公开(公告)号：US20190214288A1

公开(公告)日：2019-07-11

申请号：US16211194

申请日：2018-12-05

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Chin-Lung Ting ,  Cheng-Chi Wang ,  Ming-Tsang Wu

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10

CPC classification number: H01L21/6835 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/95001 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/3511

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, disposing first chips on the sacrificial layer, forming a first dielectric layer surrounding the first chips, forming trenches in the first dielectric layer, and forming a second dielectric layer in the trenches, wherein an upper surface of the first dielectric layer and an upper surface of the second dielectric layer are at a same plane.

公开(公告)号：US20190191504A1

公开(公告)日：2019-06-20

申请号：US16151350

申请日：2018-10-04

Applicant: InnoLux Corporation

Inventor： Li-Wei Mao ,  Chin-Lung Ting ,  Ming-Chun Tseng

IPC: H05B33/08 ,  H01L33/52 ,  G09G3/32 ,  H01L27/12

Abstract: The present disclosure provides an electronic device including a light-emitting unit and at least one circuit unit. The light-emitting unit includes at least two diodes coupled in series. At least one of the diodes is a light-emitting diode for generating light. The circuit unit includes a thin-film transistor or switch component coupled to a first end of the light-emitting unit and a power source.

公开(公告)号：US20180205156A1

公开(公告)日：2018-07-19

申请号：US15865443

申请日：2018-01-09

Applicant: InnoLux Corporation

Inventor： I-Yin LI ,  Chin-Lung Ting ,  Chung-Kuang Wei

IPC: H01Q21/06 ,  H01Q21/24 ,  H01Q5/15 ,  G02F1/13 ,  H01Q1/38

CPC classification number: H01Q21/061 ,  G02F1/1313 ,  G02F1/133382 ,  G02F1/133385 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/44 ,  H01Q5/15 ,  H01Q9/0457 ,  H01Q21/0075 ,  H01Q21/065 ,  H01Q21/245

Abstract: A liquid-crystal antenna apparatus includes a liquid-crystal antenna unit. The liquid-crystal unit includes a first substrate, a second substrate, a first radiator, a second radiator, a main radiator, a liquid-crystal layer, and a temperature sensor. The first substrate includes a first surface and a second surface. The second substrate includes a third surface and a fourth surface, wherein the first surface and the third surface face each other. The first radiator is disposed on the first surface. The second radiator is disposed on the third surface. The main radiator is disposed on the fourth surface and used for emitting wireless signals. The liquid-crystal layer is located between the first radiator and the second radiator. The temperature sensor is disposed on at least one of the first surface, the second surface, the third surface, and the fourth surface.

公开(公告)号：US12253776B2

公开(公告)日：2025-03-18

申请号：US18615105

申请日：2024-03-25

Applicant: InnoLux Corporation

Inventor： Tai-Chi Pan ,  Chin-Lung Ting ,  I-Chang Liang ,  Chih-Chiang Chang Chien ,  Po-Wen Lin ,  Kuang-Ming Fan ,  Sheng-Nan Chen

IPC: G02F1/1362 ,  G02F1/13 ,  G02F1/1335 ,  G02F1/1337

Abstract: A method of forming an electronic device including: providing an assembly, wherein the assembly includes a substrate, an optical film, a plurality of color filters and a defect, wherein the plurality of color filters and the defect are disposed between the substrate and the optical film; and using a laser pulse to form a first processed area that corresponds to the defect in the optical film, wherein the first processed area at least partially overlaps at least two of the plurality of color filters.

公开(公告)号：US12224226B2

公开(公告)日：2025-02-11

申请号：US17898410

申请日：2022-08-29

Applicant: InnoLux Corporation

Inventor： Chin-Lung Ting ,  Chung-Kuang Wei ,  Cheng-Chi Wang ,  Yeong-E Chen ,  Yi-Hung Lin

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/44 ,  H01L23/498 ,  H01L25/065 ,  H01L25/075

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

公开(公告)号：US20240373558A1

公开(公告)日：2024-11-07

申请号：US18426346

申请日：2024-01-30

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Kazuyuki Hashimoto

IPC: H05K1/18 ,  H05K1/02

Abstract: An electronic device is provided. The electronic device includes a tunable circuit. The tunable circuit includes a first substrate, a tunable component, a first signal terminal, a second signal terminal, a first control terminal, and a second control terminal. The tunable component includes a first terminal and a second terminal. The first signal terminal is coupled to the first terminal of the tunable component. The second signal terminal is coupled to the second terminal of the tunable component. The first control terminal is coupled to the first terminal of the tunable component. The second control terminal is coupled to the second terminal of the tunable component. At least a portion of the tunable circuit is formed on the first substrate.

