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公开(公告)号：US20120048593A1
公开(公告)日：2012-03-01
申请号：US13136361
申请日：2011-07-29
Applicant: James V. Russell
Inventor： James V. Russell
CPC classification number: H01R13/2414 , H01R43/007 , Y10T29/49117
Abstract: A looped conductive wire or alternatively a conductive material such as a conductive foil is electrically connected with elastomeric material to provide electrical connections with one or more electronic devices.
Abstract translation: 环状导电线或可选地导电材料例如导电箔与弹性体材料电连接以提供与一个或多个电子器件的电连接。
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22.发明申请Method and structure for coaxial via routing in printed circuit boards for improved signal integrity 有权用于印刷电路板中同轴通孔布线的方法和结构，用于改善信号完整性公开(公告)号：US20110203842A1
公开(公告)日：2011-08-25
申请号：US12798217
申请日：2010-03-31
Applicant: James V. Russell
Inventor： James V. Russell
CPC classification number: H05K1/0222 , H05K1/0251 , H05K1/116 , H05K3/4069 , H05K3/42 , H05K2201/0187 , H05K2201/096 , H05K2201/09609 , H05K2201/09727 , H05K2201/09809 , Y10T29/49124 , Y10T29/49165
Abstract: A method and a structure for a coaxial via that extend along the entire length of a signal via in a printed circuit board. Signal integrity is improved by providing ground shield for the entire length of the coaxial via. The ground shielding can be implemented by either providing ground cage vias around a signal via and routing a trace to the signal via on a built up layer or by providing a semi circle ground trench through a build up layer to permit a trace access to the signal via.
Abstract translation: 一种用于沿着印刷电路板中的信号通道的整个长度延伸的同轴通孔的方法和结构。 通过为同轴通孔的整个长度提供接地屏蔽来改善信号完整性。 接地屏蔽可以通过在信号通孔周围提供接地保持架通孔，并将迹线路由到建立层上的信号通道或者通过建立层提供半圆接地沟槽来实现，以允许对信号进行跟踪访问 通过。
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公开(公告)号：US20110155792A1
公开(公告)日：2011-06-30
申请号：US12798216
申请日：2010-03-31
Applicant: James V. Russell
Inventor： James V. Russell
CPC classification number: B23K1/20 , B21C51/005 , B23K26/361 , B23K2101/40
Abstract: The present disclosure provides for scoring a line on metal to form a solder dam to define a solderable area on a metal surface. The solderable area can define solderable pads on a solid copper plane or at the end point of a trace on a circuit board. The present disclosure provides for soldering metallic surfaces together and for aligning solderable objects to one another. The surface tension of solder enables the parts to be aligned through the manipulations of the skived patterns and their placement. The skiving can be done either by laser skiving or by mechanical scoring on the metallic surfaces.
Abstract translation: 本公开提供了在金属上划线以形成焊料坝以在金属表面上限定可焊接区域。 可焊接区域可以在实心铜平面上或电路板上的迹线终点上定义可焊接焊盘。 本公开提供了将金属表面焊接在一起并且用于将可焊接物体彼此对准的方式。 焊料的表面张力使得零件能够通过刮削图案的操作和它们的放置进行对准。 可以通过激光切割或金属表面的机械刻痕来进行切割。
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公开(公告)号：US10886653B2
公开(公告)日：2021-01-05
申请号：US16220710
申请日：2018-12-14
Applicant: Charles William Martin , Christopher Matthew Beers , James V. Russell
Inventor： Charles William Martin , Christopher Matthew Beers , James V. Russell
IPC: H01R13/24 , H01R43/00 , H01R12/70 , H01R12/52 , H01R12/71 , H01R12/79 , H01R12/57 , H01R12/73 , H01R12/62
Abstract: An improved method and structure is provided for constructing elastomeric pin arrays using a non-conductive medium and compression limiters. Pin to pin of the same elastomeric material, pin to pin of similar elastomeric material, or pin to metal cap structure interconnects are constructed using an elastomeric connection through a non-conductive medium. Compression limiting structures are mated to the non-conductive medium. This structure eliminates the need for PCB structures as the medium reducing manufacturing cost.
