal components and the auxiliary device.

公开(公告)号：US11436114B2

公开(公告)日：2022-09-06

申请号：US17379442

申请日：2021-07-19

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Amitabh Mehra ,  Anil Harwani ,  William R. Alverson ,  Grant E. Ley ,  Jerry A. Ahrens ,  Mustansir M. Pratapgarhwala ,  Scott E. Swanstrom

IPC: G06F11/22

Abstract: Automatic part testing includes: booting a part under testing into a first operating environment; executing, via the first operating environment, one or more test patterns on the part; performing a comparison between one or more observed characteristics associated with the one or more test patterns and one or more expected characteristics; and modifying one or more operational parameters of a central processing unit of the part based on the comparison.

公开(公告)号：US11262924B2

公开(公告)日：2022-03-01

申请号：US16729702

申请日：2019-12-30

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： William R. Alverson ,  Amitabh Mehra ,  Anil Harwani ,  Jerry A. Ahrens ,  Grant E. Ley ,  Jayesh Joshi

IPC: G06F3/06 ,  G11C29/10

Abstract: Automatic memory overclocking, including: increasing a memory frequency setting for a memory module until a memory stability test fails; determining an overclocked memory frequency setting including a highest memory frequency setting passing the memory stability test; and generating a profile including the overclocked memory frequency setting.

公开(公告)号：US11068368B2

公开(公告)日：2021-07-20

申请号：US16715831

申请日：2019-12-16

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Amitabh Mehra ,  Anil Harwani ,  William R. Alverson ,  Grant E. Ley ,  Jerry A. Ahrens ,  Mustansir M. Pratapgarhwala ,  Scott E. Swanstrom

IPC: G06F11/22

Abstract: Automatic part testing includes: booting a part under testing into a first operating environment; executing, via the first operating environment, one or more test patterns on the part; performing a comparison between one or more observed characteristics associated with the one or more test patterns and one or more expected characteristics; and modifying one or more operational parameters of a central processing unit of the part based on the comparison.

公开(公告)号：US20210191450A1

公开(公告)日：2021-06-24

申请号：US16726167

申请日：2019-12-23

Applicant: Advanced Micro Devices, Inc.

Inventor： Amitabh Mehra ,  Jeffrey N. Burley ,  Anil Harwani

IPC: G06F1/08 ,  G06F1/26 ,  G06F11/30

Abstract: A method and apparatus for managing overclocking in a data center includes determining a frequency limit of a first processor of a first server in the data center. The voltage of the first processor is lowered to a stability point, and the frequency is lowered. The first server is tested for stability. Based upon the results of the test, the voltage and frequency modifications are deployed to a second processor of a second server in the data center.

公开(公告)号：US20210182121A1

公开(公告)日：2021-06-17

申请号：US16711875

申请日：2019-12-12

Applicant: Advanced Micro Devices, Inc. ,  ATI Technologies ULC

Inventor： Amitabh Mehra ,  Anil Harwani ,  William Robert Alverson ,  Jerry Anton Ahrens, Jr. ,  Charles Sum Yuen Lee ,  John William Abshier

IPC: G06F9/50 ,  G06F9/4401

Abstract: A method and apparatus for managing processor functionality includes receiving, by the processor, data relating to one or more environmental conditions. The processor compares the data to pre-existing parameters to determine whether or not the environmental conditions are within the pre-existing parameters for normal operation. If the data are within the pre-existing parameters for normal operation, the processor is operated in a normal operation mode. If the data are outside the pre-existing parameters for normal operation, the processor operates in a second operation mode which is dynamically determined and calibrated during power-on, boot and operation.

公开(公告)号：US12253892B2

公开(公告)日：2025-03-18

申请号：US17704912

申请日：2022-03-25

Applicant: Advanced Micro Devices, Inc.

Inventor： Jerry Anton Ahrens ,  William Robert Alverson ,  Amitabh Mehra ,  Grant Evan Ley ,  Anil Harwani ,  Joshua Taylor Knight

IPC: G06F1/20 ,  H05K5/02 ,  H05K5/03 ,  H05K7/20

Abstract: Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.