公开(公告)号：US20240312983A1

公开(公告)日：2024-09-19

申请号：US18671908

申请日：2024-05-22

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L27/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/538 ,  H01L29/93

CPC classification number: H01L27/0629 ,  H01L21/823475 ,  H01L23/5223 ,  H01L29/93 ,  H01L23/5385 ,  H01L27/0694

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, a PN junction assembly, and a transistor circuit. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer is formed above the second surface. The second metal layer is formed on the second surface. The PN junction assembly is disposed on the first surface and electrically connected with the first metal layer and the second metal layer. The PN junction assembly includes a variable capacitor. The transistor circuit is electrically connecting with the second metal layer.

公开(公告)号：US12020602B2

公开(公告)日：2024-06-25

申请号：US18372709

申请日：2023-09-26

Applicant: InnoLux Corporation

Inventor： Chin-Lung Ting ,  Chung-Kuang Wei ,  Li-Wei Mao ,  Chi-Liang Chang ,  Chia-Hui Lin

IPC: G09F9/302 ,  G09G3/32

CPC classification number: G09F9/3026 ,  G09G3/32 ,  G09G2300/026

Abstract: The present disclosure provides an electronic device including a substrate, a first circuit layer, and a plurality of diodes. The substrate has a plurality of first through holes. The first circuit layer is disposed on the substrate and has a plurality of light through holes. The diodes disposed on the first circuit layer. One of the light through holes is located between two adjacent ones of the diodes, and the light through holes overlap a portion of the plurality of first through holes and do not overlap another portion of the plurality of first through holes in a normal direction of the substrate.

公开(公告)号：US11991464B2

公开(公告)日：2024-05-21

申请号：US17482439

申请日：2021-09-23

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Ming Chun Tseng ,  Ho-Tien Chen ,  Kung-Chen Kuo

IPC: H04N25/709 ,  H01L27/146 ,  H04N25/71 ,  H04N25/75

CPC classification number: H04N25/709 ,  H01L27/14614 ,  H04N25/745 ,  H04N25/75

Abstract: A light detection element, including a first light detection unit, a second light detection unit, and a driving transistor, is provided. The first light detection unit includes a first transistor and a first light sensing unit. The first transistor and the first light sensing unit are electrically connected. The second light detection unit and the first light detection unit are electrically connected. The second light detection unit includes a second light sensing unit and a second transistor. The second light sensing unit and the second transistor are electrically connected. The driving transistor has a gate terminal. The gate terminal is electrically connected to the first light sensing unit and the second light sensing unit. In a time interval, the first transistor is not turned on and the second transistor is turned on.

公开(公告)号：US11974479B2

公开(公告)日：2024-04-30

申请号：US17119864

申请日：2020-12-11

Applicant: InnoLux Corporation

Inventor： Shun-Yuan Hu ,  Chin-Lung Ting ,  Li-Wei Mao ,  Ming-Chun Tseng ,  Kung-Chen Kuo ,  Yi-Hua Hsu ,  Ker-Yih Kao

IPC: H01L23/498 ,  G09F9/302 ,  G09G3/00 ,  H01L23/00 ,  H01L25/16 ,  H01L27/12 ,  H10K50/86 ,  H10K59/131 ,  H10K59/18 ,  H10K77/10 ,  H01L21/66

CPC classification number: H10K59/18 ,  G09F9/3026 ,  G09G3/006 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/162 ,  H01L25/167 ,  H01L27/124 ,  H10K50/865 ,  H10K59/131 ,  H10K77/111 ,  H01L22/14 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.