公开(公告)号：US10403534B2

公开(公告)日：2019-09-03

申请号：US14536803

申请日：2014-11-10

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Wendell Boyd, Jr. ,  Matthew James Busche ,  Konstantin Makhratchev ,  Masanori Ono ,  Senh Thach

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/683

Abstract: Implementations described herein provide a pixelated substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a cooling base comprising the substrate support assembly, which in turn, allows both lateral and azimuthal tuning of a substrate processed on the substrate support assembly. A processing chamber having a pixelated substrate support assembly and method for processing a substrate using a pixelated substrate support assembly are also provided.

公开(公告)号：US20180374724A1

公开(公告)日：2018-12-27

申请号：US16115412

申请日：2018-08-28

Applicant: Applied Materials, Inc.

Inventor： Vijay Parkhe ,  Konstantin Makhratchev

IPC: H01L21/67 ,  H01L21/683 ,  F28F3/12

Abstract: An electrostatic chuck is described with independent zone cooling that leads to reduced crosstalk. In one example, the chuck includes a puck to carry a substrate for fabrication processes, and a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate.

公开(公告)号：US20180269098A1

公开(公告)日：2018-09-20

申请号：US15977718

申请日：2018-05-11

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noorbakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, JR.

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/6831 ,  Y10T156/10

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. Trenches are formed in the thermally conductive base approximately concentric around a center of the thermally conductive base. The trenches extend from the upper surface towards a lower surface of the thermally conductive base without contacting the lower surface of the thermally conductive base. The thermally conductive base includes thermal zones. The substrate support assembly further includes a thermally insulating material disposed in the trenches. The thermally insulating material in a trench of the trenches provides a degree of thermal isolation between two of the thermal zones separated by the trench at the upper surface of the thermally conductive base.

公开(公告)号：US10026636B2

公开(公告)日：2018-07-17

申请号：US15043179

申请日：2016-02-12

Applicant: Applied Materials, Inc.

Inventor： Konstantin Makhratchev ,  Jennifer Y. Sun

IPC: H01L21/683 ,  H01L21/67 ,  B23K10/00 ,  H01R43/16

Abstract: Embodiments of the invention generally relate to an electrostatic chuck having reduced power loss, and methods and apparatus for reducing power loss in an electrostatic chuck, as well as methods for testing and manufacture thereof. In one embodiment, an electrostatic chuck is provided. The electrostatic chuck includes a conductive base, and a ceramic body disposed on the conductive base, the ceramic body comprising an electrode and one or more heating elements embedded therein, wherein the ceramic body comprises a dissipation factor of about 0.11 to about 0.16 and a capacitance of about 750 picoFarads to about 950 picoFarads between the electrode and the one or more heating elements.