公开(公告)号：US11637061B2

公开(公告)日：2023-04-25

申请号：US16993291

申请日：2020-08-14

Applicant: InnoLux Corporation

Inventor： Chiu-Yuan Huang ,  Pei-Chieh Chen ,  Yu-Ting Liu ,  Tsung-Yeh Ho

IPC: H01L23/498 ,  H05K1/18 ,  G02F1/1333 ,  H01R12/77 ,  H01L51/00 ,  H01R12/70

Abstract: The present disclosure provides an electronic device including a substrate, a conductive element, an extending element and an insulating layer. The substrate includes an edge, the conductive element is disposed on the substrate, the extending element is disposed corresponding to at least a portion of the conductive element and extends to the edge of the substrate, and the insulating layer separates the conductive element and the extending element.

公开(公告)号：US12205854B2

公开(公告)日：2025-01-21

申请号：US18369847

申请日：2023-09-19

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Kuang-Chiang Huang ,  Yu-Ting Liu ,  Yi-Hung Lin ,  Cheng-En Cheng

IPC: H01L21/66 ,  H01L21/48 ,  H01L23/00

Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.

公开(公告)号：US12009291B2

公开(公告)日：2024-06-11

申请号：US18122133

申请日：2023-03-16

Applicant: InnoLux Corporation

Inventor： Chiu-Yuan Huang ,  Pei-Chieh Chen ,  Yu-Ting Liu ,  Tsung-Yeh Ho

IPC: H01L23/498 ,  G02F1/1333 ,  H01R12/70 ,  H01R12/77 ,  H05K1/18 ,  H10K77/10

CPC classification number: H01L23/4985 ,  G02F1/133305 ,  H01R12/7076 ,  H01R12/77 ,  H05K1/189 ,  H10K77/111 ,  H05K2201/09009 ,  H05K2201/10128

Abstract: The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.

公开(公告)号：US20230230914A1

公开(公告)日：2023-07-20

申请号：US18122133

申请日：2023-03-16

Applicant: InnoLux Corporation

Inventor： Chiu-Yuan Huang ,  Pei-Chieh Chen ,  Yu-Ting Liu ,  Tsung-Yeh Ho

IPC: H01L23/498 ,  H05K1/18 ,  G02F1/1333 ,  H01R12/77 ,  H01R12/70 ,  H10K77/10

CPC classification number: H01L23/4985 ,  H05K1/189 ,  G02F1/133305 ,  H01R12/77 ,  H01R12/7076 ,  H10K77/111 ,  H05K2201/09009 ,  H05K2201/10128

Abstract: The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.

公开(公告)号：US11705392B2

公开(公告)日：2023-07-18

申请号：US17691135

申请日：2022-03-10

Applicant: InnoLux Corporation

Inventor： Mei-Chi Hsu ,  Yu-Chin Lin ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L2224/16227

Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.

公开(公告)号：US12148686B2

公开(公告)日：2024-11-19

申请号：US17572657

申请日：2022-01-11

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Cheng-En Cheng ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L21/48

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.

公开(公告)号：US12075566B2

公开(公告)日：2024-08-27

申请号：US17851246

申请日：2022-06-28

Applicant: InnoLux Corporation

Inventor： Yu-Ting Liu ,  Yeong-E Chen ,  Chean Kee

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/113 ,  H05K1/028 ,  H05K1/11 ,  H05K1/18 ,  H05K2201/0338 ,  H05K2201/10128

Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

公开(公告)号：US20240332160A1

公开(公告)日：2024-10-03

申请号：US18741804

申请日：2024-06-13

Applicant: InnoLux Corporation

Inventor： Mei-Chi Hsu ,  Yu-Chin Lin ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L2224/16227

Abstract: An electronic device includes a substrate, a conductive structure disposed on the substrate, a conductive pad disposed on the conductive structure and electrically connected to the conductive structure through an opening of an insulating layer disposed on the conductive structure. In a top view, the conductive structure has a first long edge and a second long edge, and the conductive pad has a third long edge and a fourth long edge adjacent to the first long edge and the second long edge respectively. In a direction perpendicular to the first long edge, a distance between the first long edge and the second long edge is less than a distance between the third long edge and the fourth long edge, and a distance between the first long edge and the third long edge is different from a distance between the second long edge and the fourth long edge.

公开(公告)号：US20240290711A1

公开(公告)日：2024-08-29

申请号：US18656622

申请日：2024-05-07

Applicant: InnoLux Corporation

Inventor： Chiu-Yuan Huang ,  Pei-Chieh Chen ,  Yu-Ting Liu ,  Tsung-Yeh Ho

IPC: H01L23/498 ,  G02F1/1333 ,  H01R12/70 ,  H01R12/77 ,  H05K1/18 ,  H10K77/10

CPC classification number: H01L23/4985 ,  G02F1/133305 ,  H01R12/7076 ,  H01R12/77 ,  H05K1/189 ,  H10K77/111 ,  H05K2201/09009 ,  H05K2201/10128

Abstract: The present disclosure provides an electronic device including a conductive element, a first insulating layer, an extending element, and a second insulating layer disposed on a substrate. At least a portion of the first insulating layer is located between the conductive element and the extending element. The second insulating layer is disposed on the conductive element and the extending element. In a cross-sectional view, a thickness of the first insulating layer is different from a thickness of the second insulating layer. In a top view, the extending element has a first portion extending to an edge of the substrate, the extending element has a second portion connecting the first portion and disposed between the first portion and the conductive element, and the first minimum width of the first portion is less than the second minimum width of the second portion.

公开(公告)号：US11812549B2

公开(公告)日：2023-11-07

申请号：US18094995

申请日：2023-01-10

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Cheng-En Cheng ,  Yu-Ting Liu

IPC: H05K1/02 ,  H05K3/46 ,  H01L21/56 ,  H01L23/31 ,  H05K3/02

CPC classification number: H05K1/0269 ,  H05K3/022 ,  H05K3/46

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.