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21.发明授权公开(公告)号：US11302622B2
公开(公告)日：2022-04-12
申请号：US16871052
申请日：2020-05-11
Applicant: InnoLux Corporation
Inventor： Mei-Chi Hsu , Yu-Chin Lin , Yu-Ting Liu
IPC: H01L23/498 , H01L23/00
Abstract: The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.
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