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    Acoustic transducer module
    2.
    发明申请
    Acoustic transducer module 有权
    声换能器模块

    公开(公告)号：US20060116180A1

    公开(公告)日：2006-06-01

    申请号：US11117134

    申请日：2005-04-28

    Applicant: Anthony Minervini

    Inventor： Anthony Minervini

    IPC: H04M1/00

    CPC classification number: H04R19/005 ,  H01L2924/0002 ,  H04R1/028 ,  H04R19/04 ,  H04R2499/11 ,  H01L2924/00

    Abstract: A module (100, 200, 300, 400, 500, 600, 900) may be electrically connected to a PCB (18, 918) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16, 916) of the device (14). The module may include a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910) having a connecting surface (114, 214, 314, 414, 514, 614, 914), and at least one acoustic port (124, 224, 324, 424, 524, 624, 924) to couple a surface of the surface mountable acoustic transducer to the exterior of the device (14). The module (100, 200, 300, 400, 500, 600, 900) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614, 914) of the surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910). The acoustic port (124, 224, 324, 424, 524, 624, 924) may include a layer of an environmental barrier (450, 550).

    Abstract translation: 模块（100,200,300,400,500,600,900）可以电连接到位于设备（14）中的PCB（18,918）或者可以连接到设备（14）以形成部分 的装置（14）的外壳（16,916）。 该模块可以包括具有至少一个层的壳体（102,202,302,402,502,602），表面可安装的部件，例如可表面安装的声换能器（110,210,310,410,501,602,602,602,602,602,602） 910）具有连接表面（114,214,314,414,514,614,914），以及至少一个声学接口（124,224,324,424,524,624,924），用于将表面的表面 可安装的声换能器到设备（14）的外部。 模块（100,200,300,400,500,600,900）还可以包括电连接到所述连接表面（114,214,314,414,514,614,914）的辅助安装结构（654） 可表面安装的声换能器（110,210,310,410,510,610,910）。 声学端口（124,224,324,424,524,624,924）可以包括环境屏障层（450,550）。

    Containment of tin diffusion bar
    3.
    发明授权
    Containment of tin diffusion bar 有权
    遏制锡扩散棒

    公开(公告)号：US6078245A

    公开(公告)日：2000-06-20

    申请号：US213193

    申请日：1998-12-17

    Applicant: Sandra E. Fritz ,  Anthony Minervini ,  Thomas Restis

    Inventor： Sandra E. Fritz ,  Anthony Minervini ,  Thomas Restis

    IPC: H01H85/041 ,  H01H85/046 ,  H01H85/11 ,  H01H69/02

    CPC classification number: H01H85/046 ,  H01H2085/0414 ,  H01H85/0411 ,  H01H85/11

    Abstract: A thin film surface-mountable fuse for protection against electrical overload. The fuse comprises a substrate, fusible link, a containment compound, and a pair of terminal pads. The fusible link is produced from a first conductive material and supported on the substrate. A diffusion bar of a second conductive material is deposited on a portion of the fusible link. The containment compound is also deposited over a portion of the fusible link. The containment compound inhibits migration of the diffusion bar along the fusible link during an electrical overload. The terminal pads are electrically connected to the fusible link and also supported by the substrate.

    Abstract translation: 薄膜表面贴装保险丝，用于防止电气过载。 保险丝包括衬底，可熔接头，容纳化合物和一对端子衬垫。 熔丝链由第一导电材料制成并支撑在基片上。 第二导电材料的扩散棒沉积在可熔链节的一部分上。 容纳化合物也沉积在可熔链节的一部分上。 容纳化合物在电过载期间抑制扩散棒沿着熔断体的迁移。 端子焊盘电连接到可熔连接件并且还由衬底支撑。

    Microphone Having Reduced Vibration Sensitivity
    5.
    发明申请
    Microphone Having Reduced Vibration Sensitivity 审中-公开
    降低振动灵敏度的麦克风

