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公开(公告)号：US07034982B2
公开(公告)日：2006-04-25
申请号：US10823823
申请日：2004-04-13
Applicant: Jonathan Doan
Inventor： Jonathan Doan
CPC classification number: G02B26/0833
Abstract: A plastically deformable element of a microelectromechanical device is strained so as to improve the lifetime of the microelectromechanical device. The element of the device can be strained by deforming the element into a deformed state and holding the element at the deformed state for a particular time period so as to acquire an amount of plastic deformation. The operation states of the device are calibrated according to the states before straining and the acquired plastic deformation. After then, the device is operated in the calibrated states.
Abstract translation: 微机电装置的塑性变形元件变形，以便改善微机电装置的寿命。 通过将元件变形成变形状态并将元件保持在变形状态一段特定的时间段，以便获得一定量的塑性变形，可以使器件的元件变形。 根据变形前的状态和采集的塑性变形，对装置的运行状态进行校准。 然后，设备以校准状态运行。
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公开(公告)号：US07514012B2
公开(公告)日：2009-04-07
申请号：US10766776
申请日：2004-01-27
Applicant: Jonathan Doan , Satyadev R. Patel , Dmitri Simonian
Inventor： Jonathan Doan , Satyadev R. Patel , Dmitri Simonian
CPC classification number: B81C1/00682 , B81B2201/042 , G02B26/0841
Abstract: The present invention discloses a method for processing a deformable element of a microstructure for reducing the plastic deformation by oxidizing the deformable element. The method of the present invention can be performed at a variety of stages of the fabrication and packaging processes.
Abstract translation: 本发明公开了一种用于通过氧化可变形元件来处理微结构的可变形元件以减少塑性变形的方法。 本发明的方法可以在制造和包装过程的各个阶段进行。
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公开(公告)号：US07476949B2
公开(公告)日：2009-01-13
申请号：US11183046
申请日：2005-07-15
Applicant: Jonathan Doan
Inventor： Jonathan Doan
IPC: H01L29/82
CPC classification number: B81B3/0035 , G02B26/0841
Abstract: Disclosed herein is a microelectromechanical device having a structural layer composed of a low stress TiNx layer and a method of making the same.
Abstract translation: 本文公开了具有由低应力TiNx层构成的结构层的微机电装置及其制造方法。
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公开(公告)号：US20070015304A1
公开(公告)日：2007-01-18
申请号：US11183056
申请日：2005-07-15
Applicant: Jonathan Doan
Inventor： Jonathan Doan
IPC: H01L21/00
CPC classification number: B81C1/00365 , B81C2201/0181
Abstract: Disclosed herein is a microelectromechanical device having a structural layer composed of a low stress TiNx layer and a method of making the same.
Abstract translation: 本文公开了具有由低应力TiN层组成的结构层的微机电装置及其制造方法。
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公开(公告)号：US20050225832A1
公开(公告)日：2005-10-13
申请号：US10823823
申请日：2004-04-13
Applicant: Jonathan Doan
Inventor： Jonathan Doan
CPC classification number: G02B26/0833
Abstract: A plastically deformable element of a microelectromechanical device is strained so as to improve the lifetime of the microelectromechanical device. The element of the device can be strained by deforming the element into a deformed state and holding the element at the deformed state for a particular time period so as to acquire an amount of plastic deformation. The operation states of the device are calibrated according to the states before straining and the acquired plastic deformation. After then, the device is operated in the calibrated states.
Abstract translation: 微机电装置的塑性变形元件变形，以便改善微机电装置的寿命。 通过将元件变形成变形状态并将元件保持在变形状态一段特定的时间段，以便获得一定量的塑性变形，可以使器件的元件变形。 根据变形前的状态和采集的塑性变形，对装置的运行状态进行校准。 然后，设备以校准状态运行。
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Patent Agency Ranking
公开(公告)号：US20050161432A1
公开(公告)日：2005-07-28
申请号：US10766776
申请日：2004-01-27
Applicant: Jonathan Doan
Inventor： Jonathan Doan
CPC classification number: B81C1/00682 , B81B2201/042 , G02B26/0841
Abstract: The present invention discloses a method for processing a deformable element of a microstructure for reducing the plastic deformation by oxidizing the deformable element. The method of the present invention can be performed at a variety of stages of the fabrication and packaging processes.
