公开(公告)号：US10461412B2

公开(公告)日：2019-10-29

申请号：US15906126

申请日：2018-02-27

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Yi-Hung Lin ,  Chia-Chi Ho ,  Li-Wei Sung ,  Ming-Yen Weng ,  Hung-I Tseng ,  Kuo-Chun Lo ,  Charlene Su ,  Ker-Yih Kao

IPC: H01Q1/00 ,  H01Q1/40 ,  H01Q3/44 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q1/22 ,  H01Q1/24 ,  G02F1/13

Abstract: A microwave modulation device includes a first radiator, a second radiator and a modulation structure. The first radiator includes a substrate; a metal layer disposed on the substrate; a protective layer disposed on at least a portion of the metal layer and including a through hole overlapping with at least a portion of the metal layer; and an etch stop layer disposed between the metal layer and the protective layer. The second radiator disposed corresponding to the first radiator. The modulation structure is disposed between the first radiator and the second radiator.

公开(公告)号：US20250140205A1

公开(公告)日：2025-05-01

申请号：US18896818

申请日：2024-09-25

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Yi-Hung Lin ,  Kung-Chen Kuo ,  Po-Syun Chen

IPC: G09G3/3266 ,  G06F3/041 ,  G09G3/32 ,  G09G3/36

Abstract: An electronic device is provided. The electronic device includes at least one electronic circuit, a scan line, and a scan signal conversion circuit. The scan line transmits a first scan signal. The scan signal conversion circuit is electrically connected to the at least one electronic circuit and the scan line. The scan signal conversion circuit receives the first scan signal, converts the first scan signal into a second scan signal, and provides the second scan signal to the at least one electronic circuit.

公开(公告)号：US12230558B2

公开(公告)日：2025-02-18

申请号：US17960816

申请日：2022-10-05

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

公开(公告)号：US12142554B2

公开(公告)日：2024-11-12

申请号：US17523895

申请日：2021-11-10

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Yi-Hung Lin ,  Cheng-En Cheng ,  Wen-Hsiang Liao ,  Cheng-Chi Wang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: An electronic component and a manufacturing method thereof are provided. The electronic component includes a structure member and a connecting member. The structure member includes at least one working unit. The at least one working unit is disposed in a first region. The connecting member is disposed on the structure member and includes a second region. The second region is overlapped with the first region, and a metal density of the second region is less than a metal density of the first region. The electronic component and the manufacturing method thereof of the embodiment of the disclosure include the effect of improving the reliability or quality of the electronic component.

公开(公告)号：US12131917B2

公开(公告)日：2024-10-29

申请号：US17523919

申请日：2021-11-11

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Wen-Hsiang Liao ,  Cheng-Chi Wang ,  Yi-Chen Chou ,  Fuh-Tsang Wu ,  Ker-Yih Kao

IPC: H01L21/56 ,  H01L21/02 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L21/566 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/4857 ,  H01L23/3192 ,  H01L2224/82005

Abstract: A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.

公开(公告)号：US20240113695A1

公开(公告)日：2024-04-04

申请号：US18458987

申请日：2023-08-30

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Kung-Chen Kuo ,  Yu-Chia Huang ,  Nai-Fang Hsu

IPC: H03H11/02

CPC classification number: H03H11/02

Abstract: A modulation device including a plurality of electronic elements, at least one first signal line and a first driving circuit is provided. The at least one first signal line is respectively electrically connected to at least one of the electronic elements. The first driving circuit is electrically connected to the at least one first signal line. The first driving circuit provides a first signal to at least one of the at least one first signal line. The first signal includes a first pulse. The first pulse includes a first section and a second section closely adjacent to the first section.

公开(公告)号：US20230380071A1

公开(公告)日：2023-11-23

申请号：US18225692

申请日：2023-07-25

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Yi-Hung Lin

IPC: H05K3/00 ,  H01L21/48 ,  H05K3/06

CPC classification number: H05K3/007 ,  H01L21/4846 ,  H05K3/064

Abstract: An electronic device is disclosed. The electronic device includes a circuit structure. The circuit structure includes a metal member and an insulating layer. The insulating layer surrounds the metal member and includes at least one recess. The metal member corresponds to the recess, the recess exposes a surface of the metal member, and a width of the recess is greater than a width of the metal member in a cross-sectional view of the metal member and the insulating layer.

公开(公告)号：US11133580B2

公开(公告)日：2021-09-28

申请号：US15788888

申请日：2017-10-20

Applicant: InnoLux Corporation

Inventor： I-Yin Li ,  Yi-Hung Lin ,  Chin-Lung Ting ,  Tang-Chin Hung ,  Jeng-Nan Lin

IPC: H01Q1/00 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q13/10 ,  H01Q3/44 ,  H01Q21/00 ,  G02F1/1339

Abstract: An antenna device is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. At least one working element disposed between the first substrate and the second substrate, wherein the at least one working element is filled with a modulation material. At least one buffer element is connected with the at least one working element for adjusting the amount of the modulation material in the at least one working element.

公开(公告)号：US20180323126A1

公开(公告)日：2018-11-08

申请号：US15943736

申请日：2018-04-03

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Chien-Chang Lu ,  Cheng-I Wu ,  Li-Wei Sung ,  Cheng-Chi Wang ,  Chin-Lung Ting

IPC: H01L23/31 ,  H01L23/00 ,  H01L27/02

CPC classification number: H01L23/3107 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L27/0266 ,  H01L2224/0231 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/0239 ,  H01L2224/024

Abstract: The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.

公开(公告)号：US20180254257A1

公开(公告)日：2018-09-06

申请号：US15889216

申请日：2018-02-06

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/00 ,  H01L23/544 ,  H01L21/48 ,  H01L23/498

Abstract: A package structure includes a die, a first insulating layer and a first conductive layer. The die includes a first alignment pattern. The first insulating layer includes a first opening. The first conductive layer includes a first conductive pattern and a second alignment pattern. The first conductive pattern is located in the first opening and the second alignment pattern is located on the first insulating layer. The first alignment pattern and the second alignment pattern are disposed corresponding to each other.