Lid Carveouts for Processor Lighting
    25.
    发明公开

    公开(公告)号:US20230324967A1

    公开(公告)日:2023-10-12

    申请号:US17704862

    申请日:2022-03-25

    CPC classification number: G06F1/206

    Abstract: Package lids with carveouts configured to expose lights directly connected to an internal component of a processor are described. Lid carveouts are configured to precisely align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device via a press fit connection, while maintaining visibility of lights directly connected to processor internal components when the cooling device is connected. Lid carveouts are further configured to expose one or more connectors disposed on a processor surface that supports its internal component. When contacted by corresponding connectors of an auxiliary device, such as a light not integrated into a processor package or a cooling device, the lid carveouts enable direct connections between the package’s internal components and the auxiliary device.

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