公开(公告)号：US20200212012A1

公开(公告)日：2020-07-02

申请号：US16639085

申请日：2017-09-30

Applicant: Intel Corporation

Inventor： Preston T. MEYERS ,  Javier A. FALCON ,  Shawna M. LIFF ,  Joe R. SAUCEDO ,  Adel A. ELSHERBINI ,  Albert S. LOPEZ ,  Johanna M. SWAN

IPC: H01L25/065 ,  H01L25/00

Abstract: A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package has interconnects electrically coupling at least one of the top surface and the bottom surface of each substrate to at least one of the top surface and the bottom surface of another substrate. The device package has pillars disposed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates. The device package also has adhesive layers formed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates.

公开(公告)号：US20190113545A1

公开(公告)日：2019-04-18

申请号：US16096968

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Jelena CULIC-VISKOTA ,  Thomas L. SOUNART ,  Feras EID ,  Sasha N. OSTER

IPC: G01R15/20 ,  H01L41/06 ,  H01L41/12

Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.

公开(公告)号：US20190036774A1

公开(公告)日：2019-01-31

申请号：US16152280

申请日：2018-10-04

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H04L12/24 ,  A61B5/0205 ,  A61B5/00 ,  H01H57/00 ,  H01L41/047 ,  H01L41/187

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US20190036002A1

公开(公告)日：2019-01-31

申请号：US16072166

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Feras EID ,  Aleksandar ALEKSOV ,  Sasha N. OSTER ,  Baris BICEN ,  Thomas L. SOUNART ,  Johanna M. SWAN ,  Adel A. ELSHERBINI ,  Valluri R. RAO

IPC: H01L41/09 ,  G02F1/01 ,  H01L27/32 ,  F21S10/02 ,  H01L41/22 ,  H01L51/00

Abstract: Embodiments of the invention include piezoelectrically driven switches that are used for modifying a background color or light source color in display systems, and methods of forming such devices. In an embodiment, a piezoelectrically actuated switch for modulating a background color in a display may include a photonic crystal that has a plurality of blinds oriented substantially perpendicular to a surface of the display. In an embodiment, the blinds include a black surface and a white surface. The switch may also include an anchor spaced away from an edge of the photonic crystal and a piezoelectric actuator formed on the surface of the anchor and a surface of the photonic crystal. Some embodiments may include a photonic crystal that is a multi-layer polymeric structure or a polymer chain with a plurality of nanoparticles spaced at regular intervals on the polymer chain.

公开(公告)号：US20190033500A1

公开(公告)日：2019-01-31

申请号：US16072173

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Thomas L. SOUNART ,  Baris BICEN ,  Feras EID ,  Sasha N. OSTER ,  Aleksandar ALEKSOV ,  Shawna M. LIFF ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: G02B5/18 ,  G02B26/08 ,  H01L41/09

Abstract: Embodiments of the invention include an optical grating switch integrated into an organic substrate and methods of forming such devices. According to an embodiment, the optical grating switch may include a cavity formed into an organic substrate. Additionally, the optical grating switch may include an array of moveable beams anchored to the organic substrate and suspended over the cavity. In an embodiment of the invention, each of the moveable beams in the optical grating switch may include a piezoelectric region formed over end portions of the moveable beam and a top electrode formed over a top surface of each of the piezoelectric regions. In order to reflect or diffract light, embodiments of the invention may include moveable beams that include a reflective surface formed over a central portion of the moveable beam.

公开(公告)号：US20180286687A1

公开(公告)日：2018-10-04

申请号：US15476842

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： Sasha N. OSTER ,  Fay HUA ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Henning BRAUNISCH ,  Johanna M. SWAN

IPC: H01L21/285 ,  H01L21/768 ,  H01L21/033 ,  G03F7/16 ,  B82Y40/00

CPC classification number: H01L21/28562 ,  B82Y40/00 ,  H01L21/033 ,  H01L21/76822 ,  H01L21/76834

Abstract: Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.

公开(公告)号：US20180145031A1

公开(公告)日：2018-05-24

申请号：US15876080

申请日：2018-01-19

Applicant: Intel Corporation

Inventor： Henning BRAUNISCH ,  Chia-Pin CHIU ,  Aleksandar ALEKSOV ,  Hinmeng AU ,  Stefanie M. LOTZ ,  Johanna M. SWAN ,  Sujit SHARAN

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H01L25/065 ,  H01L21/683

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

公开(公告)号：US20180003569A1

公开(公告)日：2018-01-04

申请号：US15199907

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: G01K11/26 ,  H01L41/09 ,  H01L41/047

CPC classification number: G01K11/26 ,  H01L41/047 ,  H01L41/09 ,  H01L41/1132

Abstract: Embodiments of the invention include a temperature sensing device that includes a base structure that is positioned in proximity to a cavity of an organic substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure. The input transducer includes a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer. The output transducer includes a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.

公开(公告)号：US20240429173A1

公开(公告)日：2024-12-26

申请号：US18823186

申请日：2024-09-03

Applicant: Intel Corporation

Inventor： Henning BRAUNISCH ,  Chia-Pin CHIU ,  Aleksandar ALEKSOV ,  Hinmeng AU ,  Stefanie M. LOTZ ,  Johanna M. SWAN ,  Sujit SHARAN

IPC: H01L23/538 ,  H01L21/683 ,  H01L23/00 ,  H01L23/13 ,  H01L25/065

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

公开(公告)号：US20240355750A1

公开(公告)日：2024-10-24

申请号：US18758992

申请日：2024-06-28

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Amr ELSHAZLY ,  Arun CHANDRASEKHAR ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L23/5385 ,  H01L24/16 ,  H01L24/17 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/1703

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.