公开(公告)号：US20150144316A1

公开(公告)日：2015-05-28

申请号：US14402195

申请日：2013-07-08

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki

IPC: C09K5/14 ,  B29D7/01 ,  B29C47/00

CPC classification number: C09K5/14 ,  B29C43/02 ,  B29C47/0019 ,  B29C47/004 ,  B29C47/0066 ,  B29C47/0869 ,  B29C2793/0027 ,  B29D7/01 ,  B29K2083/005 ,  B29K2505/00 ,  B29K2507/04 ,  B29K2509/02 ,  B29K2509/08 ,  B29K2995/0013 ,  C08J5/18 ,  C08J2383/04 ,  C08J2383/05 ,  C08J2383/07 ,  F28F21/02 ,  H01L21/4878 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K7/20481 ,  Y10T428/31663 ,  H01L2924/00

Abstract: A method of producing a heat conductive sheet includes: a step (A) of dispersing a fibrous filler and a spherical filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition; a step (C) of slicing the formed molded block to a desired thickness to form a sheet; and a step (D) of pressing the sliced surface of the formed sheet, the sliced surface being pressed such that the thermal resistance value of the sheet after pressing becomes lower than the thermal resistance value of the sheet before pressing.

Abstract translation: 制造导热片的方法包括：将纤维填料和球形填料分散在粘合剂树脂中以制备导热片形成组合物的步骤（A）; 使用所制备的导热片形成组合物形成模制块的步骤（B）; 将所形成的模制块切割成所需厚度以形成片材的步骤（C）; 以及压制成形片的切片表面的步骤（D），被切割的表面被按压，使得压制后的片材的热阻值低于压制前的片材的热电阻值。

公开(公告)号：US20150118505A1

公开(公告)日：2015-04-30

申请号：US14404741

申请日：2013-07-05

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki

IPC: B29C47/08 ,  H01L23/373 ,  C09K5/14 ,  B29D7/01 ,  C08J5/18 ,  H05K7/20 ,  F28F21/02

CPC classification number: C09K5/14 ,  B29C43/02 ,  B29C48/0011 ,  B29C48/0022 ,  B29C48/07 ,  B29C48/267 ,  B29C2793/0027 ,  B29D7/01 ,  B29K2083/005 ,  B29K2505/00 ,  B29K2507/04 ,  B29K2509/02 ,  B29K2509/08 ,  B29K2995/0013 ,  C08J5/18 ,  C08J2383/04 ,  C08J2383/05 ,  C08J2383/07 ,  F28F21/02 ,  H01L21/4878 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K7/20481 ,  Y10T428/31663 ,  H01L2924/00

Abstract: A method of producing a heat conductive sheet without using a high-cost magnetic field generator. This is achieved by allowing a large amount of a fibrous filler to be contained in a thermosetting resin composition, so that good heat conductivity is obtained without applying a load that may interfere with the normal operation of a heat generating body and a radiator to the heat generating body and the radiator when the heat conductive sheet is disposed therebetween. The method includes: a step (A) of dispersing a fibrous filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition according to an extrusion molding method or a die molding method; a step (C) of slicing the formed molded block into a sheet; and a step (D) of pressing the sliced surface of the obtained sheet.

Abstract translation: 不使用高成本磁场发生器的制造导热片的方法。 这是通过在热固性树脂组合物中含有大量的纤维状填料来实现的，从而在不施加可能干扰发热体和散热器对热量的正常运行的负荷的情况下获得良好的导热性 发热体和散热器。 该方法包括：将纤维填料分散在粘合剂树脂中以制备导热片形成组合物的步骤（A）; 使用所制备的导热片形成用组合物根据挤出成型法或模压成型法形成模塑块的工序（B）; 将所形成的模制块切割成片材的步骤（C）; 以及压制所得片材的切片面的工序（D）。

公开(公告)号：US11597196B2

公开(公告)日：2023-03-07

申请号：US17424596

申请日：2020-01-21

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke Kubo ,  Keisuke Aramaki

IPC: B32B37/18 ,  B32B7/027 ,  B29C70/58 ,  B32B27/20 ,  B32B27/28 ,  B29K83/00 ,  B29K307/04 ,  B29L7/00 ,  F28F21/06 ,  H01L23/373

Abstract: A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm2/W or less.

公开(公告)号：US11296007B2

公开(公告)日：2022-04-05

申请号：US16069946

申请日：2017-01-13

Applicant: Dexerials Corporation

Inventor： Hiroki Kanaya ,  Shinichi Uchida ,  Keisuke Aramaki

IPC: H01L23/367 ,  H01L23/373 ,  C08K9/08 ,  C08K3/28 ,  H01L23/42 ,  C08K3/22 ,  C08L83/04 ,  B32B27/28 ,  B32B38/00 ,  H01L21/48

Abstract: Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.

公开(公告)号：US10672682B2

公开(公告)日：2020-06-02

申请号：US16072671

申请日：2017-01-13

Applicant: Dexerials Corporation

Inventor： Hiroki Kanaya ,  Shinichi Uchida ,  Shunsuke Uchida ,  Gupta Rishabh ,  Keisuke Aramaki

IPC: H01L23/00 ,  H01L23/373 ,  B29C48/08 ,  C08K7/06 ,  C08K3/00 ,  B29C48/00 ,  C08K9/00 ,  B29C48/07 ,  C09D183/04 ,  C08K9/08 ,  C08L83/04 ,  C08K3/28 ,  C08K9/04 ,  C08K3/22 ,  B29C39/00 ,  C08L101/00 ,  H01L23/42 ,  D04H1/4242 ,  H01L23/367 ,  B29L31/18 ,  B29K105/16 ,  B29K509/02 ,  B29K101/10 ,  B29K83/00 ,  C08G77/12 ,  B29K105/24 ,  C08G77/20 ,  B29K509/04 ,  B29K86/00 ,  B81B3/00

Abstract: A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.

