公开(公告)号：US20050018864A1

公开(公告)日：2005-01-27

申请号：US10921747

申请日：2004-08-19

Applicant: Anthony Minervini

Inventor： Anthony Minervini

IPC: H04R1/02 ,  B81B7/00 ,  H04R19/01 ,  H04R19/04 ,  H04R25/00 ,  H04R17/02

CPC classification number: H04R1/2892 ,  B81B3/0021 ,  B81B7/0038 ,  B81B7/0058 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C1/00158 ,  B81C1/00301 ,  B81C3/00 ,  H01L21/78 ,  H01L23/10 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/1461 ,  H04R1/04 ,  H04R1/222 ,  H04R3/00 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R23/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2225/49 ,  H04R2410/03 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798 ,  H01L2924/00

Abstract: A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

Abstract translation: 公开了一种硅电容麦克风封装。 硅电容麦克风封装包括一个换能器单元，一个基板和一个盖子。 基板包括其中形成有凹部的上表面。 换能器单元附接到基板的上表面并且与凹部的至少一部分重叠，其中换能器单元的后部体积形成在换能器单元和基板之间。 将盖放置在换能器单元上方并且包括孔。

公开(公告)号：US06191928B1

公开(公告)日：2001-02-20

申请号：US09256604

申请日：1999-02-23

Applicant: Louis Rector ,  Hugh M. Hyatt ,  Anthony Minervini ,  Robert Swensen ,  Andrew J. Neuhalfen ,  Andrew W. S. Elliott

Inventor： Louis Rector ,  Hugh M. Hyatt ,  Anthony Minervini ,  Robert Swensen ,  Andrew J. Neuhalfen ,  Andrew W. S. Elliott

IPC: H02H100

CPC classification number: H01T4/10 ,  H01C7/006 ,  H01C7/028 ,  H01C7/1013 ,  H01C7/12 ,  H01C17/08 ,  H01H69/022 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/11 ,  H01H2085/0414 ,  H01T4/08

Abstract: The thin film, electrical device is an subminiature overvoltage circuit protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components. The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device 60 to a PC board. The second subassembly includes a voltage variable polymer material with nonlinear resistance characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device. The devices of the present invention employ various electrode configurations and profiles to control the electrical field created between the electrodes and increase the active area of the electrodes in contact with the voltage variable material to enhance the electrical characteristics of the device.

Abstract translation: 薄膜电气装置是用于印刷电路板或厚膜混合电路技术的表面可安装配置的超小型过电压电路保护装置。 表面贴装设备（SMD）设计用于防止电子元件的静电放电（ESD）损坏。 电路保护装置包括三个材料组件。 第一子组件通常包括用于将保护装置60连接到PC板的衬底载体，电极和端子衬垫。 第二子组件包括具有非线性电阻特性的电压可变聚合物材料，第三子组件包括用于保护电路保护装置的其它元件的覆盖层。 本发明的器件采用各种电极结构和轮廓来控制在电极之间产生的电场，并增加与电压可变材料接触的电极的有效面积，以增强器件的电气特性。