公开(公告)号：US20180047507A1

公开(公告)日：2018-02-15

申请号：US15550672

申请日：2016-02-25

Applicant: Epcos AG

Inventor： Markus Koini ,  Christoph Auer ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Thomas Wippel

IPC: H01G4/228 ,  H05K1/18 ,  H01G4/30

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01R43/26 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

公开(公告)号：US09873952B2

公开(公告)日：2018-01-23

申请号：US14406622

申请日：2013-05-28

Applicant: EPCOS AG

Inventor： Franz Rinner ,  Christoph Auer ,  Christian Hoffmann

IPC: H01G7/00 ,  C25D13/12 ,  H01G4/232 ,  H01L41/047 ,  H01L41/293 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01L41/09 ,  H01L41/273

CPC classification number: C25D13/12 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/0471 ,  H01L41/0472 ,  H01L41/09 ,  H01L41/273 ,  H01L41/293

Abstract: A method of producing a ceramic component includes a) providing a main body having internal electrodes, outer edges of which are located on at least one first outer surface of the main body, b) contacting the first outer surface of the main body with a composition including an electrophoretically mobile insulating material and electrophoretically depositing the insulating material on outer edges of the internal electrodes on the first outer surface of the main body, and c) producing an insulating layer from the insulating material on the outer edges of the internal electrodes.

公开(公告)号：US09693482B2

公开(公告)日：2017-06-27

申请号：US14646444

申请日：2013-10-29

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Franz Rinner

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/498 ,  H01L33/64 ,  H01L25/16 ,  H01L23/367 ,  H01L23/373 ,  H01L23/00

CPC classification number: H05K7/205 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/32 ,  H01L25/16 ,  H01L25/167 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/023 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor component on a carrier body that includes a ceramic body and a thermistor sensor structure directly connected to the ceramic body. The thermistor sensor structure is integrated into the carrier body and includes a heat sink, on which the carrier body is mounted.

公开(公告)号：US20150243880A1

公开(公告)日：2015-08-27

申请号：US14706728

申请日：2015-05-07

Applicant: EPCOS AG

Inventor： Franz Rinner ,  Dieter Somitsch ,  Jan-Thorsten Reszat ,  Reinhard Gabl ,  Martin Galler ,  Christoph Auer ,  Georg Kuegerl

IPC: H01L41/313 ,  H01L41/311 ,  C23C4/08 ,  H01L41/293 ,  C23C4/12 ,  C23C4/02

CPC classification number: H01L41/313 ,  C23C4/02 ,  C23C4/08 ,  C23C4/12 ,  C23C4/129 ,  C23C4/131 ,  C23C4/134 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/29 ,  H01L41/293 ,  H01L41/311 ,  Y10T29/42 ,  Y10T156/10

Abstract: A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified.

Abstract translation: 多层设计的压电致动器包括借助于通过热喷涂施加的粘结层而被固定的外部电极。 例如，外部电极形成为编织线织物。 此外，规定了用于紧固压电致动器中的外部电极的方法。

公开(公告)号：US20150022055A1

公开(公告)日：2015-01-22

申请号：US14380670

申请日：2013-02-19

Applicant: EPCOS AG

Inventor： Dieter Somitsch ,  Franz Rinner ,  Martin Galler ,  Johann Ramler ,  Reinhard Gabl ,  Sebastian Brunner

IPC: H01L41/047 ,  H01L41/293

CPC classification number: H01L41/0472 ,  H01G4/232 ,  H01G4/252 ,  H01G4/30 ,  H01G4/306 ,  H01G4/308 ,  H01G4/33 ,  H01G13/006 ,  H01L24/27 ,  H01L41/083 ,  H01L41/273 ,  H01L41/293 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435

Abstract: A method for producing an electric contact-connection of a multilayer component is specified. A main body has internal electrode layers, a insulating material, an electrically conductive material and a photosensitive material are provided. The insulating material and the electrically conductive material are arranged in a structured manner on an outer side of the multilayer component for the alternate contact-connection of the internal electrode layers. The structured arrangement is produced by the photosensitive material. A multilayer component comprising such a contact-connection is furthermore specified.

