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    Robot for simultaneous substrate transfer
    21.
    发明授权
    Robot for simultaneous substrate transfer 有权

    公开(公告)号：US11117265B2

    公开(公告)日：2021-09-14

    申请号：US16922805

    申请日：2020-07-07

    Applicant: Applied Materials, Inc.

    Inventor： Paul Z. Wirth ,  Charles T. Carlson ,  Jason M. Schaller

    IPC: H01L21/687 ,  B25J11/00 ,  B25J9/12 ,  B25J9/00 ,  B25J9/04 ,  H01L21/677 ,  B25J15/00

    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

    HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS
    23.
    发明申请
    HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS 有权

    公开(公告)号：US20210013055A1

    公开(公告)日：2021-01-14

    申请号：US16922874

    申请日：2020-07-07

    Applicant: Applied Materials, Inc.

    Inventor： Jason M. Schaller ,  Steve Hongkham ,  Charles T. Carlson ,  Tuan A. Nguyen ,  Swaminathan T. Srinivasan ,  Khokan Chandra Paul

    IPC: H01L21/67 ,  H01L21/687

    Abstract: Exemplary substrate processing systems may include a factory interface and a load lock coupled with the factory interface. The systems may include a transfer chamber coupled with the load lock. The transfer chamber may include a robot configured to retrieve substrates from the load lock. The systems may include a chamber system positioned adjacent and coupled with the transfer chamber. The chamber system may include a transfer region laterally accessible to the robot. The transfer region may include a plurality of substrate supports disposed about the transfer region. Each substrate support of the plurality of substrate supports may be vertically translatable. The transfer region may also include a transfer apparatus rotatable about a central axis and configured to engage substrates and transfer substrates among the plurality of substrate supports. The chamber system may also include a plurality of processing regions vertically offset and axially aligned with an associated substrate support.

    Single Layer PCB Circuit Layout For Uniform Radial LED Array
    24.
    发明申请
    Single Layer PCB Circuit Layout For Uniform Radial LED Array 审中-公开

    公开(公告)号：US20200375027A1

    公开(公告)日：2020-11-26

    申请号：US16417886

    申请日：2019-05-21

    Applicant: Applied Materials, Inc.

    Inventor： Jason M. Schaller ,  Robert Brent Vopat ,  Paul E. Pergande

    IPC: H05K1/02

    Abstract: A system for heating substrates comprising LEDs arranged in a plurality of concentric circles is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed in a two-dimensional grid, where there are a set of rows, and each row comprises a plurality of LEDs configured in parallel. This configuration is fault tolerant, allowing one or more LEDs to be inoperable, without affecting any of the other LEDs. Further, the LEDs are arranged in concentric circles, allowing uniform heating of the substrate. Additionally, in certain embodiments, the LEDs and signal traces are arranged so that a single layer circuit board may be used. A method of creating this array of LEDs is also disclosed.

    MULTI-POSITION BATCH LOAD LOCK APPARATUS AND SYSTEMS AND METHODS INCLUDING SAME
    28.
    发明申请
    MULTI-POSITION BATCH LOAD LOCK APPARATUS AND SYSTEMS AND METHODS INCLUDING SAME 有权
    多位置负载锁定装置和系统及包括其中的方法

    公开(公告)号：US20140271054A1

    公开(公告)日：2014-09-18

    申请号：US14211123

    申请日：2014-03-14

    Applicant: Applied Materials, Inc.

    Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, JR. ,  Robert Mitchell

    IPC: H01L21/677 ,  H01L21/673

    CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

    Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

    Abstract translation: 公开了批量装载锁定装置的各种实施例。 批量装载锁定装置包括装载锁定体，其包括第一和第二装载锁定开口，在装载锁定体内的升降组件，升降组件包括多个晶圆台，多个晶片台中的每一个适于提供通过第一 和第二负载锁定开口，其中批量装载锁定装置包括温度控制能力（例如，加热或冷却）。 批量装载锁定装置能够将批次的晶片转入和移出各种处理室。 还提供了包括批量加载锁定装置和操作批量加载锁定装置的方法的系统，以及许多其它方面。

    Vacuum Sealed RF Resonator Cavity for LINAC
    29.
    发明申请
    Vacuum Sealed RF Resonator Cavity for LINAC 有权

    公开(公告)号：US20250142708A1

    公开(公告)日：2025-05-01

    申请号：US18384055

    申请日：2023-10-26

    Applicant: Applied Materials, Inc.

    Inventor： William H. Leavitt ,  William Herron Park, JR. ,  Jason M. Schaller

    IPC: H05H7/02 ,  H05H9/00

    Abstract: An RF resonator cavity that includes a resonator coil is disclosed. Unlike traditional RF resonator cavities, no sulfur hexafluoride is used in this cavity. Rather, the volume of the RF resonator cavity is pumped to vacuum conditions. This may be done using a vacuum system, or by hermetically sealing the cavity. This approach eliminates the use of a potent greenhouse gas, while maintaining the integrity of the cavity. Specifically, the dielectric strength of the vacuum is greater than that of sulfur hexafluoride. This RF resonator cavity may be deployed in a linear accelerator used to implant ions into a workpiece.

    Robot for simultaneous substrate transfer
    30.
    发明授权
    Robot for simultaneous substrate transfer 有权

    公开(公告)号：US12170220B2

    公开(公告)日：2024-12-17

    申请号：US17940369

    申请日：2022-09-08

    Applicant: Applied Materials, Inc.

    Inventor： Jason M. Schaller ,  Luke Bonecutter ,  Charles T. Carlson ,  Rajkumar Thanu ,  Karuppasamy Muthukamatchi ,  Jeff Hudgens ,  Benjamin Riordon

    IPC: H01L21/67 ,  B65G47/90 ,  H01L21/687

    Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.

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