公开(公告)号：USD631184S1

公开(公告)日：2011-01-18

申请号：US29341132

申请日：2009-07-31

Applicant: Jia-Chi Feng ,  Cheng-Hung Yu

Designer： Jia-Chi Feng ,  Cheng-Hung Yu

公开(公告)号：USD619154S1

公开(公告)日：2010-07-06

申请号：US29311907

申请日：2009-07-29

Applicant: Jia-Chi Feng ,  Cheng-Hung Yu

Designer： Jia-Chi Feng ,  Cheng-Hung Yu

公开(公告)号：US20100000086A1

公开(公告)日：2010-01-07

申请号：US12168164

申请日：2008-07-07

Applicant: Cheng-Hung Yu ,  Chi-En Li

Inventor： Cheng-Hung Yu ,  Chi-En Li

IPC: H05K3/02

CPC classification number: H05K3/1258 ,  H05K1/0284 ,  H05K1/0306 ,  H05K3/048 ,  H05K3/107 ,  H05K3/4069 ,  H05K2201/09118 ,  H05K2203/0191 ,  H05K2203/0264 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: The present invention provides a method of making a molded interconnect device. The method includes the steps of: injection molding a plastic body having thereon at least one patterned circuit trench structure; and filling a conductive material into the patterned circuit trench structure thereby forming a circuit trace on the plastic body.

Abstract translation: 本发明提供一种制造模制互连装置的方法。 该方法包括以下步骤：对其上具有至少一个图案化电路沟槽结构的塑料体注塑; 并将导电材料填充到图案化电路沟槽结构中，从而在塑料体上形成电路迹线。

公开(公告)号：US20090294888A1

公开(公告)日：2009-12-03

申请号：US12128600

申请日：2008-05-28

Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu

Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu

IPC: H01L31/0216 ,  G03F7/20

CPC classification number: H01L27/14685 ,  G03F7/2022 ,  H01L27/14627 ,  H01L27/14643

Abstract: A method for fabricating an image sensor is disclosed. First, a semiconductor substrate is provided, in which a photosensitive region is defined on the semiconductor substrate. At least one photosensitive material is then formed on the semiconductor substrate, and a first exposure process is performed to form a tapered pattern in the photosensitive material. A second exposure process is performed to form a straight foot pattern in the photosensitive material, and a developing process is performed to remove the tapered pattern and straight foot pattern to form the photosensitive material into a plurality of photosensitive blocks. A reflow process is conducted thereafter to form the photosensitive blocks into a plurality of microlenses.

Abstract translation: 公开了一种用于制造图像传感器的方法。 首先，提供半导体衬底，其中光敏区被限定在半导体衬底上。 然后在半导体衬底上形成至少一种感光材料，并进行第一曝光处理以在感光材料中形成锥形图案。 执行第二曝光处理以在感光材料中形成直脚图案，并且进行显影处理以去除锥形图案和直脚图案以将感光材料形成为多个感光块。 此后进行回流处理以将感光块形成多个微透镜。

公开(公告)号：US20090124037A1

公开(公告)日：2009-05-14

申请号：US11939326

申请日：2007-11-13

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L31/0232

CPC classification number: H01L27/14685

Abstract: A fabricating process of an image sensor is provided. A substrate having thereon a circuit of the image sensor and an insulating layer is provided, wherein the insulating layer has therein a pad opening exposing a metal pad of the circuit. A filling layer is formed in the pad opening, and a color filter array is formed over the insulating layer. A planarization layer is formed over the substrate covering the color filter array, and a microlens array is formed on the planarization layer. The filling layer is then removed.

Abstract translation: 提供了图像传感器的制造工艺。 提供了其上具有图像传感器和绝缘层的电路的基板，其中绝缘层具有暴露电路的金属焊盘的焊盘开口。 填充层形成在焊盘开口中，并且在绝缘层上形成滤色器阵列。 在覆盖滤色器阵列的基板上形成平坦化层，在平坦化层上形成微透镜阵列。 然后取出填充层。

公开(公告)号：US06635844B2

公开(公告)日：2003-10-21

申请号：US09683467

申请日：2002-01-03

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: B23K2600

CPC classification number: B23K26/128 ,  B08B7/0042 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/12 ,  B23K26/123 ,  B23K26/127 ,  B23K26/142

Abstract: A stepper system, having an apparatus for on-line cleaning a wafer chuck by utilizing laser, has a wafer stage capable of moving horizontally along x-y directions and vertically along z direction, the wafer chuck, having a top surface contaminated by organic materials, fixed on the wafer stage, a laminar flow chamber used to isolate the wafer chuck during the cleaning of the wafer chuck, an excimer laser generation module, a laser beam delivery system and a projection lens system both for guiding the pulse laser to the contaminated top surface of the wafer chuck to decompose the organic materials thereon, and an inert gas supply for providing an inert gas flow to remove the decomposed organic materials from the top surface of the wafer chuck. A control system is further used to control the global or local cleaning of the contaminated top surface.