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公开(公告)号：US09373452B2
公开(公告)日：2016-06-21
申请号：US14048246
申请日：2013-10-08
Applicant: Thomas P. Warwick , James V. Russell
Inventor： Thomas P. Warwick , James V. Russell
CPC classification number: H01H1/403 , H01H1/0036 , H01H1/365 , H01H45/02
Abstract: A shuttle board relay is provided that is scalable to a specific pitch or routing density. The shuttle board relay provides a path with different sets of electrical components that allows this via by allowing the integration of components and other types of customization. The shuttle board relay provides a minimally disruptive path to the signal. This minimizes loss and signal distortion, isolation and crosstalk are a function of pitch. Since pitch can be set, grounds included, etc., a design may be fully optimized for low cross talk.
Abstract translation: 提供穿梭板继电器，其可扩展到特定的音调或路由密度。 穿梭板继电器提供具有不同组电气部件的路径，通过允许组件和其他类型的定制的集成来允许该通路。 穿梭板继电器为信号提供了最小的破坏性路径。 这最大限度地减少损耗和信号失真，隔离和串扰是音调的函数。 由于可以设置音高，包括等等，所以可以针对低串扰来完全优化设计。
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Patent Agency Ranking
26.发明申请公开(公告)号：US20150319863A1
公开(公告)日：2015-11-05
申请号：US14700438
申请日：2015-04-30
Applicant: Dhananjaya Turpuseema , Thomas P. Warwick , Thomas Smith , James V. Russell
Inventor： Dhananjaya Turpuseema , Thomas P. Warwick , Thomas Smith , James V. Russell
CPC classification number: H05K1/188 , H05K1/144 , H05K1/183 , H05K1/186 , H05K3/0026 , H05K3/0094 , H05K3/321 , H05K3/366 , H05K3/4655 , H05K3/4679 , H05K2201/032 , H05K2201/0355 , H05K2201/042 , H05K2201/09509 , H05K2201/09536 , H05K2201/09545 , H05K2201/09572 , H05K2203/0485 , H05K2203/063 , H05K2203/11 , Y10T29/49128 , Y10T29/4914
Abstract: A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component. This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad.
Abstract translation: 印刷电路板内部的方法和电互连结构，用于在嵌入式组件端子，信号迹线和/或电源/接地平面之间建立可靠的，高性能的连接方法，其可能占据与嵌入式组件相同的垂直空间，例如 作为电容器或电阻器。 通过所述嵌入式组件结构的制造过程进一步减轻组装和可靠性。 在一种结构化的钻孔中，电镀通孔使用永久且高度导电的附着材料将印刷电路板中的迹线或平面连接到嵌入式部件的电气端子。 在另一种结构中，迹线或平面通过选择性侧壁电镀连接，该电镀围绕部件的电端子。 该结构还使用永久且高度导电的附着材料将组件端子电连接到电镀侧壁，并且在最终实施例中，端子通过导电附着材料通过z轴上的通孔连接到导电焊盘。
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公开(公告)号：US20150096873A1
公开(公告)日：2015-04-09
申请号：US14048246
申请日：2013-10-08
Applicant: Thomas P. Warwick , James V. Russell
Inventor： Thomas P. Warwick , James V. Russell
IPC: H01H45/02
CPC classification number: H01H1/403 , H01H1/0036 , H01H1/365 , H01H45/02
Abstract: A shuttle board relay is provided that is scalable to a specific pitch or routing density. The shuttle board relay provides a path with different sets of electrical components that allows this via by allowing the integration of components and other types of customization. The shuttle board relay provides a minimally disruptive path to the signal. This minimizes loss and signal distortion, isolation and crosstalk are a function of pitch. Since pitch can be set, grounds included, etc., a design may be fully optimized for low cross talk.
