公开(公告)号：US20210013118A1

公开(公告)日：2021-01-14

申请号：US16508210

申请日：2019-07-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-En Chen ,  Ian Hu ,  Chih-Pin Hung

IPC: H01L23/367 ,  H01L23/427

Abstract: A semiconductor package structure includes a package substrate, at least one semiconductor die, a heat dissipating device, at least one electronic device and a heat transmitting structure. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The heat dissipating device is thermally connected to the first surface of the package substrate. The electronic device is electrically connected to the second surface of the package substrate. The electronic device has a first surface and a second surface opposite to the first surface, and the first surface of the electronic device faces the second surface of the package substrate. The heat transmitting structure is disposed adjacent to the second surface of the package substrate, and thermally connected to the electronic device and the heat dissipating device.