Abstract translation: 本发明公开了一种用于通过氧化可变形元件来处理微结构的可变形元件以减少塑性变形的方法。 本发明的方法可以在制造和包装过程的各个阶段进行。
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公开(公告)号：US20070018261A1
公开(公告)日：2007-01-25
申请号：US11183046
申请日：2005-07-15
Applicant: Jonathan Doan
Inventor： Jonathan Doan
IPC: H01L29/82
CPC classification number: B81B3/0035 , G02B26/0841
Abstract: Disclosed herein is a microelectromechanical device having a structural layer composed of a low stress TiNx layer and a method of making the same.
Abstract translation: 本文公开了具有由低应力TiN层组成的结构层的微机电装置及其制造方法。
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公开(公告)号：US07170667B1
公开(公告)日：2007-01-30
申请号：US11303088
申请日：2005-12-14
Applicant: Jonathan Doan
Inventor： Jonathan Doan
IPC: G02B26/00
CPC classification number: G02B26/0833 , B81C1/00674
Abstract: A microelectromechanical device with a plastically deformable element of is exposed to illumination light so as to elongate the lifetime of the device on the customer side.
Abstract translation: 具有可塑性变形元件的微电子机械装置暴露于照明光，以延长设备在使用者端的寿命。
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公开(公告)号：US20070062647A1
公开(公告)日：2007-03-22
申请号：US11230263
申请日：2005-09-19
Applicant: Joel Bailey , Jonathan Doan , Paul Forderhase , Johnny Ortiz , Michael Robbins
Inventor： Joel Bailey , Jonathan Doan , Paul Forderhase , Johnny Ortiz , Michael Robbins
IPC: H01L21/306 , C23F1/00
CPC classification number: H01L21/67063 , G03F7/168 , H01L21/02087 , H01L21/6708
Abstract: An isolative substrate edge area processing method and apparatus is described. The apparatus has an isolator for isolating and processing by dry chemical technique a portion of a substrate including a substrate edge region. The isolator has nozzles for directing a flow of reactive species towards the edge area of the substrate and a purge plenum for biasing flow of reactive species towards an exhaust plenum while the substrate rotates on a chuck. Tuned flow control prevents migration of reactive species and reaction byproducts out of the processing area. A method for processing a substrate with the isolator involves directing a flow of reactive species at an angle towards an edge area of the substrate while forming a boundary around the processing area with flow control provided by the purge plenum, and exhaust plenum.
Abstract translation: 描述了隔离衬底边缘区域处理方法和装置。 该装置具有用于通过干化学技术隔离和处理包括衬底边缘区域的衬底的一部分的隔离器。 隔离器具有用于将反应物质流引导到基底的边缘区域的喷嘴和用于在衬底在卡盘上旋转的同时将反应物质的流动偏向排气室的吹扫气室。 调节流量控制可防止反应物质和反应副产物迁离加工区域。 用隔离器处理衬底的方法包括以一定角度朝向衬底的边缘区域引导反应物种的流动，同时通过由净化气室和排气室提供的流动控制在处理区域周围形成边界。
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公开(公告)号：US20060220045A1
公开(公告)日：2006-10-05
申请号：US11100104
申请日：2005-04-05
Applicant: Jonathan Doan , Terry Tarn
Inventor： Jonathan Doan , Terry Tarn
CPC classification number: G02B26/0833 , B81B7/0048 , B81B2201/047 , H01L2924/0002 , H01L2924/00
Abstract: A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive material comprising a compliant adhesive component is applied and positioned between the device substrate and package substrate.
Abstract translation: 微观结构与微结构的装置基板一起包装，所述装置基板附接到封装基板。 为了消散微结构的可能的变形，这可能导致器件故障或微结构的质量下降，包括柔性粘合剂组分的粘合剂材料被施加并定位在器件衬底和封装衬底之间。
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