Abstract translation: 提供穿梭板继电器，其可扩展到特定的音调或路由密度。 穿梭板继电器提供具有不同组电气部件的路径，通过允许组件和其他类型的定制的集成来允许该通路。 穿梭板继电器为信号提供了最小的破坏性路径。 这最大限度地减少损耗和信号失真，隔离和串扰是音调的函数。 由于可以设置音高，包括等等，所以可以针对低串扰来完全优化设计。
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28.发明申请Apparatus and Method for a Conductive Elastomer on a Coaxial Cable or a Microcable to Improve Signal Integrity Probing 有权同轴电缆或微电缆导电弹性体的设备和方法，以改善信号完整性探测公开(公告)号：US20150027749A1
公开(公告)日：2015-01-29
申请号：US14512705
申请日：2014-10-13
Applicant: Thomas P. Warwick , James V. Russell
Inventor： Thomas P. Warwick , James V. Russell
CPC classification number: H01R11/18 , H01R9/05 , H01R13/2414 , H01R2201/20 , Y10T29/49123 , Y10T29/49895
Abstract: A method and structure for improving signal integrity probing. A coaxial or a microcoaxial cable is threaded through an optional alignment substrate where the cable is used to support or align the cable or an array of cables. A conductive elastomer is placed on a cable or a microcoaxial cable to improve signal integrity probing.
Abstract translation: 一种改善信号完整性探测的方法和结构。 同轴或微同轴电缆穿过可选的对准基板，其中电缆用于支撑或对准电缆或电缆阵列。 将导电弹性体放置在电缆或微同轴电缆上以改善信号完整性探测。
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29.发明申请Apparatus and method for a conductive elastomer on a coaxial cable or a microcable to improve signal integrity probing 审中-公开用于同轴电缆或微电缆上的导电弹性体的装置和方法，以改善信号完整性探测公开(公告)号：US20130240247A1
公开(公告)日：2013-09-19
申请号：US13385914
申请日：2012-03-14
Applicant: Thomas P. Warwick , James V. Russell
Inventor： Thomas P. Warwick , James V. Russell
CPC classification number: H01R9/05 , H01R11/18 , H01R13/2414 , H01R2201/20 , Y10T29/49895
Abstract: A method and structure for improving signal integrity probing. A coaxial or a microcoaxial cable is threaded through an optional alignment substrate where the cable is used to support or align the cable or an array of cables. A conductive elastomer is placed on a cable or a microcoaxial cable to improve signal integrity probing.
Abstract translation: 一种改善信号完整性探测的方法和结构。 同轴或微同轴电缆穿过可选的对准基板，其中电缆用于支撑或对准电缆或电缆阵列。 将导电弹性体放置在电缆或微同轴电缆上以改善信号完整性探测。
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30.发明授权Method and structure for coaxial via routing in printed circuit boards for improved signal integrity 有权用于印刷电路板中同轴通孔布线的方法和结构，用于改善信号完整性公开(公告)号：US08354601B2
公开(公告)日：2013-01-15
申请号：US12798217
申请日：2010-03-31
Applicant: James V. Russell
Inventor： James V. Russell
CPC classification number: H05K1/0222 , H05K1/0251 , H05K1/116 , H05K3/4069 , H05K3/42 , H05K2201/0187 , H05K2201/096 , H05K2201/09609 , H05K2201/09727 , H05K2201/09809 , Y10T29/49124 , Y10T29/49165
Abstract: A method and a structure for a coaxial via that extend along the entire length of a signal via in a printed circuit board. Signal integrity is improved by providing ground shield for the entire length of the coaxial via. The ground shielding can be implemented by either providing ground cage vias around a signal via and routing a trace to the signal via on a built up layer or by providing a semi circle ground trench through a build up layer to permit a trace access to the signal via.
Abstract translation: 一种用于沿着印刷电路板中的信号通道的整个长度延伸的同轴通孔的方法和结构。 通过为同轴通孔的整个长度提供接地屏蔽来改善信号完整性。 接地屏蔽可以通过在信号通孔周围提供接地保持架通孔，并将迹线路由到建立层上的信号通道或者通过建立层提供半圆接地沟槽来实现，以允许对信号进行跟踪访问 通过。
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