    公开(公告)号：US20100303274A1

    公开(公告)日：2010-12-02

    申请号：US12781918

    申请日：2010-05-18

    Applicant: William Ryan ,  Anthony Minervini

    Inventor： William Ryan ,  Anthony Minervini

    IPC: H04R1/02

    CPC classification number: H04R1/222 ,  H04R1/04

    Abstract: A microphone assembly includes a first transducer and a second transducer. The first transducer is coupled to a first substrate layer on a first side of the first substrate layer. The second transducer is coupled to a second substrate layer on a second side of the second substrate layer. The first side and the second side are opposite to each other. The first substrate layer and the second substrate layer are substantially parallel and mechanically coupled. The first transducer and the second transducer have a shared volume and this shared volume is one of a front volume or a rear volume.

    Abstract translation: 麦克风组件包括第一换能器和第二换能器。 第一传感器耦合到第一衬底层的第一侧上的第一衬底层。 第二传感器耦合到第二衬底层的第二侧上的第二衬底层。 第一面和第二面彼此相对。 第一基底层和第二基底层基本平行并机械耦合。 第一个传感器和第二个传感器具有共享音量，该共享音量是前音量或后音量之一。

    MICROELECTROMICHANICAL SYSTEM PACKAGE WITH STRAIN RELIEF BRIDGE
    6.
    发明申请
    MICROELECTROMICHANICAL SYSTEM PACKAGE WITH STRAIN RELIEF BRIDGE 有权
    具有应变消除桥的微电子自动化系统封装

    公开(公告)号：US20100038733A1

    公开(公告)日：2010-02-18

    申请号：US12191857

    申请日：2008-08-14

    Applicant: Anthony Minervini

    Inventor： Anthony Minervini

    IPC: H01L23/12 ,  H01L23/48 ,  H01L21/02

    CPC classification number: B81B7/0048 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0109 ,  H01L2924/0002 ,  H04R1/04 ,  H04R2201/003 ,  H01L2924/00

    Abstract: A strain absorption bridge for use in a MEMS package includes a first substrate that is configured to be attachable to a circuit board. A first elastically deformable element is coupled to the first substrate and the first elastically deformable element is configured to be attachable to a MEMS device. Alternatively, the MEMS device may be attached to the first substrate. The elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.

    Abstract translation: 用于MEMS封装的应变吸收桥包括被配置为可附接到电路板的第一衬底。 第一可弹性变形的元件被耦合到第一基板，并且第一可弹性变形元件构造成可附接到MEMS装置。 或者，MEMS器件可以附接到第一衬底。 可弹性变形的元件至少部分地吸收并消散在机械应变到达MEMS装置之前从电路板传递的机械应变。

    Acoustic Assembly For A Transducer
    7.
    发明申请
    Acoustic Assembly For A Transducer 有权
    传感器声学组件

    公开(公告)号：US20060215874A1

    公开(公告)日：2006-09-28

    申请号：US11277695

    申请日：2006-03-28

    Applicant: Mekell Jiles ,  David Schafer ,  Anthony Minervini ,  Hanny Sunarto ,  Thomas Miller ,  Daniel Warren

    Inventor： Mekell Jiles ,  David Schafer ,  Anthony Minervini ,  Hanny Sunarto ,  Thomas Miller ,  Daniel Warren

    IPC: H04R17/02

    CPC classification number: H04R7/125 ,  H04R7/10 ,  H04R7/20 ,  H04R9/00 ,  H04R11/00 ,  H04R11/02 ,  H04R25/00 ,  H04R31/003 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T156/1052

    Abstract: An acoustic assembly for use in a transducer includes a multi-layer structure. A first layer member includes a first center portion, a first edge portion and a first aperture separating the first center portion and the first edge portion. A second layer member includes a second center portion, a second edge portion and a second aperture separating the second center portion and the second edge portion such that the second center portion is free to move relative to the second edge portion. The first and second layers are formed into an assembly wherein the first center portion and the second center portion are coupled, the first edge portion and the second edge portion are coupled, and the first aperture and the second aperture are substantially aligned to define a passageway. The assembly has an assembly stiffness that is greater than the stiffness of either the first or second layer members. A hinge joins the assembled first and second center portions and the first and second edge portions such that the assembled first and second center portions is free to at least partially rotate relative to the assembled first and second edge portions about an axis. A flexible layer member is coupled to the assembly and provides airtight sealing of the passageway.