Abstract translation: 具有通过利用激光在线清洗晶片卡盘的装置的步进系统具有能够沿xy方向水平移动并且沿z方向垂直移动的晶片载台，具有被有机材料污染的顶面的晶片卡盘固定 在晶片台上，用于在清洁晶片卡盘期间隔离晶片卡盘的层流室，准分子激光产生模块，激光束传输系统和投影透镜系统，用于将脉冲激光引导到受污染的顶表面 的晶片卡盘以分解其上的有机材料，以及用于提供惰性气流以从晶片卡盘的顶表面去除分解的有机材料的惰性气体供应。 进一步使用控制系统来控制污染的顶部表面的全局或局部清洁。

公开(公告)号：US06623109B2

公开(公告)日：2003-09-23

申请号：US10171284

申请日：2002-06-13

Applicant: Tse-Chi Mou ,  Ying-Lun Chang ,  Cheng-Hung Yu ,  Chin-Yi Chou

Inventor： Tse-Chi Mou ,  Ying-Lun Chang ,  Cheng-Hung Yu ,  Chin-Yi Chou

IPC: B41J205

CPC classification number: B41J2/14072 ,  B41J2/14129 ,  B41J2202/03

Abstract: A structure of a printhead for raising its product acceptance rate and improving its quality is provided. The structure of a printhead includes a base layer, a pattern layer disposed on the base layer, a channel barrier layer having a dry film, an ink channel, a flow channel and plural ink cavities on the pattern layer, and a nozzle plate adhered to the dry film of the channel barrier layer by thermal compression. The pattern layer further includes a flow pattern and a base pattern surrounding a central location for forming thereabove the ink channel.

公开(公告)号：US20140027682A1

公开(公告)日：2014-01-30

申请号：US13561103

申请日：2012-07-30

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: G02B5/23 ,  B05D5/06

CPC classification number: G02B5/201 ,  G03F7/0007

Abstract: A method for manufacturing a color filter array having hybrid color filters includes providing a high-grade photoresist and a low-grade photoresist, forming a plurality of first color filters on a substrate, and forming a plurality of second color filters and a plurality of third color filters on the substrate. The first color filters include the high-grade photoresist, and the second color filters and the third color filters include the low-grade photoresist. The high-grade photoresist of the first color filters includes a first amount of large size pigments in one unit area and the low-grade photoresists of the second color filters and the third color filters include a second amount of large size pigments in one unit area. A ratio of the second amount to the first amount is equal to or larger than

Abstract translation: 一种制造具有混合滤色器的滤色器阵列的方法，包括提供高级光致抗蚀剂和低等级光致抗蚀剂，在衬底上形成多个第一滤色器，以及形成多个第二滤色器和多个第三滤色器 基底上的滤色器。 第一滤色器包括高级光致抗蚀剂，第二滤色器和第三滤色器包括低等级光致抗蚀剂。 第一滤色器的高级光致抗蚀剂包括在一个单位面积中的第一量的大尺寸颜料和第二滤色器的低等级光致抗蚀剂和第三滤色器在一个单位面积中包括第二量的大尺寸颜料 。 第二量与第一量的比例等于或大于

公开(公告)号：US20120261731A1

公开(公告)日：2012-10-18

申请号：US13084558

申请日：2011-04-12

Applicant: Cheng-Hung Yu

Inventor： Cheng-Hung Yu

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/14621 ,  H01L27/14685

Abstract: An image sensor is disclosed. The image sensor includes a substrate, at least a color filter, and a microlens disposed on the color filter. The substrate includes a passivation layer thereon, and the color filter is disposed on the passivation layer, in which the color filter is truncated.

Abstract translation: 公开了一种图像传感器。 图像传感器包括基板，至少滤色器和布置在滤色器上的微透镜。 衬底上包括钝化层，并且滤色器设置在钝化层上，滤色器被截断。

公开(公告)号：US08084289B2

公开(公告)日：2011-12-27

申请号：US12714093

申请日：2010-02-26

Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

IPC: H01L21/00

CPC classification number: H01L27/14687 ,  H01L27/14636 ,  H01L27/14685

Abstract: A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region are sequentially formed on the substrate. A color filter array is formed on the first planarization layer in the pixel array region. A second planarization layer is formed to cover the color filter array and filled into the opening. A plurality of microlens is formed above the color filter array on the second planarization layer. A capping layer is conformally formed on the microlens and the second planarization layer. An etching step is performed to remove the capping layer and the second planarization layer in the opening so as to expose the patterned metal layer in the pad region.

Abstract translation: 提供一种制造图像传感器装置的方法。 首先，提供包括像素阵列区域和衬垫区域的衬底。 图案化金属层和具有露出焊盘区域中的图案化金属层的开口的第一平坦化层依次形成在基板上。 在像素阵列区域中的第一平坦化层上形成滤色器阵列。 形成第二平坦化层以覆盖滤色器阵列并填充到开口中。 在第二平坦化层上的滤色器阵列上方形成多个微透镜。 覆盖层保形地形成在微透镜和第二平坦化层上。 执行蚀刻步骤以去除开口中的覆盖层和第二平坦化层，以暴露焊盘区域中的图案化金属层。