公开(公告)号：US10966315B2

公开(公告)日：2021-03-30

申请号：US16906124

申请日：2020-06-19

Applicant: Japan Display Inc.

Inventor： Kota Uogishi ,  Keisuke Asada ,  Hideaki Abe ,  Kazuyuki Yamada

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18

Abstract: According to one embodiment, an electronic device includes a panel including a mounting edge and pad portions, a flexible printed circuit board mounted on the panel. The flexible printed circuit board includes a base member including a first surface and a second surface, wiring lines placed on a side of the first surface and a protective layer covering the wiring lines, and including a bent portion, the base member includes a groove portion located in the bend portion and formed in the second surface, the groove portion includes concavity portions extending along a second direction and arranged along the first direction, and a thickness of the base member in a site where the groove portion is formed is less than a thickness of the base member in a site overlapping the driver IC chip.

公开(公告)号：US10775951B2

公开(公告)日：2020-09-15

申请号：US16546696

申请日：2019-08-21

Applicant: Japan Display Inc.

Inventor： Hayato Kurasawa ,  Keisuke Asada ,  Tatsuya Ide ,  Koji Ishizaki

IPC: G06F3/045 ,  G06F3/044 ,  G06F3/041 ,  H05K1/11 ,  G02F1/1333 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/36

Abstract: According to one embodiment, a detection device includes a substrate, detection electrode, terminal formed of a metal material, lead, coating layer, conductive adhesion layer, and circuit board. The lead connects the electrode and the terminal. The coating layer covers the electrode and the lead, and partly covers the terminal. The adhesion layer covers a part of the terminal exposed from the coating layer and covers a part of the coating layer. The circuit board is connected to the terminal with the adhesion layer interposed therebetween. At least in an overlapping area where the adhesion layer covers the coating layer, an area of the metal material per unit area is smaller than that of the other area of the terminal.

公开(公告)号：US10437404B2

公开(公告)日：2019-10-08

申请号：US15958388

申请日：2018-04-20

Applicant: Japan Display Inc.

Inventor： Hayato Kurasawa ,  Keisuke Asada ,  Tatsuya Ide ,  Koji Ishizaki

IPC: G06F3/045 ,  G06F3/044 ,  G02F1/1333 ,  G06F3/041 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/36

Abstract: According to one embodiment, a detection device includes a substrate, detection electrode, terminal formed of a metal material, lead, coating layer, conductive adhesion layer, and circuit board. The lead connects the electrode and the terminal. The coating layer covers the electrode and the lead, and partly covers the terminal. The adhesion layer covers a part of the terminal exposed from the coating layer and covers a part of the coating layer. The circuit board is connected to the terminal with the adhesion layer interposed therebetween. At least in an overlapping area where the adhesion layer covers the coating layer, an area of the metal material per unit area is smaller than that of the other area of the terminal.

公开(公告)号：US09977558B2

公开(公告)日：2018-05-22

申请号：US15483247

申请日：2017-04-10

Applicant: Japan Display Inc.

Inventor： Hayato Kurasawa ,  Keisuke Asada ,  Tatsuya Ide ,  Koji Ishizaki

IPC: G06F3/044 ,  G06F3/041 ,  H05K1/02 ,  H05K1/14

CPC classification number: G06F3/044 ,  G02F1/13338 ,  G06F3/0412 ,  G06F2203/04108 ,  G06F2203/04112 ,  H05K1/028 ,  H05K1/117 ,  H05K1/147 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/10128

Abstract: According to one embodiment, a detection device includes a substrate, detection electrode, terminal formed of a metal material, lead, coating layer, conductive adhesion layer, and circuit board. The lead connects the electrode and the terminal. The coating layer covers the electrode and the lead, and partly covers the terminal. The adhesion layer covers a part of the terminal exposed from the coating layer and covers a part of the coating layer. The circuit board is connected to the terminal with the adhesion layer interposed therebetween. At least in an overlapping area where the adhesion layer covers the coating layer, an area of the metal material per unit area is smaller than that of the other area of the terminal.