公开(公告)号：US20230290764A1

公开(公告)日：2023-09-14

申请号：US18318740

申请日：2023-05-17

Applicant: Innolux Corporation

Inventor： Yeong-E Chen

IPC: H01L25/16 ,  H01L25/04 ,  H01L31/02 ,  H01L25/075 ,  H01L33/62 ,  H01L23/538 ,  H01L31/18

CPC classification number: H01L25/167 ,  H01L25/042 ,  H01L31/02005 ,  H01L25/0753 ,  H01L33/62 ,  H01L23/5386 ,  H01L31/1892 ,  H01L2933/0066

Abstract: An electronic device is provided. The electronic device includes a circuit structure layer, a package structure, and an electronic element. The circuit structure layer includes a circuit layer and a plurality of first conductive pads. The package structure is disposed on the circuit structure layer. The electronic element is embedded in the package structure. The electronic element is electrically connected to the circuit layer through the plurality of first conductive pads. A thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element.

公开(公告)号：US11694999B2

公开(公告)日：2023-07-04

申请号：US17083318

申请日：2020-10-29

Applicant: Innolux Corporation

Inventor： Yeong-E Chen

IPC: H01L25/16 ,  H01L25/04 ,  H01L31/02 ,  H01L25/075 ,  H01L33/62 ,  H01L23/538 ,  H01L31/18

CPC classification number: H01L25/167 ,  H01L23/5386 ,  H01L25/042 ,  H01L25/0753 ,  H01L31/02005 ,  H01L31/1892 ,  H01L33/62 ,  H01L2933/0066

Abstract: An electronic device and a fabrication method thereof are provided. The electronic device includes a circuit structure layer, a package structure, an electronic element, and a plurality of function elements. The circuit structure layer has a first side and a second side opposite to the first side. The package structure is disposed on the first side of the circuit structure layer. The electronic element is embedded or encapsulated in the package structure. The function elements are disposed on the second side of the circuit structure layer. The function elements are electrically connected to the electronic element through the circuit structure layer. The electronic device provided by the disclosure exhibits borderless design or has a large function region.

公开(公告)号：US20230090376A1

公开(公告)日：2023-03-23

申请号：US17523895

申请日：2021-11-10

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Yi-Hung Lin ,  Cheng-En Cheng ,  Wen-Hsiang Liao ,  Cheng-Chi Wang

IPC: H01L23/498 ,  H01L21/48

Abstract: An electronic component and a manufacturing method thereof are provided. The electronic component includes a structure member and a connecting member. The structure member includes at least one working unit. The at least one working unit is disposed in a first region. The connecting member is disposed on the structure member and includes a second region. The second region is overlapped with the first region, and a metal density of the second region is less than a metal density of the first region. The electronic component and the manufacturing method thereof of the embodiment of the disclosure include the effect of improving the reliability or quality of the electronic component.

公开(公告)号：US12266646B2

公开(公告)日：2025-04-01

申请号：US18318740

申请日：2023-05-17

Applicant: Innolux Corporation

Inventor： Yeong-E Chen

IPC: H01L25/16 ,  H01L23/538 ,  H01L25/04 ,  H01L25/075 ,  H10F71/00 ,  H10F77/00 ,  H10H20/857 ,  H10H20/01

Abstract: An electronic device is provided. The electronic device includes a circuit structure layer, a package structure, and an electronic element. The circuit structure layer includes a circuit layer and a plurality of first conductive pads. The package structure is disposed on the circuit structure layer. The electronic element is embedded in the package structure. The electronic element is electrically connected to the circuit layer through the plurality of first conductive pads. A thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element.

公开(公告)号：US12148658B2

公开(公告)日：2024-11-19

申请号：US18074525

申请日：2022-12-05

Applicant: InnoLux Corporation

Inventor： Cheng-Chi Wang ,  Yeong-E Chen ,  Cheng-En Cheng

IPC: H01L21/768 ,  H01L21/027 ,  H01L21/288 ,  H01L21/48 ,  H01L21/66 ,  H01L21/683

Abstract: The present disclosure discloses a method for manufacturing an electronic device, including: setting a basic working area; a photoresist coating process; a development process; an etching process; an exposure process; a metal plating process; and a polishing process, wherein the photoresist coating process, the development process, the etching process, the exposure process, the metal plating process and the polishing process respectively have a maximum optimized process area, and a smallest one of the maximum optimized process areas is selected as the basic working area.

公开(公告)号：US12142554B2

公开(公告)日：2024-11-12

申请号：US17523895

申请日：2021-11-10

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Yi-Hung Lin ,  Cheng-En Cheng ,  Wen-Hsiang Liao ,  Cheng-Chi Wang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: An electronic component and a manufacturing method thereof are provided. The electronic component includes a structure member and a connecting member. The structure member includes at least one working unit. The at least one working unit is disposed in a first region. The connecting member is disposed on the structure member and includes a second region. The second region is overlapped with the first region, and a metal density of the second region is less than a metal density of the first region. The electronic component and the manufacturing method thereof of the embodiment of the disclosure include the effect of improving the reliability or quality of the electronic component.

公开(公告)号：US20240105697A1

公开(公告)日：2024-03-28

申请号：US18531733

申请日：2023-12-07

Applicant: Innolux Corporation

Inventor： Yeong-E Chen

IPC: H01L25/16 ,  H01L23/538 ,  H01L25/04 ,  H01L25/075 ,  H01L31/02 ,  H01L31/18 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L23/5386 ,  H01L25/042 ,  H01L25/0753 ,  H01L31/02005 ,  H01L31/1892 ,  H01L33/62 ,  H01L2933/0066

Abstract: An electronic device is provided. The electronic device includes a circuit structure layer, an insulation layer, a function element and a protection layer. The circuit structure layer has a first side and a second side opposite to the first side. The insulation layer is disposed on the first side and contacts the circuit structure layer. The function element is disposed on the second side of the circuit structure layer. The protection layer exposes a surface of at least one function element and the surface is away from the circuit layer.

公开(公告)号：US11812549B2

公开(公告)日：2023-11-07

申请号：US18094995

申请日：2023-01-10

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Cheng-En Cheng ,  Yu-Ting Liu

IPC: H05K1/02 ,  H05K3/46 ,  H01L21/56 ,  H01L23/31 ,  H05K3/02

CPC classification number: H05K1/0269 ,  H05K3/022 ,  H05K3/46

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

公开(公告)号：US11582865B2

公开(公告)日：2023-02-14

申请号：US17313006

申请日：2021-05-06

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Cheng-En Cheng ,  Yu-Ting Liu

IPC: H05K3/22 ,  H05K3/24 ,  H05K3/46 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/31 ,  H01L23/485 ,  H05K1/02 ,  H05K3/02

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.

公开(公告)号：US20220299565A1

公开(公告)日：2022-09-22

申请号：US17834869

申请日：2022-06-07

Applicant: Innolux Corporation

Inventor： Yeong-E Chen

IPC: G01R31/28 ,  H01L21/768 ,  H01L23/00

Abstract: A method for manufacturing an electronic device includes the following steps. A substrate including a first region and a second region is provided. A seed layer is formed on the substrate. A circuit structure layer is formed on the seed layer, and the circuit structure layer has a plurality of first circuit structures disposed on the first region and a plurality of second circuit structures disposed on the second region. The first circuit structures and the second circuit structures are electrically connected through the seed layer. A circuit test process is performed and includes applying a predetermined voltage to the second circuit structures to test the first circuit structures to determine whether the first circuit structures are normal or not.