公开(公告)号：US20130241398A1

公开(公告)日：2013-09-19

申请号：US13874132

申请日：2013-04-30

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Yi-Jui HUANG ,  Meng-Yuan HONG ,  Ming-Chi HSU

IPC: H05B33/12

CPC classification number: H05B33/12 ,  H01L33/501 ,  H01L33/507 ,  Y10T428/249986

Abstract: A wavelength conversion structure comprises a phosphor layer comprising a first part and a second part formed on the first part, wherein the first part and the second part have a plurality of pores, a first material layer formed in the plurality of pores of the first part, a second material layer formed in the plurality of pores of the second part and a plurality of phosphor particles, wherein the plurality of phosphor particles is distributed in the first material layer and the second material layer.

Abstract translation: 波长转换结构包括荧光体层，其包括形成在第一部分上的第一部分和第二部分，其中第一部分和第二部分具有多个孔，第一部分层形成在第一部分的多个孔中 形成在第二部分的多个孔中的第二材料层和多个荧光体颗粒，其中多个荧光体颗粒分布在第一材料层和第二材料层中。

公开(公告)号：US20240405181A1

公开(公告)日：2024-12-05

申请号：US18733304

申请日：2024-06-04

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Wei-Yu CHEN ,  Li-Shen TANG ,  Kun-Wei KAO ,  Jia-Xing CHUNG ,  Wei-Shan HU ,  Ching-Tai CHENG ,  Chang-Tai HSIAO ,  Yih-Hua RENN ,  Chun-Yen WU

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/40

Abstract: An embodiment of the present disclosure provides a semiconductor device arrangement. This arrangement includes a substrate, an adhesive structure, and a first semiconductor device. The substrate includes an upper surface. The adhesive structure is located on the upper surface and includes a first concave region. The first semiconductor device includes a lower surface facing toward the adhesive structure and a conductive bump located under the lower surface and in the first concave region. The conductive bump includes a first portion and a second portion. Wherein the lower surface does not contact the adhesive structure, the first portion contacts the first concave region, and the second portion does not contact the first concave region.

公开(公告)号：US20240405002A1

公开(公告)日：2024-12-05

申请号：US18734838

申请日：2024-06-05

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Chang-Tai HSIAO

IPC: H01L25/075 ,  H01L23/00

Abstract: An embodiment of the present disclosure provides a semiconductor device arrangement. This semiconductor device arrangement includes a substrate and a plurality of semiconductor devices. The substrate includes an upper surface. The plurality of semiconductor devices is separately and staggered located on the upper surface, and includes a first semiconductor device and a second semiconductor device. Wherein the first semiconductor device includes a first interior angle, the second semiconductor device includes a second interior angle, and there is a minimum distance between the first interior angle and the second interior angle among the plurality of semiconductor devices, wherein the minimum distance is between 3 μm 25 μm.

公开(公告)号：US20240332264A1

公开(公告)日：2024-10-03

申请号：US18615912

申请日：2024-03-25

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Kun-Wei KAO ,  Teng-Hui HSIEH

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/62

Abstract: A pixel package includes a first light-emitting diode, a second light-emitting diode, a third light-emitting diode, a transparent layered structure, and a first conductive structure. The first light-emitting diode has a first light-emitting surface and a first bottom surface opposite thereto, and the first light-emitting diode is arranged side by side with the second light-emitting diode over the first light-emitting surface. The transparent layered structure encapsulates and separates the first light-emitting diode, the second light-emitting diode, and the third light-emitting diode. The first conductive structure has a first portion and a second portion. The first portion is located between the first light-emitting diode and the first light-emitting surface. The second portion is located under the first portion and is exposed from the transparent layered structure. In a plan view, the third light-emitting diode is respectively overlapped with the first light-emitting diode and the second light-emitting diode.

公开(公告)号：US20240234660A1

公开(公告)日：2024-07-11

申请号：US18433367

申请日：2024-02-05

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: This disclosure discloses a method of manufacturing a light-emitting device includes steps of providing a first substrate with a plurality of first light-emitting elements and adhesive units arranged thereon, providing a second substrate with a first group of second light-emitting elements and a second group of second light-emitting elements arranged thereon, and connecting the a second group of second light-emitting elements and the adhesive units. The first light-emitting elements and the first group of second light-emitting elements are partially or wholly overlapped with each other during connecting the second group of second light-emitting elements and the adhesive units.

