Abstract:
A printing method for printing a file stored on an external storage device attached to an image forming device includes steps of transmitting printing instruction information including first print instructing device information that specifies a print instructing device, from the print instructing device configured to issue a printing instruction to the image forming device, to the image forming device, determining whether the first print instructing device information included in the printing instruction information transmitted by the print instructing device is identical to second print instructing device information stored on the external storage device that specifies a print instructing device, and printing the file stored on the external storage device with the image forming device based upon the printing instruction information, when it is determined that the first print instructing device information is identical to the second print instructing device information.
Abstract:
Disclosed is a high-strength electric resistance welded steel pipe which is manufacture from a steel sheet containing, on mass basis, 0.2% to 0.4% C, 0.05% to 0.5% Si, 0.5% to 2.5% Mn, 0.025% or less P, 0.01% or less S, 0.01% to 0.15% or Al, 0.01% to 2% Cu, 0.05% to 2% Cr, 0.005% to 0.2% Ti, and 0.0002% to 0.005% B, with the remainder being iron and inevitable impurities. The steel pipe has a tensile strength of 1750 N/mm2 or more, a 0.1%-proof stress of 1320 N/mm2 or more, and a Charpy impact value at a testing temperature of minus 40° C. of 50 J/cm2 or more.
Abstract translation:本发明公开了一种高质量电阻焊钢管,其由含有0.2〜0.4%C,0.05〜0.5%Si,0.5〜2.5%Mn,0.025%以下P, ,0.01%以下的S,0.01〜0.15%的Al,0.01〜2%的Cu,0.05〜2%的Cr,0.005〜0.2%的Ti和0.0002〜0.005%的B,其余为铁和 不可避免的杂质。 钢管的拉伸强度为1750N / mm 2以上,0.1%保护应力为1320N / mm 2以上,夏比冲击值 在零下40摄氏度的测试温度为50J / cm 2以上。
Abstract:
To provide a control board for efficiently generating electric energy in a power generating device from heat generated from an electronic device. A control board includes a board including a first heat dissipating pad; an electronic device including a second heat dissipating pad to dissipate heat; a power generating device including a Peltier device which converts heat energy generated from the electronic device into electric energy, wherein the power generating device is sandwiched between the first heat dissipating pad and the second heat dissipating pad; and a power supply circuit configured to reuse the electric energy.
Abstract:
An information processing apparatus providing a specific function includes a non-volatile function program memory that stores a function program for providing the specific function, a main memory, and an arithmetic device that reads and stores the function program from the function program memory into the main memory at startup of the information processing apparatus and performs an arithmetic operation based on the function program to execute the function program. The arithmetic device operates at a start frequency set for startup as a clock frequency for accessing the function program memory when reading and storing the function program from the function program memory into the main memory at the startup, and operates at a frequency lower than the start frequency as the clock frequency for accessing the function program memory after reading and storing the function program into the main memory.
Abstract:
A bookbinding apparatus inserts ring parts of a comb-shaped ring into binding holes of a sheet bundle and files and binds the sheet bundle, sequentially and includes a binding hole forming section configured to form binding holes in the sheet, a compiling section configured to arrange the sheet in which the binding holes are formed to make the sheet bundle, a comb-shaped ring feeding section configured to feed the comb-shaped ring piece by piece, a binding section configured to receive the fed comb-shaped ring, insert the ring parts of the comb-shaped ring into the binding holes of the sheet bundle, and bind the sheet bundle, and a bound-book discharging section configured to transfer the sheet bundle bound by the binding section to a storage stacker.
Abstract:
A semiconductor device includes first and second conductor patterns embedded in a first interlayer insulation film and a third conductor pattern embedded in a second interlayer insulation film, the third conductor pattern including a main part and an extension part, the extension part being electrically connected to the first conductor pattern by a first via-plug, the extension part having a branched pattern closer to the main part compared with the first conductor pattern, the branched pattern making a contact with the second conductor pattern via a second via-plug, each of the main part, extension part including the branched pattern, first via-plug and second via-plug forming a damascene structure.
Abstract:
A transceiving device includes a transmission signal generating module for generating a transmission signal that is frequency-modulated by a predetermined frequency sweep width, a transceiver module for transmitting a pulse signal having substantially the same waveform as a waveform of the transmission signal and receiving an echo signal corresponding to the transmission signal from a detection range, and a pulse-compression filter for pulse-compressing the echo signal received by the transceiver module. The pulse-compression filter has an input/output characteristic. The characteristic has, when the pulse-compression filter is inputted with an input signal having substantially the same waveform as the waveform of the transmission signal, a window function shape such that a phase spectrum of an output signal corresponding to the input signal is linear and an amplitude spectrum of the output signal does not have a frequency component other than a frequency band with which a frequency sweep is carried out.
Abstract:
A main wall part is provided so as to surround an integrated circuit part. A sub-wall part which is in “L” shape is provided between each corner of the main wall part and the integrated circuit part. Therefore, even if the stress is concentrated due to heat treatment or the like, the stress is dispersed to the main wall part and the sub-wall part, and hence peeling between layers and a crack are unlikely to occur, as compared with the conventional art. Further, even if the crack and the like occur at the corner, moisture from the outside hardly reaches the integrated circuit part when the main wall part and the sub-wall part are coupled to each other. For this reason, it is possible to ensure an extremely high moisture resistance.