公开(公告)号：US20160149131A1

公开(公告)日：2016-05-26

申请号：US14899978

申请日：2014-06-18

Applicant: LG CHEM, LTD.

Inventor： Jung Sup SHIM ,  Yoon Gyung CHO ,  Suk Ky CHANG ,  Hyun Jee YOO ,  Seung Min LEE ,  Kyung YuI BAE

IPC: H01L51/00 ,  H01L51/52 ,  C08J5/18 ,  C08L23/22

CPC classification number: H01L51/004 ,  C08J5/18 ,  C08J2323/22 ,  C08J2423/30 ,  C08L23/22 ,  C08L101/02 ,  C08L2203/206 ,  C08L2205/02 ,  C08L2205/08 ,  H01L23/293 ,  H01L51/0043 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There are provided a composition for encapsulation film, an encapsulation film, and an electronic device having the same. The present application may provide an encapsulation film having an excellent moisture barrier property, operability, workability, and durability and a structure including an element encapsulated by the encapsulation film.

Abstract translation: 提供了一种用于封装膜，封装膜和具有该组合物的电子器件的组合物。 本申请可以提供具有优异的防潮性，可操作性，可加工性和耐久性的包封膜和包括由封装膜包封的元件的结构。

公开(公告)号：US20150357570A1

公开(公告)日：2015-12-10

申请号：US14762399

申请日：2014-07-21

Applicant: LG CHEM, LTD.

Inventor： Seung Min LEE ,  Suk Ky CHANG ,  Min Soo PARK ,  Hyun Jee YOO ,  Jung Sup SHIM ,  Yoon Gyung CHO ,  Kyung YuI BAE ,  Hyun Suk KIM ,  Jung Ok MOON

IPC: H01L51/00 ,  H01L51/56 ,  C08L23/22 ,  H01L51/52

CPC classification number: H01L51/004 ,  C08F220/18 ,  C08L23/22 ,  C08L33/08 ,  C08L101/00 ,  C08L101/005 ,  C08L2203/16 ,  C08L2203/206 ,  C08L2205/04 ,  C08L2312/00 ,  C09J123/22 ,  C09J133/06 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/56

Abstract: An encapsulation composition, an encapsulation film including the same, an encapsulation product for organic electronic devices, and a method of manufacturing an organic electronic device are provided. The encapsulation composition can be useful in effectively preventing moisture or oxygen from flowing into the organic electronic device from external environments while realizing transparency when the organic electronic device is encapsulated by the encapsulation composition. Also, the encapsulation film formed of the encapsulation composition can be useful in ensuring mechanical properties such as handling properties and processability, and the organic electronic device whose encapsulation structure is formed by means of the encapsulation film may have improved lifespan and durability, thereby providing an encapsulation product for organic electronic devices showing high reliability.

Abstract translation: 提供了一种封装组合物，包括该封装组合物的封装膜，用于有机电子器件的封装产品，以及一种制造有机电子器件的方法。 封装组合物可有效地防止水分或氧气从外部环境流入有机电子器件，同时当通过封装组合物封装有机电子器件时实现透明度。 此外，由封装组合物形成的封装膜可用于确保诸如处理性能和可加工性的机械性能，并且通过封装膜形成封装结构的有机电子器件可具有改善的寿命和耐久性，从而提供 有机电子器件的封装产品显示出高可靠性。