公开(公告)号：US20230002219A1

公开(公告)日：2023-01-05

申请号：US17932409

申请日：2022-09-15

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Hermann ,  Ulrich Krumbien ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/00

Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

公开(公告)号：US11524891B2

公开(公告)日：2022-12-13

申请号：US17151392

申请日：2021-01-18

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  H04R7/02 ,  H04R31/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R7/08

Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

公开(公告)号：US20220279270A1

公开(公告)日：2022-09-01

申请号：US17647653

申请日：2022-01-11

Applicant: Infineon Technologies AG

Inventor： Abidin Güçlü Onaran ,  Marc Fueldner ,  Dietmar Straeussnigg

IPC: H04R1/28 ,  B81B3/00 ,  H04R19/04 ,  H04R7/06 ,  H04R7/16

Abstract: A MicroElectroMechanical (MEMS) device includes a suspended electrode structure anchored to a substrate, the MEMS device having a MEMS resonance mode, and a Tuned Mass Damping (TMD) structure, wherein a portion of the suspended electrode structure forms a TMD structure having a TMD spring element and a TMD mass element, for providing a TMD resonance mode counteracting the MEMS resonance mode.

公开(公告)号：US11381923B2

公开(公告)日：2022-07-05

申请号：US16884816

申请日：2020-05-27

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Pedro Augusto Borrego Lambin Torres Amaral ,  Alessandro Caspani ,  Niccoló De Milleri ,  Marc Fueldner

IPC: H04R19/04 ,  H03F3/45

Abstract: A MEMS transducer includes a first and a second differential MEMS sensor device. The first differential MEMS sensor device includes a first and a second electrode structure for providing a first differential output signal, and a third electrode structure between the first and second electrode structure. The second differential MEMS sensor device includes a first and second electrode structure for providing a second differential output signal, and a third electrode structure between the first and second electrode structure. A biasing circuit provides the third electrode structure of the first differential MEMS sensor device with a first biasing voltage and provides the third electrode structure of the second differential MEMS sensor device with a second biasing voltage. A read-out circuitry combines the first and second differential output signal in an anti-parallel manner.

公开(公告)号：US11117798B2

公开(公告)日：2021-09-14

申请号：US16270219

申请日：2019-02-07

Applicant: Infineon Technologies AG

Inventor： Gunar Lorenz ,  Alfons Dehe ,  Marc Fueldner ,  Bernd Goller ,  Ulrich Krumbein ,  Andreas Wiesbauer

IPC: H01L29/84 ,  B81B7/00 ,  B81B3/00 ,  B81B7/02 ,  H04R19/04 ,  H04R1/02 ,  G01L9/00 ,  H04R19/00

Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

公开(公告)号：US20210029469A1

公开(公告)日：2021-01-28

申请号：US16884816

申请日：2020-05-27

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Pedro Augusto Borrego Lambin Torres Amaral ,  Alessandro Caspani ,  Niccoló De Milleri ,  Marc Fueldner

IPC: H04R19/04

Abstract: A MEMS transducer includes a first and a second differential MEMS sensor device. The first differential MEMS sensor device includes a first and a second electrode structure for providing a first differential output signal, and a third electrode structure between the first and second electrode structure. The second differential MEMS sensor device includes a first and second electrode structure for providing a second differential output signal, and a third electrode structure between the first and second electrode structure. A biasing circuit provides the third electrode structure of the first differential MEMS sensor device with a first biasing voltage and provides the third electrode structure of the second differential MEMS sensor device with a second biasing voltage. A read-out circuitry combines the first and second differential output signal in an anti-parallel manner.

公开(公告)号：US20190270637A1

公开(公告)日：2019-09-05

申请号：US16270315

申请日：2019-02-07

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Niccolo De Milleri ,  Bernd Goller ,  Ulrich Krumbein ,  Gerhard Lohninger ,  Giordano Tosolini ,  Andreas Wiesbauer

IPC: B81B7/00 ,  H04R1/02

Abstract: A MEMS assembly includes a housing having an internal volume V, wherein the housing has a sound opening to the internal volume V, a MEMS component in the housing adjacent to the sound opening, and a layer element arranged at least regionally at a surface region of the housing that faces the internal volume V, wherein the layer element includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.

公开(公告)号：US20190039884A1

公开(公告)日：2019-02-07

申请号：US16050795

申请日：2018-07-31

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Marc Fueldner ,  Andreas Wiesbauer

IPC: B81B7/02 ,  B81B3/00 ,  H04R19/04 ,  H04R19/00

Abstract: In accordance with an embodiment, a MEMS sensor includes a MEMS arrangement having a movable electrode and a stator electrode arranged opposite the movable electrode. The MEMS sensor includes a first bias voltage source, which is connected to the stator electrode and which is configured to apply a first bias voltage to the stator electrode. The MEMS sensor further includes a common-mode read-out circuit connected to the stator electrode by a capacitive coupling and comprising a second bias voltage source, which is configured to apply a second bias voltage to a side of the capacitive coupling that faces away from the stator electrode.

公开(公告)号：US10034100B2

公开(公告)日：2018-07-24

申请号：US15290877

申请日：2016-10-11

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

IPC: H04R25/00 ,  H04R19/04 ,  H04R19/00 ,  H04R31/00 ,  H04R7/00

Abstract: A sound transducer structure includes a membrane and a counter electrode. The membrane includes a first main surface in a sound transducing region made of a membrane material, and an edge region. The counter electrode includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. A plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume. The membrane and the counter electrode are arranged to provide a capacity therebetween. The membrane comprises a corrugation groove extending in the sound transducing region from the first main surface of the membrane into the free volume.

公开(公告)号：US09967677B2

公开(公告)日：2018-05-08

申请号：US14959560

申请日：2015-12-04

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Marc Fueldner ,  Elmar Bach

IPC: H04R3/00 ,  H04R19/04 ,  H04R1/04 ,  H04R3/04 ,  H04R29/00

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R3/04 ,  H04R29/004 ,  H04R2201/003 ,  H04R2430/01

Abstract: A system and method for a sensor-supported microphone includes an amplifier having an input configured to be coupled to a transducer, and an output coupled to an analog interface to output a transduced electrical signal from the transducer, a data bus configured to be coupled to an environmental sensor, a calibration parameter storage circuit coupled to the data bus, the calibration parameter storage circuit comprising calibration data relating sensitivity of the transducer with environmental measurements provided by the environmental sensor, and a digital interface coupled to the data bus and configured to output the calibration data and the environmental measurements.