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    DISK DEVICE
    3.
    发明申请
    DISK DEVICE 有权

    公开(公告)号：US20220247064A1

    公开(公告)日：2022-08-04

    申请号：US17725616

    申请日：2022-04-21

    Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

    Inventor： Jia LIU ,  Taichi OKANO ,  Kota TOKUDA ,  Nobuhiro YAMAMOTO

    IPC: H01Q1/22 ,  G11B33/12 ,  G11B33/02 ,  G06F3/06

    Abstract: A disk device includes a housing having a sidewall, the side wall having a first through-hole; a magnetic disk rotatably disposed in the housing and surrounded by the sidewall in a radial direction; a flexible printed circuit electrically connected to the magnetic disk; an insulator closing the first through-hole; a wireless communication device having a first communication antenna inside the housing; and a control board electrically connected to the flexible printed circuit. The control board is supplied with power from outside of the housing via a first connector, and is configured to receive a write command or a read command via the first communication antenna.

    ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS
    5.
    发明申请
    ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS 审中-公开
    电子元件和电子设备

    公开(公告)号：US20130271937A1

    公开(公告)日：2013-10-17

    申请号：US13735246

    申请日：2013-01-07

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Nobuhiro YAMAMOTO ,  Takahisa FUNAYAMA

    IPC: H05K1/18

    CPC classification number: H05K1/181 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/83192 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10977 ,  H05K2201/2018 ,  Y02P70/613

    Abstract: According to one embodiment, an electronic apparatus includes a substrate, a first electronic component, and a reinforcing member. The substrate includes first electrodes. The first electronic component includes a base, second electrodes, and solders configured to connect the first electrodes to the second electrodes. The reinforcing member includes a supporting member between the substrate and the base and a reinforcing material fixed to the supporting member, the reinforcing member fixed to the substrate and the base, and the reinforcing material formed of a thermosetting resin configured to remove an oxide film and fastened to the solders and the substrate.

    Abstract translation: 根据一个实施例，电子设备包括基板，第一电子部件和加强部件。 衬底包括第一电极。 第一电子部件包括基底，第二电极和被配置为将第一电极连接到第二电极的焊料。 所述加强构件包括在所述基板和所述基座之间的支撑构件和固定到所述支撑构件的加固材料，固定到所述基板和所述基座的所述加强构件以及由热固性树脂形成的所述加强材料，所述热固性树脂被配置为去除氧化膜和 固定在焊料和基材上。

    DISK DEVICE
    7.
    发明公开
    DISK DEVICE 审中-公开

    公开(公告)号：US20240071422A1

    公开(公告)日：2024-02-29

    申请号：US18489456

    申请日：2023-10-18

    Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

    Inventor： Kota TOKUDA ,  Yoshihiro AMEMIYA ,  Shinra YAMANAKA ,  Nobuhiro YAMAMOTO ,  Taichi OKANO

    IPC: G11B33/12 ,  H05K1/05 ,  H05K1/11

    CPC classification number: G11B33/122 ,  H05K1/05 ,  H05K1/118 ,  G11B5/54

    Abstract: A disk device according to one embodiment includes a magnetic disk, a magnetic head, and a flexible printed circuit board. The flexible printed circuit board is electrically connected to the magnetic head. The flexible printed circuit board includes a first layer, a second layer having conductive property, and a third layer having insulation property. The first layer includes a first surface having insulation property. The second layer overlays the first surface, and includes a first conductor and a second conductor spaced from the first conductor. The third layer covers at least a part of the first surface and at least a part of the second layer. The flexible printed circuit board is provided with a first hole that is located between the first conductor and the second conductor with spacing from the second layer and penetrates the third layer.

    DISK DEVICE AND ELECTRONIC DEVICE
    8.
    发明申请
    DISK DEVICE AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20220301591A1

    公开(公告)日：2022-09-22

    申请号：US17469383

    申请日：2021-09-08

    Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

    Inventor： Taichi OKANO ,  Masahide TAKAZAWA ,  Jai LIU ,  Nobuhiro YAMAMOTO ,  Kota TOKUDA

    IPC: G11B23/30 ,  G11B25/04 ,  G11B5/48

    Abstract: According to one embodiment, a disk device includes a housing, recording medium, a magnetic head, an internal wireless communication device, and an internal component. The housing has an internal space. The internal wireless communication device generates at least either of: an electric signal representing information to be written to the recording medium, the electric signal corresponding to light, a magnetic field, or an electric field generated by an external wireless communication device; and light, a magnetic field, or an electric field toward the external wireless communication device, the light, the magnetic field, or the electric field corresponding to an electric signal representing information read from the recording medium. The internal component in the internal space is electrically connected to the magnetic head, the internal component that communicates with an external component located outside the housing through the internal wireless communication device and the external wireless communication device.

    ELECTRONIC APPARATUS
    9.
    发明申请
    ELECTRONIC APPARATUS 审中-公开

    公开(公告)号：US20190304511A1

    公开(公告)日：2019-10-03

    申请号：US16119944

    申请日：2018-08-31

    Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

    Inventor： Yousuke HISAKUNI ,  Nobuhiro YAMAMOTO ,  Kota TOKUDA

    IPC: G11B33/14 ,  H05K1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H05K5/06 ,  G11B33/08

    Abstract: According to one embodiment, an electronic apparatus includes, for example, a casing having an opening with a perimeter, and a circuit board including a first surface facing away from the casing and a second surface facing the casing, a first conductor which extends over the opening in the casing and at least a portion of which is located over the first surface, a second conductor at least portion of which extends over the second surface and is exposed to the interior of the casing at the opening in the casing, and a third conductor extending through the first surface and the second surface and electrically connected to the first conductor and the second conductor at a location outward of the perimeter of the opening.

    SEMICONDUCTOR DEVICE PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
    10.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
    半导体器件封装和包括其的电子器件

    公开(公告)号：US20160126172A1

    公开(公告)日：2016-05-05

    申请号：US14636177

    申请日：2015-03-02

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Nobuhiro YAMAMOTO ,  Keiko KAJI ,  Kiyokazu ISHIZAKI ,  Takahisa FUNAYAMA

    IPC: H01L23/498 ,  H01L25/10 ,  H01L25/065 ,  H01L23/48 ,  H01L23/31 ,  H01L25/18

    Abstract: A semiconductor device package includes a substrate having a first surface and a second surface that is opposite to the first surface, a plurality of solder joints disposed on the first surface of the substrate, a semiconductor chip disposed above the second surface of the substrate, and a support member disposed between the second surface of the substrate and the semiconductor chip. At least one of the solder joints is in contact with the first surface of the substrate opposite to a region on the second surface in which the support member is not disposed.

    Abstract translation: 半导体器件封装包括具有第一表面和与第一表面相对的第二表面的衬底，设置在衬底的第一表面上的多个焊点，设置在衬底的第二表面上方的半导体芯片，以及 设置在基板的第二表面和半导体芯片之间的支撑构件。 所述焊点中的至少一个与所述基板的与所述支撑部件未设置的第二表面上的区域相反的第一表面接触。

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