Abstract translation: 规定了多层部件的电接触连接的制造方法。 主体具有内部电极层，绝缘材料，导电材料和感光材料。 绝缘材料和导电材料以结构化方式布置在用于内部电极层的交替接触连接的多层部件的外侧上。 结构化布置由感光材料制成。 还规定了包括这种接触连接的多层部件。

公开(公告)号：US11342126B2

公开(公告)日：2022-05-24

申请号：US15553430

申请日：2015-12-21

Applicant: Epcos AG

Inventor： Markus Koini ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Georg Kügerl ,  Thomas Wippel

IPC: H01G4/38 ,  H01G2/06 ,  H01G4/232 ,  H01G4/228 ,  H01G4/30 ,  H05K1/18 ,  H01G4/248 ,  H01R43/26

Abstract: An electrical component having partial bodies, a base on which the partial bodies are arranged, and at least one connection contact for electrically connecting the partial bodies to a carrier. A method for producing an electrical component having one or more partial bodies is also disclosed.

公开(公告)号：US10943740B2

公开(公告)日：2021-03-09

申请号：US16447639

申请日：2019-06-20

Applicant: Epcos AG

Inventor： Markus Koini ,  Christoph Auer ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Thomas Wippel

IPC: H01G4/38 ,  H01G2/06 ,  H01G4/232 ,  H01G4/228 ,  H01G4/30 ,  H05K1/18 ,  H01G4/248 ,  H01R43/26

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

公开(公告)号：US20190304702A1

公开(公告)日：2019-10-03

申请号：US16447639

申请日：2019-06-20

Applicant: Epcos AG

Inventor： Markus Koini ,  Christoph Auer ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Thomas Wippel

IPC: H01G4/38 ,  H01R43/26 ,  H01G4/248 ,  H05K1/18 ,  H01G4/232 ,  H05K3/34 ,  H01G4/228 ,  H01G2/06 ,  H01G4/30

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

公开(公告)号：US20190131208A1

公开(公告)日：2019-05-02

申请号：US16095636

申请日：2017-02-16

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Franz Rinner ,  Günter Pudmich ,  Werner Rollett ,  Michael Weilguni

IPC: H01L23/373 ,  H01L23/498 ,  H05K1/03 ,  H01L33/62 ,  F21S41/141 ,  B60Q1/04

Abstract: A multi-layer carrier system and a method for producing a multi-layer carrier system are disclosed. In an embodiment a multi-layer carrier system includes at least one multi-layer ceramic substrate and at least one matrix module of heat-producing semiconductor components, wherein the semiconductor components are arranged on the multi-layer ceramic substrate, and wherein the matrix module is electrically conductively connected to a driver circuit by way of the multi-layer ceramic substrate.

公开(公告)号：US10204722B2

公开(公告)日：2019-02-12

申请号：US15312503

申请日：2015-05-18

Applicant: EPCOS AG

Inventor： Franz Rinner ,  Yongli Wang

IPC: H01C7/10 ,  H01C1/142 ,  H01C7/102 ,  H01C7/105 ,  H01C1/14 ,  H01C17/00

Abstract: An electronic component and a method for producing an electrical component are disclosed. In an embodiment, the electronic component includes a functional body having a first surface and a second surface, wherein the second surface faces away from the first surface, and a contact electrically linked to the first surface, the contact having an edge region and a central region, wherein the functional body has a first electrical resistance between the first surface and the second surface in a first functional body portion, which overlaps the edge region of the contact as viewed in a plan view of the electronic component, that is greater than a second electrical resistance between the first surface and the second surface in a second functional body portion, which overlaps the central region of the contact as viewed in a plan view of the electronic component.