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    Micromirror array device with compliant adhesive
    1.
    发明授权
    Micromirror array device with compliant adhesive 有权
    具有柔性粘合剂的微镜阵列器件

    公开(公告)号：US07408250B2

    公开(公告)日：2008-08-05

    申请号：US11100104

    申请日：2005-04-05

    Applicant: Jonathan Doan ,  Terry Tarn

    Inventor： Jonathan Doan ,  Terry Tarn

    IPC: H01L23/02

    CPC classification number: G02B26/0833 ,  B81B7/0048 ,  B81B2201/047 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive material comprising a compliant adhesive component is applied and positioned between the device substrate and package substrate.

    Abstract translation: 微观结构与微结构的装置基板一起包装，所述装置基板附接到封装基板。 为了消散微结构的可能的变形，这可能导致器件故障或微结构的质量下降，包括柔性粘合剂组分的粘合剂材料被施加并定位在器件衬底和封装衬底之间。

    Microelectromechanical structure and a method for making the same
    3.
    发明授权
    Microelectromechanical structure and a method for making the same 有权
    微机电结构及其制造方法

    公开(公告)号：US07153443B2

    公开(公告)日：2006-12-26

    申请号：US10805610

    申请日：2004-03-18

    Applicant: Jonathan Doan ,  Satyadev Patel

    Inventor： Jonathan Doan ,  Satyadev Patel

    IPC: H01L21/302

    CPC classification number: B81C1/00793 ,  B81B2201/042 ,  B81C2201/053

    Abstract: A microstructure and the method for making the same are disclosed herein. The microstructure has structural members, at least one of which comprises an intermetallic compound. In making such a microstructure, a sacrificial material is employed. After completion of forming the structural layers, the sacrificial material is removed by a spontaneous vapor phase chemical etchant.

    Abstract translation: 本文公开了微结构及其制造方法。 微结构具有结构构件，其中至少一个包括金属间化合物。 在制造这样的微结构时，采用牺牲材料。 在完成形成结构层之后，牺牲材料通过自发气相化学腐蚀剂除去。

    Method of improving the performance of microstructures
    4.
    发明授权
    Method of improving the performance of microstructures 有权
    提高微结构性能的方法

    公开(公告)号：US07034982B2

    公开(公告)日：2006-04-25

    申请号：US10823823

    申请日：2004-04-13

    Applicant: Jonathan Doan

    Inventor： Jonathan Doan

    IPC: G02B26/00 ,  G01J1/42

    CPC classification number: G02B26/0833

    Abstract: A plastically deformable element of a microelectromechanical device is strained so as to improve the lifetime of the microelectromechanical device. The element of the device can be strained by deforming the element into a deformed state and holding the element at the deformed state for a particular time period so as to acquire an amount of plastic deformation. The operation states of the device are calibrated according to the states before straining and the acquired plastic deformation. After then, the device is operated in the calibrated states.

    Abstract translation: 微机电装置的塑性变形元件变形，以便改善微机电装置的寿命。 通过将元件变形成变形状态并将元件保持在变形状态一段特定的时间段，以便获得一定量的塑性变形，可以使器件的元件变形。 根据变形前的状态和采集的塑性变形，对装置的运行状态进行校准。 然后，设备以校准状态运行。

    Low compressive TiNx materials and methods of making the same
    6.
    发明授权
    Low compressive TiNx materials and methods of making the same 有权
    低压TiNx材料及其制作方法

    公开(公告)号：US07476949B2

    公开(公告)日：2009-01-13

    申请号：US11183046

    申请日：2005-07-15

    Applicant: Jonathan Doan

    Inventor： Jonathan Doan

    IPC: H01L29/82

    CPC classification number: B81B3/0035 ,  G02B26/0841

    Abstract: Disclosed herein is a microelectromechanical device having a structural layer composed of a low stress TiNx layer and a method of making the same.

    Abstract translation: 本文公开了具有由低应力TiNx层构成的结构层的微机电装置及其制造方法。

    Low compressive TiNx, materials and methods of making the same
    7.
    发明申请
    Low compressive TiNx, materials and methods of making the same 审中-公开
    低压TiNx，材料和制作方法相同

    公开(公告)号：US20070015304A1

    公开(公告)日：2007-01-18

    申请号：US11183056

    申请日：2005-07-15

    Applicant: Jonathan Doan

    Inventor： Jonathan Doan

    IPC: H01L21/00

    CPC classification number: B81C1/00365 ,  B81C2201/0181

    Abstract: Disclosed herein is a microelectromechanical device having a structural layer composed of a low stress TiNx layer and a method of making the same.

    Abstract translation: 本文公开了具有由低应力TiN层组成的结构层的微机电装置及其制造方法。

    Method of improving the performance of microstructures
    9.
    发明申请
    Method of improving the performance of microstructures 有权
    提高微结构性能的方法

    公开(公告)号：US20050225832A1

    公开(公告)日：2005-10-13

    申请号：US10823823

    申请日：2004-04-13

    Applicant: Jonathan Doan

    Inventor： Jonathan Doan

    IPC: G01B1/00 ,  G02B26/00 ,  G02B26/08

    CPC classification number: G02B26/0833

    Abstract: A plastically deformable element of a microelectromechanical device is strained so as to improve the lifetime of the microelectromechanical device. The element of the device can be strained by deforming the element into a deformed state and holding the element at the deformed state for a particular time period so as to acquire an amount of plastic deformation. The operation states of the device are calibrated according to the states before straining and the acquired plastic deformation. After then, the device is operated in the calibrated states.

    Abstract translation: 微机电装置的塑性变形元件变形，以便改善微机电装置的寿命。 通过将元件变形成变形状态并将元件保持在变形状态一段特定的时间段，以便获得一定量的塑性变形，可以使器件的元件变形。 根据变形前的状态和采集的塑性变形，对装置的运行状态进行校准。 然后，设备以校准状态运行。

    Pre-oxidization of deformable elements of microstructures
    10.
    发明申请
    Pre-oxidization of deformable elements of microstructures 有权
    微观组织可变形元素的预氧化

    公开(公告)号：US20050161432A1

    公开(公告)日：2005-07-28

    申请号：US10766776

    申请日：2004-01-27

    Applicant: Jonathan Doan

    Inventor： Jonathan Doan

    IPC: B44C1/22 ,  B81B7/00 ,  B81C1/00 ,  G02B26/08

    CPC classification number: B81C1/00682 ,  B81B2201/042 ,  G02B26/0841

    Abstract: The present invention discloses a method for processing a deformable element of a microstructure for reducing the plastic deformation by oxidizing the deformable element. The method of the present invention can be performed at a variety of stages of the fabrication and packaging processes.

    Abstract translation: 本发明公开了一种用于通过氧化可变形元件来处理微结构的可变形元件以减少塑性变形的方法。 本发明的方法可以在制造和包装过程的各个阶段进行。

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