公开(公告)号：US10526519B2

公开(公告)日：2020-01-07

申请号：US16072334

申请日：2017-01-13

Applicant: Dexerials Corporation

Inventor： Hiroki Kanaya ,  Yu Nomura ,  Shunsuke Uchida ,  Shinichi Uchida ,  Keisuke Aramaki

IPC: H01L23/34 ,  C09K5/14 ,  C08K3/04 ,  H01L23/373 ,  C08J5/18 ,  C08K3/22 ,  C08K3/28 ,  C08K7/06 ,  H01L23/367 ,  H01L23/00 ,  H01L23/42

Abstract: A thermal conducting sheet including: a binder resin; carbon fibers; and a thermal conducting filler other than the carbon fibers, wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30, wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.

公开(公告)号：US20190055443A1

公开(公告)日：2019-02-21

申请号：US16072334

申请日：2017-01-13

Applicant: Dexerials Corporation

Inventor： Hiroki Kanaya ,  Yu Nomura ,  Shunsuke Uchida ,  Shinichi Uchida ,  Keisuke Aramaki

IPC: C09K5/14 ,  C08K3/04 ,  C08K7/06 ,  C08K3/22 ,  C08K3/28 ,  C08J5/18 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373

Abstract: A thermal conducting sheet including: a binder resin; carbon fibers; and a thermal conducting filler other than the carbon fibers, wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30, wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.

公开(公告)号：US09308695B2

公开(公告)日：2016-04-12

申请号：US14323313

申请日：2014-07-03

Applicant: DEXERIALS CORPORATION

Inventor： Hiroyuki Usui ,  Keisuke Aramaki

IPC: B06B1/00 ,  B29C47/00 ,  B29D7/00 ,  B29D7/01 ,  C08J5/18 ,  H01L23/373 ,  C08K7/06 ,  C08L83/04 ,  C08K3/22 ,  C08L83/14 ,  B26D1/08 ,  B26D7/08 ,  B26D3/28 ,  C08K7/18 ,  B29C35/02 ,  B29C47/10 ,  B29C47/88 ,  B29C70/62 ,  B29C70/14 ,  C08K3/04 ,  C08G77/12 ,  C08G77/20 ,  C08K5/56 ,  B29K509/00 ,  B29L7/00 ,  B29L31/18

CPC classification number: B29D7/01 ,  B26D1/08 ,  B26D3/28 ,  B26D7/086 ,  B29C35/02 ,  B29C47/0004 ,  B29C47/0019 ,  B29C47/0021 ,  B29C47/0066 ,  B29C47/1027 ,  B29C47/8805 ,  B29C70/14 ,  B29C70/62 ,  B29K2509/00 ,  B29K2883/00 ,  B29K2995/0013 ,  B29K2995/0044 ,  B29K2995/0073 ,  B29L2007/00 ,  B29L2031/18 ,  C08G77/12 ,  C08G77/20 ,  C08J5/18 ,  C08J2383/04 ,  C08J2383/05 ,  C08J2383/07 ,  C08K3/04 ,  C08K3/22 ,  C08K5/56 ,  C08K7/06 ,  C08K7/18 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/005 ,  C08L83/04 ,  C08L83/14 ,  C08L2205/025 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/8385 ,  H01L2924/0002 ,  Y10T428/24 ,  Y10T428/24355 ,  Y10T428/24488 ,  Y10T428/24777 ,  Y10T428/268 ,  C08L83/00 ,  H01L2924/00

Abstract: A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.

Abstract translation: 导热片具有低表面粗糙度的切割表面，因此在界面处显示降低的热阻，并且在厚度方向上具有高导热性。 因此，导热片可以插入在各种热源和辐射构件中的任一种之间。 制造导热片的方法至少包括：挤出成型步骤，其中使用挤出机挤出含有聚合物，各向异性导热填料和填料的导热组合物，从而模制挤出成型产品，其中 各向异性导热填料沿挤出方向取向; 固化步骤，其中挤出成型产品被固化以获得固化物体; 以及切割步骤，其中固化物体在与挤出方向垂直的方向上用超声波切割机切割成给定厚度。

公开(公告)号：US20150166771A1

公开(公告)日：2015-06-18

申请号：US14401954

申请日：2013-07-05

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke Aramaki ,  Takuhiro Ishii

IPC: C08K7/06 ,  C08K3/28 ,  C08K3/22

CPC classification number: C08K7/06 ,  C08J5/042 ,  C08J2383/02 ,  C08K3/22 ,  C08K3/28 ,  C08K7/18 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/003 ,  C08L83/04 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat conductive sheet is provided in which the frequency of contact between fibrous fillers is high. In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal operation of a heat generating body and a heat dissipator to the heat generating body and the heat dissipator when the heat conductive sheet is disposed therebetween. The heat conductive sheet contains fibrous fillers and a binder resin, and the ratio of the fibrous fillers that are oriented in the direction of the thickness of the heat conductive sheet in all the fibrous fillers is 45 to 95%.

Abstract translation: 提供了一种导热片，其中纤维填料之间的接触频率高。 在导热片中，纤维状填料的露出端部不会露出而嵌入片材，不需要施加可能干扰发热体和散热器正常工作的负荷 发热体和散热器。 导热片含有纤维状填料和粘合剂树脂，所有纤维状填料中的导热性片的厚度方向的纤维填料的比例为45〜95％。