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    ADHESIVE COMPOSITION
    22.
    发明申请
    ADHESIVE COMPOSITION 审中-公开

    公开(公告)号：US20190225740A1

    公开(公告)日：2019-07-25

    申请号：US16338353

    申请日：2017-09-29

    Applicant: LG CHEM, LTD.

    Inventor： So Young KIM ,  Seung Min LEE ,  Se Woo YANG

    IPC: C08G59/22 ,  C09J163/00 ,  C09D163/00 ,  C09J5/06 ,  H01L51/52 ,  H01L51/56

    Abstract: Disclosed is related to an adhesive composition for encapsulating an organic electronic element and an organic electronic device comprising the same. The adhesive composition includes a curable compound having no carbon-carbon unsaturated group, a thermal initiator, and a photo-initiator. The adhesive composition can form a structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, can realize a top emitting organic electronic device, and can prevent defects such as dark spots which may occur in the organic electronic device.

    ENCAPSULATION COMPOSITION (AS AMENDED)
    26.
    发明申请
    ENCAPSULATION COMPOSITION (AS AMENDED) 审中-公开
    包封组合物（如修订）

    公开(公告)号：US20150357570A1

    公开(公告)日：2015-12-10

    申请号：US14762399

    申请日：2014-07-21

    Applicant: LG CHEM, LTD.

    Inventor： Seung Min LEE ,  Suk Ky CHANG ,  Min Soo PARK ,  Hyun Jee YOO ,  Jung Sup SHIM ,  Yoon Gyung CHO ,  Kyung YuI BAE ,  Hyun Suk KIM ,  Jung Ok MOON

    IPC: H01L51/00 ,  H01L51/56 ,  C08L23/22 ,  H01L51/52

    CPC classification number: H01L51/004 ,  C08F220/18 ,  C08L23/22 ,  C08L33/08 ,  C08L101/00 ,  C08L101/005 ,  C08L2203/16 ,  C08L2203/206 ,  C08L2205/04 ,  C08L2312/00 ,  C09J123/22 ,  C09J133/06 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/56

    Abstract: An encapsulation composition, an encapsulation film including the same, an encapsulation product for organic electronic devices, and a method of manufacturing an organic electronic device are provided. The encapsulation composition can be useful in effectively preventing moisture or oxygen from flowing into the organic electronic device from external environments while realizing transparency when the organic electronic device is encapsulated by the encapsulation composition. Also, the encapsulation film formed of the encapsulation composition can be useful in ensuring mechanical properties such as handling properties and processability, and the organic electronic device whose encapsulation structure is formed by means of the encapsulation film may have improved lifespan and durability, thereby providing an encapsulation product for organic electronic devices showing high reliability.

    Abstract translation: 提供了一种封装组合物，包括该封装组合物的封装膜，用于有机电子器件的封装产品，以及一种制造有机电子器件的方法。 封装组合物可有效地防止水分或氧气从外部环境流入有机电子器件，同时当通过封装组合物封装有机电子器件时实现透明度。 此外，由封装组合物形成的封装膜可用于确保诸如处理性能和可加工性的机械性能，并且通过封装膜形成封装结构的有机电子器件可具有改善的寿命和耐久性，从而提供 有机电子器件的封装产品显示出高可靠性。

    COMPOSITION FOR ENCAPSULATION
    29.
    发明申请
    COMPOSITION FOR ENCAPSULATION 有权

    公开(公告)号：US20220195203A1

    公开(公告)日：2022-06-23

    申请号：US17611397

    申请日：2020-06-05

    Applicant: LG CHEM, LTD.

    Inventor： So Young KIM ,  Seung Min LEE ,  Eun Gu HAN ,  Se Woo YANG

    IPC: C09D4/00 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56

    Abstract: The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

    ENCAPSULATION FILM
    30.
    发明申请
    ENCAPSULATION FILM 有权

    公开(公告)号：US20210343977A1

    公开(公告)日：2021-11-04

    申请号：US17270823

    申请日：2019-09-03

    Applicant: LG CHEM, LTD.

    Inventor： Sung Nam MOON ,  Seung Min LEE ,  Eun Jeong KIM ,  Yeong Bong MOK ,  Se Woo YANG ,  Jun Won CHOI

    IPC: H01L51/52 ,  H01L51/56

    Abstract: The present disclosure relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, and provides an encapsulation film which can form a structure capable of blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby effectively releasing the heat accumulated in the organic electronic device and preventing the occurrence of deterioration of the organic electronic device.

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