公开(公告)号：US5793377A

公开(公告)日：1998-08-11

申请号：US562176

申请日：1995-11-22

Applicant: Kevin D. Moore

Inventor： Kevin D. Moore

IPC: G06F3/033 ,  G06F3/048 ,  G06T17/00

CPC classification number: G06F3/04845

Abstract: A drawing tool and method having a snap function for constraining items drawn and/or modified to precise angles and precise intervals of polar coordinates is described. Using the drawing tool and method, objects may be drawn or modified at precise angles and intervals in accordance with user settable parameters.

Abstract translation: 描述了具有用于约束被绘制和/或修改为极坐标的精确角度和精确间隔的项目的捕捉功能的绘图工具和方法。 使用绘图工具和方法，可以根据用户可设置的参数以精确的角度和间隔绘制或修改对象。

公开(公告)号：US5160409A

公开(公告)日：1992-11-03

申请号：US740271

申请日：1991-08-05

Applicant: Kevin D. Moore ,  John W. Stafford ,  William M. Beckenbaugh ,  Ken Cholewczynski

Inventor： Kevin D. Moore ,  John W. Stafford ,  William M. Beckenbaugh ,  Ken Cholewczynski

IPC: H01L21/48 ,  H05K1/11 ,  H05K3/06 ,  H05K3/34

CPC classification number: H05K3/3457 ,  H01L21/4853 ,  H05K1/111 ,  H05K3/3473 ,  H05K1/11 ,  H05K2201/09381 ,  H05K2203/042 ,  H05K2203/043 ,  H05K2203/0723 ,  H05K3/062 ,  Y02P70/611 ,  Y10T29/49121

Abstract: A method for forming a solder-bumped circuit trace on a planar dielectric substrate includes fabricating a trace having an intersection between linear section, depositing onto the trace a uniform thin plate of solder alloy and reflowing the solder alloy to form a bump at the intersection. More particularly, the trace comprises first and second linear sections that intersect at an angle between 45 degrees and 135 degrees and have widths preferably between 50 and 150 microns. The solder plate is deposited, preferably by electroplating, at a thickness between about 10 and 25 microns. Thereafter, when the trace is heated to melt the solder layer, the solder coalesces at the intersection to form the bump.

Abstract translation: 在平面介质基板上形成焊料凸起的电路迹线的方法包括制造在线性部分之间具有交点的迹线，在迹线上沉积均匀的焊料合金薄板并回流焊料合金以在交叉点处形成凸块。 更具体地，迹线包括以45度和135度之间的角度相交并且具有优选地在50和150微米之间的宽度的第一和第二线性部分。 焊料板优选通过电镀沉积在约10至25微米之间的厚度。 此后，当加热痕迹以熔化焊料层时，焊料在相交处聚结形成凸块。

公开(公告)号：US5120678A

公开(公告)日：1992-06-09

申请号：US609483

申请日：1990-11-05

Applicant: Kevin D. Moore ,  Steven C. Machuga ,  John W. Stafford ,  Kenneth Cholewczynski ,  Dennis B. Miller

Inventor： Kevin D. Moore ,  Steven C. Machuga ,  John W. Stafford ,  Kenneth Cholewczynski ,  Dennis B. Miller

IPC: H01L21/58 ,  H01L23/498 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L24/83 ,  H01L23/49816 ,  H01L24/29 ,  H05K3/284 ,  H05K3/3436 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K2201/09072 ,  H05K2201/09909 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: An improved method is provided for assembling an integrated circuit component to a substrate by a solder bump interconnection that is reinforced by a polymer film. The component is attached to a region of the substrate by a plurality of solder bump interconnections that create a gap between the component interface and the substrate region. A polymer dam is applied to the region encircling the attached component spaced apart therefrom. A liquid polymer precursor material is applied to the region including the gap and is confined by the dam to prevent indiscriminate flow across the substrate. In one aspect of this invention, gas is vented from the gap through a passage in the substrate to enhance fill by the precursor liquid. In another aspect of this invention, the precursor liquid is injected into the gap through a passage in the substrate and spread outwardly therefrom. In any event, the precursor liquid infiltrates the gap about the solder interconnections and is cured to form a film that reinforces and protectively encapsulates the solder interconnections.

Abstract translation: 提供了一种改进的方法，用于通过由聚合物膜增强的焊料凸块互连将集成电路部件组装到衬底。 该部件通过在部件界面和基板区域之间产生间隙的多个焊料凸块互连而附着于基板的区域。 将聚合物坝施加到环绕与之间隔开的附接部件的区域。 将液体聚合物前体材料施加到包括间隙的区域，并被坝限制，以防止不加选择地流过基底。 在本发明的一个方面，气体通过衬底中的通道从间隙排出，以增强前体液体的填充。 在本发明的另一方面，前体液体通过基底中的通道注入到间隙中并从其向外扩散。 在任何情况下，前体液体渗透围绕焊料互连的间隙，并且被固化以形成加强和保护性地封装焊料互连的膜。