公开(公告)号：US20210385584A1

公开(公告)日：2021-12-09

申请号：US17354412

申请日：2021-06-22

Applicant: Infineon Technologies AG

Inventor： Somu Goswami ,  Christian Bretthauer ,  Matthias Friedrich Herrmann ,  Gunar Lorenz ,  Pradyumna Mishra ,  Daniel Neumaier ,  David Tumpold

IPC: H04R17/02 ,  B81B3/00

Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

公开(公告)号：US20210053821A1

公开(公告)日：2021-02-25

申请号：US16543970

申请日：2019-08-19

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R31/00 ,  H04R7/08

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US20240158224A1

公开(公告)日：2024-05-16

申请号：US18540253

申请日：2023-12-14

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geißler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B7/02 ,  B81C1/00103 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0384 ,  B81C2201/013 ,  H04R2201/003

Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

公开(公告)号：US20240017986A1

公开(公告)日：2024-01-18

申请号：US18352444

申请日：2023-07-14

Applicant: Infineon Technologies AG

Inventor： Stefan Barzen ,  Alexander Frey ,  Matthias Friedrich Herrmann ,  Jun Cheng Ooi ,  Hans-Jörg Timme

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/007 ,  B81B3/001 ,  B81C1/00658 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C2201/0178 ,  B81C2201/0133

Abstract: A MEMS device comprises a first membrane structure having a reinforcement region formed from one piece of the first membrane structure, wherein the reinforcement region has a larger layer thickness than an adjoining region of the first membrane structure. The MEMS device includes an electrode structure, wherein the electrode structure is vertically spaced apart from the first membrane structure.

公开(公告)号：US20210139319A1

公开(公告)日：2021-05-13

申请号：US17151392

申请日：2021-01-18

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  H04R31/00 ,  B81B3/00 ,  H04R1/08 ,  B81B7/02 ,  H04R7/08 ,  H04R7/02

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US10175130B2

公开(公告)日：2019-01-08

申请号：US15074649

申请日：2016-03-18

Applicant: Infineon Technologies AG

Inventor： Athanasios Kollias ,  Matthias Friedrich Herrmann ,  Christian Ebner ,  Ernesto Romani ,  Stephan Mechnig ,  Joseph Hufschmitt ,  Andreas Wiesbauer ,  Christian Jenkner

IPC: G01L9/00 ,  G01L9/12

Abstract: An embodiment includes a method of performing a measurement using a micro-electro-mechanical system (MEMS) device that includes a plurality of MEMS sensors having different resonant frequencies. The method includes applying an excitation signal to a first port of the MEMS device such that each of the plurality of the MEMS sensors is stimulated by the excitation signal. The method further includes measuring a signal at a second port of the MEMS device and determining a measured value based on the measuring the signal.

公开(公告)号：US12297102B2

公开(公告)日：2025-05-13

申请号：US18540253

申请日：2023-12-14

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geißler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/00

Abstract: In an embodiment, a method for forming a microfabricated structure includes depositing a first membrane on a substrate, depositing a first isolation layer on the first membrane, depositing a stator layer on the first isolation layer, forming a perforated stator from the stator layer, wherein the first isolation layer is disposed on a first surface of the perforated stator, depositing a second isolation layer on a second surface of the perforated stator and depositing a second membrane on the second isolation layer, including depositing a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first glass layer having a low etch rate, and a second glass layer having a high etch rate embedded in the first glass layer.

公开(公告)号：US20230339743A1

公开(公告)日：2023-10-26

申请号：US18305905

申请日：2023-04-24

Applicant: Infineon Technologies AG

Inventor： Hans-Jörg Timme ,  Stefan Barzen ,  Marc Füldner ,  Stefan Geißler ,  Matthias Friedrich Herrmann ,  Maria Kiriak ,  Abidin Güçlü Onaran ,  Konstantin Tkachuk ,  Arnaud Walther

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/0361 ,  B81B2203/0353 ,  B81B2203/04

Abstract: A MEMS device includes a first deflectable membrane structure, a rigid electrode structure and a second deflectable membrane structure in a vertically spaced configuration. The rigid electrode structure is arranged between the first and second deflectable membrane structures. The first and second deflectable membrane structures each includes a deflectable portion, and the deflectable portions of the first and second deflectable membrane structures are mechanically coupled by mechanical connection elements to each other and are mechanically decoupled from the rigid electrode structure. At least a subset of the mechanical connection elements are elongated mechanical connection elements. The elongated mechanical connection elements have a lateral cross-sectional area with a laterally elongated dimension along a direction which is within a tolerance range of +/−20° perpendicular to the local membrane deflection gradient of the first and second deflectable membrane structures at the lateral position of the respective elongated mechanical connection element.

公开(公告)号：US10981780B2

公开(公告)日：2021-04-20

申请号：US16543970

申请日：2019-08-19

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R31/00 ,  H04R7/02 ,  H04R1/08 ,  H04R7/08

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US10370242B2

公开(公告)日：2019-08-06

申请号：US15662389

申请日：2017-07-28

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Matthias Friedrich Herrmann ,  Johannes Manz

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00

Abstract: A microelectromechanical device, a microelectromechanical system, and a method of manufacturing a microelectromechanical device, wherein the microelectromechanical device may include: a substrate; a diaphragm mounted to the substrate; a first electrode mounted to the diaphragm; a second electrode mounted to the substrate; wherein the first electrode is laterally adjacent to the second electrode; and wherein the diaphragm is arranged over a gap between the first electrode and the second electrode.