公开(公告)号：US20240203920A1

公开(公告)日：2024-06-20

申请号：US18537508

申请日：2023-12-12

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Jan-Way CHIEN

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L2224/0347 ,  H01L2224/03848 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05624 ,  H01L2224/11515 ,  H01L2224/13016 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1403

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first electrode and a second electrode disposed on a substrate, a first conductive bump disposed on the first electrode, and a second conductive bump disposed on the second electrode, wherein, the first conductive bump has a first convex top surface, the second conductive bump has a second convex top surface, and the top of the first convex top surface and the top of the second convex top surface substantially have a same horizontal height. The composition of the first electrode includes a first metal. The composition of the first conductive bump includes the first metal and a second metal. The content of the first metal in the first conductive bump is gradually decreased in a direction away from the first electrode.

公开(公告)号：US20240186449A1

公开(公告)日：2024-06-06

申请号：US18396320

申请日：2023-12-26

Applicant: Epistar Corporation

Inventor： Min-Hsun HSIEH ,  Yu-Tsu LEE ,  Wei-Jen HSUEH

IPC: H01L33/30 ,  H01L27/15 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L33/30 ,  H01L27/156 ,  H01L33/0062 ,  H01L33/62

Abstract: The present disclosure provides a semiconductor device including a semiconductor structure, a first metal element-containing structure, and a layer. The semiconductor structure includes a first semiconductor layer having a first material, a second semiconductor layer, an active region between the first semiconductor layer and the second semiconductor layer. The first metal element-containing structure is located on the semiconductor structure and includes a first metal element. The layer has a second material and a second metal element and is located between the first semiconductor layer and the first metal element-containing structure. The first material has a conduction band edge Ec and a valence band edge Ev, and the second material has a work function WF1, when the first semiconductor layer is of an n-type conductivity, the work function WF1 fulfills WF1 (Ec+Ev)/2.

公开(公告)号：US20240145650A1

公开(公告)日：2024-05-02

申请号：US18407075

申请日：2024-01-08

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Shau-Yi CHEN ,  Tzu-Yuan LIN ,  Wei-Chiang HU ,  Pei-Hsuan LAN ,  Min-Hsun HSIEH

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L27/156 ,  H01L33/62

Abstract: A package comprises a substrate including a first surface, and an upper conductive layer arranged on the first surface, a first light-emitting unit arranged on the upper conductive layer, and comprises a first semiconductor layer, a first substrate, a first light-emitting surface and a first side wall, a second light-emitting unit, which is arranged on the upper conductive layer, and comprises a second light-emitting surface and a second side wall, a light-transmitting layer arranged on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit, a light-absorbing layer, which is arranged between the substrate and the light-transmitting layer in a continuous configuration of separating the first light-emitting unit and the second light-emitting unit from each other, and a reflective wall arranged on the first side wall, wherein a height of the reflective wall is lower than that of the light-absorbing layer.

公开(公告)号：US20230119631A1

公开(公告)日：2023-04-20

申请号：US17962207

申请日：2022-10-07

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/38 ,  H01L33/00

Abstract: A semiconductor device includes a semiconductor stack, a protective layer on the semiconductor stack, an electrode on the semiconductor stack and electrically connected to the semiconductor stack, and a conductive bump on the electrode. The thickness of the conductive bump is measured from the topmost point of the conductive bump to the uppermost surface of the protective layer. The ratio of the thickness of the conductive bump to the maximum width of the conductive bump is between 0.1 and 0.4.

公开(公告)号：US20230048631A1

公开(公告)日：2023-02-16

申请号：US17400640

申请日：2021-08-12

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Min-Hsun HSIEH ,  Chun-Wei CHEN

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/15 ,  H01L33/56 ,  H01L33/48

Abstract: A display device includes LEDs, a circuit board, an insulating layer, conductive posts, a control conductive plate, and a common conductive strip. The circuit board includes first pads and a second pad surrounding the first pads. The LEDs are on an insulating layer covering the first pads, each including a first and second electrode pad. The conductive posts are on and connected to a first portion of the first pads, and penetrate the insulation layer. The control conductive plate is electrically connected to one of the first electrode pads and the conductive posts. The common conductive strip is on the insulation layer and electrically connected to the second pad and a second electrode pad. Each first electrode pad is electrically connected to the first pads. A second portion of the first pads is completely covered by the insulation layer and overlapped with the common conductive strip and the insulation layer.