    Abstract translation: 用于换能器的声学组件包括多层结构。 第一层构件包括第一中心部分，第一边缘部分和将第一中心部分和第一边缘部分分开的第一孔。 第二层构件包括第二中心部分，第二边缘部分和将第二中心部分和第二边缘部分分开的第二孔，使得第二中心部分相对于第二边缘部分自由移动。 第一和第二层被形成为组合件，其中第一中心部分和第二中心部分联接，第一边缘部分和第二边缘部分被联接，并且第一孔和第二孔基本上对准以限定通道 。 组件具有大于第一或第二层构件的刚度的组件刚度。 铰链将组装的第一和第二中心部分以及第一和第二边缘部分接合，使得组装的第一和第二中心部分相对于组装的第一和第二边缘部分围绕轴线自由地至少部分地旋转。 柔性层构件联接到组件并且提供通道的气密密封。

    Microphone Having Reduced Vibration Sensitivity
    9.
    发明申请
    Microphone Having Reduced Vibration Sensitivity 审中-公开
    降低振动灵敏度的麦克风

    公开(公告)号：US20120039499A1

    公开(公告)日：2012-02-16

    申请号：US13278580

    申请日：2011-10-21

    Applicant: William Ryan ,  Anthony Minervini ,  Michael John Abry

    Inventor： William Ryan ,  Anthony Minervini ,  Michael John Abry

    IPC: H04R1/00

    CPC classification number: H04R1/222 ,  H04R1/04

    Abstract: A microphone assembly includes a first transducer and a second transducer. The first transducer is coupled to a first substrate layer on a first side of the first substrate layer. The second transducer is coupled to a second substrate layer on a second side of the second substrate layer. The first side and the second side are opposite to each other. The first substrate layer and the second substrate layer are substantially parallel and mechanically coupled. The first transducer and the second transducer have a shared volume and this shared volume is one of a front volume or a rear volume.

    Abstract translation: 麦克风组件包括第一换能器和第二换能器。 第一传感器耦合到第一衬底层的第一侧上的第一衬底层。 第二传感器耦合到第二衬底层的第二侧上的第二衬底层。 第一面和第二面彼此相对。 第一基底层和第二基底层基本平行并机械耦合。 第一个传感器和第二个传感器具有共享音量，该共享音量是前音量或后音量之一。

    Microelectromechanical system assembly and method for manufacturing thereof
    10.
    发明申请
    Microelectromechanical system assembly and method for manufacturing thereof 审中-公开
    微机电系统组装及其制造方法

    公开(公告)号：US20070215962A1

    公开(公告)日：2007-09-20

    申请号：US11384599

    申请日：2006-03-20

    Applicant: Anthony Minervini ,  Peter Loeppert ,  William Ryan

    Inventor： Anthony Minervini ,  Peter Loeppert ,  William Ryan

    IPC: H01L29/82

    CPC classification number: B81B7/0064 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2924/19107 ,  H01L2924/00014

    Abstract: A microelectromechanical system (MEMS) assembly comprises a MEMS transducer, an integrated circuit (IC), and a substrate. The integrated circuit and the MEMS transducer are being electrically coupled to the substrate. The substrate may be a single layer or multiple layers. A coupling circuit resides in the substrate and may comprise a low pass filter (LPF) to provide a path to ground for undesirable co-propagating RF signals while allow direct current (DC) or low frequency signals to pass through the IC.

    Abstract translation: 微机电系统（MEMS）组件包括MEMS换能器，集成电路（IC）和基板。 集成电路和MEMS换能器电耦合到基板。 衬底可以是单层或多层。 耦合电路位于衬底中，并且可以包括低通滤波器（LPF），以提供用于不期望的共同传播RF信号的接地路径，同时允许直流（DC）或低频信号通过IC。

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