公开(公告)号：US11705392B2

公开(公告)日：2023-07-18

申请号：US17691135

申请日：2022-03-10

Applicant: InnoLux Corporation

Inventor： Mei-Chi Hsu ,  Yu-Chin Lin ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L2224/16227

Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.

公开(公告)号：US12046547B2

公开(公告)日：2024-07-23

申请号：US18204405

申请日：2023-06-01

Applicant: InnoLux Corporation

Inventor： Mei-Chi Hsu ,  Yu-Chin Lin ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L2224/16227

Abstract: The present disclosure provides an electronic device including a substrate, a first pad, an insulating layer, a second pad, a conductive element and a chip. The first pad is disposed on the substrate. The insulating layer is disposed on the first pad and has a plurality of first openings. The second pad is electrically connected to the first pad through the first openings. The conductive particle is disposed on the second pad. The chip is electrically connected to the second pad through the conductive element. In a top view of the electronic device, the first openings are arranged along a long edge of the first pad, and an outline of at least one first opening has a curved shape.

公开(公告)号：US20230307347A1

公开(公告)日：2023-09-28

申请号：US18204405

申请日：2023-06-01

Applicant: InnoLux Corporation

Inventor： Mei-Chi Hsu ,  Yu-Chin Lin ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L2224/16227

Abstract: The present disclosure provides an electronic device including a substrate, a first pad, an insulating layer, a second pad, a conductive element and a chip. The first pad is disposed on the substrate. The insulating layer is disposed on the first pad and has a plurality of first openings. The second pad is electrically connected to the first pad through the first openings. The conductive particle is disposed on the second pad. The chip is electrically connected to the second pad through the conductive element. In a top view of the electronic device, the first openings are arranged along a long edge of the first pad, and an outline of at least one first opening has a curved shape.

公开(公告)号：US11302622B2

公开(公告)日：2022-04-12

申请号：US16871052

申请日：2020-05-11

Applicant: InnoLux Corporation

Inventor： Mei-Chi Hsu ,  Yu-Chin Lin ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L23/00

Abstract: The present disclosure provides an electronic device including a substrate, a first pad, a second pad and an integrated circuit chip. The first pad is disposed on the substrate. The second pad is disposed on the first pad and electrically connected to the first pad. The integrated circuit chip is disposed on the second pad and is electrically connected to the second pad. The second pad has a plurality of curved corners.

公开(公告)号：US20240332160A1

公开(公告)日：2024-10-03

申请号：US18741804

申请日：2024-06-13

Applicant: InnoLux Corporation

Inventor： Mei-Chi Hsu ,  Yu-Chin Lin ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L2224/16227

Abstract: An electronic device includes a substrate, a conductive structure disposed on the substrate, a conductive pad disposed on the conductive structure and electrically connected to the conductive structure through an opening of an insulating layer disposed on the conductive structure. In a top view, the conductive structure has a first long edge and a second long edge, and the conductive pad has a third long edge and a fourth long edge adjacent to the first long edge and the second long edge respectively. In a direction perpendicular to the first long edge, a distance between the first long edge and the second long edge is less than a distance between the third long edge and the fourth long edge, and a distance between the first long edge and the third long edge is different from a distance between the second long edge and the fourth long edge.

公开(公告)号：US20220199514A1

公开(公告)日：2022-06-23

申请号：US17691135

申请日：2022-03-10

Applicant: InnoLux Corporation

Inventor： Mei-Chi Hsu ,  Yu-Chin Lin ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L23/00

Abstract: The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.