公开(公告)号：US20200305280A1

公开(公告)日：2020-09-24

申请号：US16555370

申请日：2019-08-29

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

Inventor： Kota TOKUDA ,  Nobuhiro YAMAMOTO

IPC: H05K1/11 ,  H05K13/04

Abstract: According to one embodiment, an electronic device includes a flexible printed wiring board includes an insulating layer, a plurality of connection pads provided on one side of the insulating layer and constituting a group, and a pad provided on another surface side of the insulating layer and having heat conductivity, wherein the pad overlaps one or more connection pads positioned at an outer edge of the group of connection pads via the insulating layer and comprises a portion extending on the outside of the connection pad on the outer edge, and a connection member includes a plurality of connection terminals connected to the connection pads via a solder.

公开(公告)号：US20200302960A1

公开(公告)日：2020-09-24

申请号：US16555463

申请日：2019-08-29

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

Inventor： Kota TOKUDA ,  Nobuhiro YAMAMOTO

IPC: G11B5/48 ,  G11B25/04 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14

Abstract: According to one embodiment, a disk device includes a plurality of disk-shaped recording media, a first actuator assembly supported by a support shaft, a second actuator assembly supported by the support shaft and spaced from the first actuator assembly, a flexible printed wiring board includes a base portion, a first relay portion extending from the base portion and connected to the first actuator assembly, and a second relay portion extending from the base portion and connected to the second actuator assembly, a support member fixed to the base portion of the flexible printed wiring board, and a reinforcing member provided in the base portion in the vicinity of the first relay portion and the second relay portion.

公开(公告)号：US20200259283A1

公开(公告)日：2020-08-13

申请号：US16859385

申请日：2020-04-27

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

Inventor： Nobuhiro YAMAMOTO ,  Kota TOKUDA

IPC: H01R12/79 ,  H01R12/78 ,  H01R13/24 ,  H05K5/02 ,  H05K1/02 ,  H05K5/06 ,  H05K1/18 ,  H05K1/14 ,  G11B33/02 ,  G11B25/04 ,  G11B33/12 ,  H05K3/36

Abstract: According to one embodiment, an electronic device includes a casing, a flexible wiring member, and a first electrical component, for example. The casing is provided with an opening. The flexible wiring member includes an insulating film, a lead mounted on the insulating film, and a connection terminal, and extends through the opening. The sealant is filled in the opening. The first electrical component is encapsulated by the casing and electrically connected to a second electrical component outside the casing through the flexible wiring member.

公开(公告)号：US20180337477A1

公开(公告)日：2018-11-22

申请号：US15915707

申请日：2018-03-08

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

Inventor： Nobuhiro YAMAMOTO ,  Kota TOKUDA

IPC: H01R12/79 ,  H01R12/78 ,  H01R13/24 ,  H05K5/02 ,  H05K1/02 ,  H05K5/06 ,  H05K1/18 ,  H05K1/14 ,  G11B33/02

CPC classification number: H01R12/79 ,  G11B25/043 ,  G11B33/022 ,  G11B33/122 ,  H01R12/78 ,  H01R13/2407 ,  H05K1/028 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/365 ,  H05K5/0247 ,  H05K5/065 ,  H05K5/069 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09409 ,  H05K2201/10189

Abstract: According to one embodiment, an electronic device includes a casing, a flexible wiring member, and a first electrical component, for example. The casing is provided with an opening. The flexible wiring member includes an insulating film, a lead mounted on the insulating film, and a connection terminal, and extends through the opening. The sealant is filled in the opening. The first electrical component is encapsulated by the casing and electrically connected to a second electrical component outside the casing through the flexible wiring member.

公开(公告)号：US20170069559A1

公开(公告)日：2017-03-09

申请号：US15018547

申请日：2016-02-08

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Nobuhiro YAMAMOTO ,  Yousuke HISAKUNI

IPC: H01L23/367 ,  H01L27/108 ,  H01L27/115 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/4006 ,  H01L23/49551 ,  H01L23/562 ,  H01L24/14 ,  H01L27/108 ,  H01L27/115 ,  H01L2924/15311 ,  H01L2924/351

Abstract: A semiconductor device includes a housing, a substrate housed in and fixed to the housing, and a semiconductor module package disposed on a surface of the substrate. A protrusion is formed on the housing, protrudes towards the substrate, located adjacent to the semiconductor module package, and directly or indirectly urges the substrate in a direction away from the protrusion.

Abstract translation: 半导体器件包括壳体，容纳在壳体中并固定到壳体的衬底以及设置在衬底的表面上的半导体模块封装。 在壳体上形成突起，朝向与半导体模块封装相邻的衬底突出，并且在远离突起的方向上直接或间接地推动衬底。

公开(公告)号：US20130278842A1

公开(公告)日：2013-10-24

申请号：US13735194

申请日：2013-01-07

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kota TOKUDA ,  Nobuhiro YAMAMOTO ,  Tsuyoshi KOZAI

IPC: H04N5/64 ,  H05K1/02

CPC classification number: H04N5/64 ,  G06F1/1633 ,  G06F1/20 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/02 ,  H05K1/0204 ,  H05K5/02 ,  H05K7/205 ,  H05K7/20963

Abstract: According to one embodiment, an electronic apparatus includes a board, a first electronic component on the board, a second electronic component on the board, and a fixing member between the first and second electronic components. The second electronic component is designed to produce less heat than the first electronic component. The fixing member is configured to secure the board to a part.

Abstract translation: 根据一个实施例，电子设备包括板，板上的第一电子部件，板上的第二电子部件以及第一和第二电子部件之间的固定部件。 第二电子部件设计成比第一电子部件产生更少的热量。 固定构件被构造成将板固定到部件上。