公开(公告)号：US20240158224A1

公开(公告)日：2024-05-16

申请号：US18540253

申请日：2023-12-14

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geißler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B7/02 ,  B81C1/00103 ,  H04R1/08 ,  H04R7/02 ,  H04R7/08 ,  H04R31/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0384 ,  B81C2201/013 ,  H04R2201/003

Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.

公开(公告)号：US20240114292A1

公开(公告)日：2024-04-04

申请号：US18532607

申请日：2023-12-07

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Andreas Wiesbauer ,  Athanasios Kollias

IPC: H04R7/08 ,  B81B3/00 ,  H04R7/16 ,  H04R19/04

CPC classification number: H04R7/08 ,  B81B3/0021 ,  H04R7/16 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0353 ,  B81B2203/04 ,  H04R2201/003

Abstract: A system includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, and the second membrane comprises a plurality of openings, a sealed low pressure chamber between the first membrane and the third membrane, and a plurality of electrodes in the sealed low pressure chamber

公开(公告)号：US20210139319A1

公开(公告)日：2021-05-13

申请号：US17151392

申请日：2021-01-18

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  H04R31/00 ,  B81B3/00 ,  H04R1/08 ,  B81B7/02 ,  H04R7/08 ,  H04R7/02

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US20180103325A1

公开(公告)日：2018-04-12

申请号：US15839546

申请日：2017-12-12

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00 ,  H04R7/00

CPC classification number: H04R19/04 ,  H04R7/00 ,  H04R19/005 ,  H04R31/00 ,  H04R31/003 ,  H04R31/006 ,  Y10T29/49005

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.

公开(公告)号：US20170164118A1

公开(公告)日：2017-06-08

申请号：US14959560

申请日：2015-12-04

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Marc Fueldner ,  Elmar Bach

IPC: H04R19/04 ,  H04R1/04 ,  H04R29/00 ,  H04R3/04

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R3/04 ,  H04R29/004 ,  H04R2201/003 ,  H04R2430/01

Abstract: A system and method for a sensor-supported microphone includes an amplifier having an input configured to be coupled to a transducer, and an output coupled to an analog interface to output a transduced electrical signal from the transducer, a data bus configured to be coupled to an environmental sensor, a calibration parameter storage circuit coupled to the data bus, the calibration parameter storage circuit comprising calibration data relating sensitivity of the transducer with environmental measurements provided by the environmental sensor, and a digital interface coupled to the data bus and configured to output the calibration data and the environmental measurements.

公开(公告)号：US20230184610A1

公开(公告)日：2023-06-15

申请号：US18062886

申请日：2022-12-07

Applicant: Infineon Technologies AG

Inventor： Athanasios Kollias ,  Marc Fueldner ,  Matthias Friedrich Herrmann ,  Gunar Lorenz ,  Andreas Wiesbauer

IPC: G01L9/00 ,  H04R19/04 ,  H04R7/06

CPC classification number: G01L9/0072 ,  H04R19/04 ,  H04R7/06 ,  H04R2201/003

Abstract: A sensor arrangement includes a substrate having a through opening between a first and a second main surface region, a sound transducing portion at the first main surface region of the substrate and spanning the through opening in the substrate, and a pressure sensing portion at the first main surface region of the substrate and fluidically coupled to the through opening in the substrate. The sound transducing portion includes a deflectable membrane structure, and a counter electrode. The pressure sensing portion includes a first and second rigid electrode and a deflectable membrane structure. The deflectable membrane structure of the pressure sensing portion opposes the plane of the first main surface region of the substrate. The first and second rigid electrodes of the pressure sensor form a reference capacitor of the pressure sensor, and the second rigid electrode and the membrane structure form a sense capacitor of the pressure sensor.

公开(公告)号：US20220201398A1

公开(公告)日：2022-06-23

申请号：US17128587

申请日：2020-12-21

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Andreas Wiesbauer ,  Athanasios Kollias

IPC: H04R7/08 ,  B81B3/00 ,  H04R7/16 ,  H04R19/04

Abstract: A system includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, and the second membrane comprises a plurality of openings, a sealed low pressure chamber between the first membrane and the third membrane, and a plurality of electrodes in the sealed low pressure chamber.

公开(公告)号：US20220194784A1

公开(公告)日：2022-06-23

申请号：US17128638

申请日：2020-12-21

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Andreas Wiesbauer ,  Athanasios Kollias

IPC: B81C1/00 ,  B81B7/00 ,  B81B3/00 ,  B81B7/02

Abstract: A triple-membrane MEMS device includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, a sealed low pressure chamber between the first membrane and the third membrane, a first stator and a second stator in the sealed low pressure chamber, and a signal processing circuit configured to read-out output signals of the triple-membrane MEMS device.

公开(公告)号：US20210323813A1

公开(公告)日：2021-10-21

申请号：US17357146

申请日：2021-06-24

Applicant: Infineon Technologies AG

Inventor： Gunar Lorenz ,  Alfons Dehe ,  Marc Fueldner ,  Bernd Goller ,  Ulrich Krumbein ,  Andreas Wiesbauer

IPC: B81B7/00 ,  B81B3/00 ,  B81B7/02 ,  H04R19/04 ,  H04R1/02 ,  G01L9/00

Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

公开(公告)号：US11115755B2

公开(公告)日：2021-09-07

申请号：US16779203

申请日：2020-01-31

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

IPC: H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  H04R7/00

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.